JPS63177582A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a hybrid integrated circuit device in which leads of circuit components such as ICs can be accurately soldered connected.

[Prior art] When attaching a flat butt type semiconductor chip to a substrate of a hybrid S integrated circuit device, a cream solder layer is provided on a thick film electrode conductor layer corresponding to a large number of leads of the semiconductor chip, and the leads are temporarily attached here. It has already been done to adhere the leads and then melt and solidify the cream solder layer to fix the leads. It is also known to provide an overcoat glass in areas other than the soldering area in order to prevent short circuits between leads, that is, between electrode conductor layers due to solder.

[Problems to be solved by the invention] By the way, the overcoat glass can be heated at a relatively low temperature (50
Since it is made of amorphous glass that is fired at a temperature of 0°C to 550°C, when the overcoat glass paste is fired, the overcoat glass sag occurs at the boundary between the parts covered with overcoat glass and the parts not covered with overcoat glass, causing overcoat glass to sag. It was difficult to place the glass precisely in the desired area. If sag occurs on the edge of the overcoat glass, the overcoat glass will also adhere to the soldering area, making it impossible to secure the desired soldering area, and leaving the cream solder on the desired electrode conductor layer. This results in solder bridging between electrode conductor layers and incomplete lead connections. This kind of problem occurs when the lead spacing is 0.4m+
This problem occurs noticeably when attaching an extremely narrow flat-pack type semiconductor chip as shown in a.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for manufacturing a hybrid integrated circuit that allows the leads of circuit components to be connected reliably and easily.

[Means for Solving the Problems] In order to solve the above problems and achieve the above objects, the present invention provides a plurality of electrode conductors for soldering connection of circuit components having a plurality of mutually adjacent leads. forming a layer on an insulating substrate, forming an insulating layer mainly composed of crystalline glass between the plurality of electrode conductor layers, and applying the circuit to the plurality of electrode conductor layers by soldering. The present invention relates to a method of manufacturing a hybrid integrated circuit, which includes a step of connecting leads of components.

[Function] According to the present invention, since the insulating layer mainly composed of crystalline glass is provided between the electrode conductor layers, sagging at the edges of the insulating layer is reduced, and desired soldering can be performed over the area. can be secured. Therefore, problems such as solder adhering to the insulating layer are less likely to occur, and lead-to-lead bridges or short circuits due to solder are less likely to occur.

[Embodiment] Next, a method for manufacturing a hybrid integrated circuit device according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

First, as shown in FIG. 1(A), a silver-palladium conductor paste is printed on a ceramic substrate 1, dried, and fired (
850°C for 11o minutes) to obtain I shown by the dashed line.
A large number of electrode conductor layers 2 for connecting CII leads 12, ie, soldering, form lands, resistor electrode conductor layers 3, wiring conductor layers 4, and the like.

Next, as shown in FIG. 1(B), a crystallized glass paste (crossover glass paste) containing lead silicate glass as a main component is applied to the cross wiring portion and the electrode conductor JW.
2, dried at 150° C. for 10 minutes, and baked at 850° C. for 10 minutes to form a cross-over glass layer 5 and an insulator 7116 functioning as a solder resist layer as shown with diagonal lines. Form. Both the crossover glass layer 5 and the insulator layer 6 are glass layers having a high softening temperature and mainly composed of crystalline glass consisting of 90% crystalline glass and 10% amorphous glass. Therefore, high temperature (850
℃), there is very little sagging at the periphery. In other words, there is little difference between the printed pattern of the glass paste and the pattern after firing.

Next, as shown in FIG. 1C, a cross wiring conductor layer 7 is formed on the crossover glass layer 5.

This conductor layer 7 is made by printing silver palladium conductor paste,
It is formed by drying at 150°C for 10 minutes and baking at 850°C for 10 minutes.

Next, as shown in FIG. 1(D), a thick film resistor 8 is formed between the electrode conductor layers 3 by printing a resistor paste, drying it at 150°C for 10 minutes, and baking it at 850'C for 110 minutes. Form.

Next, as shown in FIG. 1(E), an amorphous overcoat glass layer 9 is formed, except for the electrode conductor layer 2 for IC connection, between them, and other electrode parts not shown. Forms a film. This overcoat glass layer 9 is formed by printing an overcoat glass paste, drying it at 150°C for 10 minutes, and baking it at 530°C for 3 minutes.

Next, after trimming the thick film resistor 8, cream solder (solder paste) consisting of solder alloy powder and flux is printed on the electrode conductor layer 2 as shown in FIG. 1(E). A solder layer 10 is formed.

Next, as shown in FIG. 2, the leads 12 of ICI 1 are placed on top of the cream solder/[10]. Cream solder layer 10
has adhesive properties, so the leads 12 are temporarily attached.

Next, the cream solder layer 10 is melted and solidified to fix the lead 12 to the electrode conductor M2.

In this embodiment, since the insulating layer 6 between the electrode conductor layers 2 is mainly composed of crystalline glass, there is extremely little wobbling at the periphery, and a highly accurate pattern can be obtained.

Therefore, the insulator N6 can be accurately formed even at extremely narrow intervals such as 0.4 mm. Since the insulator layer 6 is less likely to drip onto the electrode conductor layer 2 and contaminate it, the cream solder 10 is less likely to be printed on the insulator layer 6, and the occurrence of solder bridges is reduced. Become.

Moreover, the occurrence of incomplete connections of the leads 12 is reduced, and reliability is improved. Furthermore, in this example, since the insulator J16 is formed at the same time as the crossover glass layer 5,
Substantially no increase in process steps occurs.

[Modifications] The present invention is not limited to the above-described embodiments, and may be modified. For example, the electrode conductor layer 2.3 and the wiring conductor layer 4 may be formed using copper paste. good.

[Effects of the Invention] As is clear from the above, according to the present invention, the leads can be connected reliably.

[Brief explanation of the drawing]

Figures 1 (A), (B), (C) < D, and (E) are plan views showing the hybrid integrated circuit device according to the present invention in the order of manufacturing steps, and Figure 2 is the line ■-■ in Figure 1 (E). FIG. 3 is a cross-sectional view showing a portion corresponding to , with leads connected thereto. 1 Ceramic substrate 2 Electrode conductor layer Crossover glass layer 6 Insulator layer 9 Overcoat glass layer 10 Cream solder 1 IC 12 leads 1962 Patent Rei No. 10785 2,
Title of the invention Method for manufacturing a hybrid integrated circuit device 3 Relationship with the case of the person making the amendment Applicant 4, attorney 5, date of amendment order Initiator 6 Number of inventions increased by the amendment 7 Drawings to be amended (Fig. 1) prisoner @0). 8. Details of the amendment: Figure 1 (4) @Ω will be corrected to the attached drawing. Figure 1

Claims (2)

[Claims] (1) A step of forming a plurality of electrode conductor layers on an insulating substrate for soldering circuit components having a plurality of adjacent leads, and a step of forming a crystalline glass between the plurality of electrode conductor layers. manufacturing a hybrid integrated circuit device comprising the steps of: forming an insulator layer containing as a main component; and connecting leads of the circuit component to the plurality of electrode conductor layers by solder. Method. (2) the step of connecting the leads of the circuit component with the solder includes providing a cream solder layer on the electrode conductor layer;
2. The method of manufacturing a hybrid integrated circuit device according to claim 1, further comprising bonding the lead to the electrode conductor layer using the cream solder layer.