JPH0631137U - Multiple electronic components - Google Patents

Abstract

(57) [Abstract] [Purpose] You can easily make the thickness of the center and end of multiple electronic components almost the same without increasing the number of manufacturing processes or increasing the size of the board. To prevent bite of multiple electronic parts. [Structure] The multiple electronic component 10 of the present invention comprises an insulating substrate 1,
In the longitudinal direction of the insulating substrate 1, a plurality of chip capacitors 4a to
Electrode pads 2, 3a formed so that 4d are arranged in parallel
3d and 3z, and chip capacitors 4a to 4d arranged in parallel between the electrode pads 2 and 3a to 3d. And
A conductive film pad 5a is formed on the end of the insulating substrate 1 in the longitudinal direction.
And the thick portion 5 ... Consisting of the solder layer 5b.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to multiple electronic components such as multiple capacitor components and multiple resistors.

[0002]

[Prior art]

 Conventionally, as shown in FIGS. 4 and 5, a structure of a multiple electronic component is such that a rectangular insulating substrate 1, a common electrode pad 2 formed at one long side end of the insulating substrate, and an insulating substrate Chip parts soldered between the individual electrode pads (hereinafter, simply referred to as electrode pads) 3a to 3d formed on the other long side end of the substrate and the common electrode pad 2 and the electrode pads 3a to 3d 4a to 4d, lead terminals 6a to 6d and 6z extending from the electrode pads 3a to 3d and 3z, and a molding resin 7 that exposes a part of the lead terminals 6a to 6d and 6z and covers the whole. Was configured.

In a conventional method for manufacturing a multiple electronic component, a large-sized substrate divided by a break line so that a large number of rectangular insulating substrates 1 can be extracted is manufactured.

First, the electrode pads 2, 3a to 3d, 3z are printed, dried, and baked on the front surface and the back surface of the region to be the insulating substrate 1 divided by the break line. The electrode pad on the back side does not appear in the figure. At this time, the common electrode pad 2 and the electrode pads 3a to 3d and 3z are provided on the front surface side of the substrate 1, and the front surface side electrode pads and the lead terminals 6a to 3d and 3z are provided on the back surface side of the substrate 1. Individual electrode pads are formed so that 6d and 6z can be attached.

Next, the chip components 4a to 4d such as chip capacitors and chip resistors are soldered so as to extend across the common electrode pad 2 and the electrode pads 3a to 3d. The solder joining method at this time is a reflow process using a cream solder and a reflow furnace, or a solder dip process to collectively join a plurality of chip components 4a to 4d onto a large-sized substrate.

Next, the insulating substrate 1 to which the plurality of chip components 4a to 4d are bonded is extracted from the large substrate along the break line of the large substrate.

As shown in FIG. 3, the break is divided by inserting the large substrate 11 between the two substrate dividing rollers 31a and 31b and pressing the rollers 31a and 31b. Here, since the chip components 4a to 4d are already bonded near the center of the substrate 1, the contact portions of the rollers 31a and 31b that avoid the chip components 4a to 4d are set on the insulating substrate 1. I had to leave. This portion is a substrate peripheral portion such as an end portion on the short side of the substrate 1.

Next, the lead terminals 6a to 6d are inserted into the electrode pads 3a to 3d, 3z on the front and back of the individually divided insulating substrate 1 and soldered by solder dipping.

Next, the entire substrate 1 is covered with the resin mold 7 so that the lead terminals 6 a to 6 d are partially exposed. Specifically, it is dipped in a powdery thermoplastic resin, applied to the entire substrate 1, and then heat-treated. Alternatively, the entire substrate 1 is dipped in a molten resin and cooled and cured.

[0010]

[Problems to be solved by the device]

 In the multiple electronic component 40 formed as described above, the blank portion for contacting the divided rollers 31a and 31b provided around the insulating substrate 1 is compared with the portion where the chip components 4a to 4d are mounted. And its thickness becomes thin.

When the multiple electronic components 40 are stored in a long hollow storage case 60 as shown in FIG. 6B, when they are normally stored, the multiple electronic components 40a, Substrate end sides of 40b and 40c are in contact with each other and aligned in series.

However, in the case of the conventional multiple electronic components 40a, 40b, 40c whose thickness becomes thin on the end side of the substrate 1 as described above, vibration is given from the outside, such as during transportation of the storage case 60. Then, as shown in FIG. 6 (a), one end of the adjacent electronic component 40b that is housed adjacent to the inner wall of the storage case 60 and the end of the electronic component 40a bites into the gap. . Further, one end of the multiple electronic components 40c that are adjacently accommodated will bite into the gap between the inner wall of the storage case 60 and the other end of the multiple electronic components 40b.

Therefore, when the multiple electronic components 40a to 40c are taken out from the storage case 60, they cannot be taken out smoothly, and when they are mounted on the printed wiring board by an automatic machine, they cause trouble. I will end up.

In order to prevent this, in order to make the thickness of the end portion of the substrate 1 equal to the thickness of the central portion of the substrate on which the chip components 4a to 4d are mounted, after dividing the insulating substrate from the large substrate, In some cases, jumper chip parts and dummy chip parts that do not function in the circuit were joined. However, in the manufacturing process, such dummy chip parts must be joined after the large substrate 11 is divided. It had to be performed separately from the mounting process of the components 4a to 4d. In other words, the solder joining process of the chip components 4a to 4d-the dividing process-the joining process of the dummy chip components increases.

The present invention has been devised in view of the above problems, and an object thereof is to easily make the thickness of multiple electronic components substantially the same without increasing the manufacturing process, and to store the case. It is intended to provide multiple electronic components that can prevent mutual bite in each other.

[0016]

[Means for Solving the Problems]

 The multiple electronic component of the present invention comprises a plurality of chip components mounted on one main surface of a rectangular insulating substrate so as to be parallel to the shorter side of the insulating substrate. In the above, a thick portion composed of a conductive film pad and a solder layer formed on the conductive film pad is arranged at an end portion on the short side of the insulating substrate.

[0017]

[Action]

 With the above configuration, a thick part made of a conductive film pad and a solder layer is formed around the board, particularly when it is housed in a case, at the longitudinal end of the board that abuts the adjacent multiple electronic component. Therefore, the thickness of the resin-molded multiple electronic components is almost the same as the central part of the board on which the chip parts are mounted, and the bite between the adjacent multiple electronic components in the storage case and the inner wall of the storage case. Can be prevented, and stable storage and removal becomes possible.

In addition, since the conductive film pad is formed at the same time as the common electrode pad and the electrode pad, and the solder layer is formed at the same time when the chip components are soldered, the manufacturing process is not actually performed. There is no.

The conductive film pad can have a predetermined thickness due to the surface tension of the solder. In order to make this thickness approximately the same as the thickness of the chip component, it is desirable to set the shape of the dummy pad to 2 mm square or more and to form a plurality thereof.

[0020]

【Example】

 Hereinafter, the multiple electronic component of the present invention will be described in detail with reference to the drawings. In the figure, a multiple capacitor component, which is one mode of the multiple electronic component and has a plurality of chip capacitors arranged side by side on a substrate, will be described.

FIG. 1 is a plan view of the multiple capacitor component, and FIG. 2 is a view showing a cross section taken along line XX in FIG.

The multiple capacitor component 10 includes an insulating substrate 1, a common electrode pad 2, front surface electrode pads 3a to 3d, chip capacitors 4a to 4d, a thick portion 5, ..., Lead terminals 6a to 6d, 6z. , And a resin mold 7.

The insulating substrate 1 is made of an insulating material such as alumina, and the common electrode pad 2 is provided at one end of the insulating substrate 1 on the long side opposite to each other, and the other end on the long side is provided. In the portion, electrode pads 3a to 3d and a pad 3z extending from the common electrode pad 2 are formed, respectively. Although not shown in the figure, electrode pads are also formed on the back surface of the substrate 1 corresponding to the electrode pads 3a to 3d and 3z.

Further, thick-walled portions 5 including a conductive film pad 5 a and a solder layer 5 b are formed at one end portion of the insulating substrate 1 on one short side which is opposed to each other. Further, the common electrode pad 2 formed on one long side end and the common electrode pad 3z formed on the other long side end are commonly connected to one short side end. The electrode pad 2 is laid out, and thickened portions 2a and 2b having a large area are formed in the laid-out portion.

The electrode pads 3 a to 3 d and 3 z on the front surface side and the electrode pads formed on the back surface are formed on the other long side of the insulating substrate 1 so as to be juxtaposed at predetermined intervals.

The lead terminals 6a to 6d and 6z are solder-bonded by the electrode pads 3a to 3d and 3z on the front surface side and the electrode pads formed on the back surface.

The chip capacitors 4a to 4d are arranged side by side so as to straddle the common electrode pad 2 and the surface-side electrode pads 3a to 3d, and are joined by soldering. For example, the chip capacitor 4a is arranged so as to straddle between the common electrode pad 2 and the surface-side electrode pad 3a.

Three thick portions 5 ... Are formed at one end on the short side of the insulating substrate 1 in the figure. The thick portion 5 ... Is composed of a conductive film pad 5a formed of the same material as the common electrode pad 2 and the electrode pads 3a to 3d, and a solder layer 5b bonded on the conductive film pad 5a. ing. The conductive film pad 5a has a substantially rectangular shape, and the size thereof is 2 mm square or more. Further, at the other end on the short side of the insulating substrate 1, the thick portions 2a and 2b having the same layer structure as the thick portions 5 ... Has been formed.

Prior to the bonding of the chip capacitors 4a to 4d, a part of the common electrode pad 2 to which the chip capacitors 4a to 4d are bonded, the electrode pads 3a to 3d on the surface side and the meat are formed on the surface of the insulating substrate 1. An overglass 8 having silica as a main component, which is a solder resist, is formed to expose the thick portions 5, ..., 2a, 2b. Specifically, the overglass 8 is formed so as to divide the electrode pads 3a to 3d and 3z on the front surface side, and in the lead-out portion of the common electrode pad 2, the dimensions of the thick portions 2a and 2b are defined. It is formed so as to cross the lead-out portion.

In this way, if the overglass 8 is formed, when the chip capacitors 4a to 4d are reflow-processed with cream solder for solder joining, the substrate 1 is dipped in a molten solder bath. When the solder dipping process is performed by the solder dip treatment, it is possible to prevent a short circuit between the adjacent electrode pads 3a to 3d and 3z, and at the same time, form the solder layer 5b on the conductive film pad 5a to form the thick portions 5, ..., 2a, 2b. When forming the solder layer, the thickness of the solder layer 5b can be increased by limiting the place where the solder layer 5b is formed and utilizing the surface tension of the solder. In particular, the solder layer 5b can form the solder layer 5b sufficiently swelled on the conductive film pad 5 due to the surface tension of the solder by setting the dimension of the conductive film pad 5 to be 2 mm square or more. .., 2a, 2b having a thickness of about 0.3 to 1.0 mm, which is substantially the same as the thickness of the chip capacitors 4a to 4d in the central portion of the substrate, can be formed.

One end of each of the lead terminals 6a to 6d and 6z is divided into two parts, one of which is soldered to the front surface side electrode pads 3a to 3d and 3z, and the other is soldered to the back surface side electrode pad.

The resin mold 7 is formed by applying and curing a thermosetting resin powder so as to expose a part of the lead terminals 6a to 6d and 6z. Further, it may be formed by immersing it in a bath in which a thermosetting resin is melted and curing it. As a result, the chip capacitors 4a to 4d and the electrode pads 2, 3a to 3d on the insulating substrate 1 are protected against external impact.

Next, a method of manufacturing the multiple electronic component of the present invention will be described.

First, a large insulating substrate 11 partitioned by break lines 12 is prepared so that a plurality of insulating substrates 1 can be extracted.

Next, on the surface side of the region of the insulating substrate 1 partitioned on the large-sized substrate 11, the common electrode pad 2 including the wide portions to be the thick portions 2a, 2b, the electrode pads 3a to 3d on the front side, and The conductive film pad 5a to be the thick portion 5 is printed using a silver-based conductor or a copper-based conductor material, dried, and then baked. On the back surface, the electrode pad on the back surface is printed using a silver-based conductor or a copper-based conductor material, dried, and then baked.

Next, the common glass 2 to which the chip capacitors 4a to 4d are joined, the electrode pads 3a to 3d on the front side, and the overglass are printed and dried so that the thick portions 5 ... 2a and 2b are exposed. -Bake.

Next, the chip capacitors 4a to 4d are juxtaposed between the common electrode 2 and the electrode pads 3a to 3d on the front side and joined by solder, and at the same time, the solder layers of the thick portions 5, ..., 2a, 2b. 5b is formed. Specifically, cream solder is applied and heat-treated in a reflow oven. Alternatively, the solder dipping method is used in which the entire substrate 11 is immersed in a molten solder bath.

Next, the large insulating substrate 11 is divided and the insulating substrate 1 having a predetermined size is extracted. Specifically, the substrate is divided along the break line, but as shown in FIGS. 3 (a) and 3 (b), the large substrate 11 is inserted between the two substrate dividing rollers 31a and 31b so that the two substrate dividing rollers are It is divided by pressing 31a and 31b. As shown in the plan view of FIG. 3B, the actual substrate dividing rollers 31a and 31b are arranged so as to avoid the chip capacitors 4a to 4d bonded to the end portion on the short side of the substrate 1, that is, the center of the substrate 1. And presses the portion where the thick portion 5 ... Is formed. Even if pressure is applied to this portion, only the pressure is applied to the half-layer 5b of the thick portion 5, ..., The peeling of the chip capacitors 4a to 4d due to this pressure does not occur.

Next, the lead terminals 6 a to 6 d and 6 z are respectively bonded to the electrode pads 3 a to 3 d and 3 z on the front surface side of the insulating substrate 1 and the corresponding electrode pads 31 a to 31 d and 31 z on the rear surface side, which are individually divided. Then, soldering is performed. The solder joining at this time is preferably a solder dip method. Since the solder layer 5b forming the thick portions 5, ..., 2a, 2d is formed again by this solder joining, even if the solder layer 5b is damaged in the above-described division step, it is easy to regenerate it. To be done.

Finally, a resin mold 7 is formed on the entire substrate 1 so that the lead terminals 6a to 6d and 6z are partially exposed. Specifically, the insulating substrate 1 is slightly heated and immersed in a thermosetting resin powder such as an epoxy resin, and then the thermosetting resin powder adhered to the entire insulating substrate 1 is heated and melted to cure. To do. As another method, it may be cooled and hardened by immersing it in a molten resin bath so that some of the lead terminals 6a to 6d and 6z are exposed.

According to the multiple electronic component manufactured as described above, when the large-sized substrate is divided, the end portions of the substrate 11, which are indispensable, are in contact with the division rollers 31a and 31b, particularly the insulated substrate 1. .. are formed at the ends on the short side of. Therefore, considering the thickness of the multiple electronic component 10 in which the resin mold 7 is formed, the thickness of the portion where the chip capacitors 4a to 4d are arranged and the thickness of the end portion on the short side of the substrate 1 are set to be substantially equal. It will be ruko. As described above, since the end portions on the short side of the substrate 1 have substantially the same thickness, when a plurality of multiple electronic components 10 are stored in a storage case, as shown in FIG. The front end of the multiple electronic components stored later does not bite into the space between the rear end of the multiple electronic components and the inner wall of the case, ensuring stable storage and removal. You can do it.

The above-described operation and effect, that is, the prevention of the bite between the multiple electronic components, can be prevented by the end portion on the short side of the substrate 1 (the end portion that abuts the adjacent multiple electronic components when the substrate 1 is stored in the storage case). 2a, 2b is formed by forming the thick-walled portions 5 ... 2a, 2b. Particularly, at the portion where the thick-walled portions 5 are formed, the split rollers 31a, 31b are pressed against each other when the large substrate 11 is split. Since the insulating substrate 1 corresponds to a blank portion that cannot be removed, even if the thick portion 5 is formed, the size of the substrate 1 does not increase.

Further, the step of forming the thick portion 5 ... Simultaneously forms the common electrode pad 2 and the electrode pads 3a to 3d on the surface side, and at the same time, only changes the conductor film pattern to change the conductive film pad 5a and the common electrode pad. Since the wide part of the lead-out part of 2 can be formed, and the forming process of the solder layer 5a is simultaneously formed in the solder joining process of the chip capacitors 4a to 4d and the solder joining process of the lead terminals 6a to 6d, 6z, There is no increase in the number of processes, and no substantial increase in manufacturing cost.

In the above-described embodiment, if the storage direction in the storage case can be controlled, it is not necessary to form the thick portions 2a and 2b in the lead-out portion of the common electrode 2.

Further, according to the above-described embodiments, the chip capacitor has been described as the chip-type electronic component, but a chip resistor or a chip inductor may be used instead of the chip capacitor, or a combination of these may be used. A simple circuit may be configured.

Furthermore, the pattern shape of the common electrode pad and the surface-side electrode pad can be arbitrarily changed by various circuit configurations.

[0047]

[Effect of device]

 As described above, according to the present invention, since the thickness of the multiple electronic component can be made substantially the same on the center side of the substrate on which the chip component is mounted and the end portion of the substrate, a plurality of multiple electronic components can be stored in the storage case. When the serial electronic components are stored, there is no bite between the adjacent multiple electronic components and the inner wall of the case, which makes the storage work extremely easy and the work of taking out the multiple electronic components from the storage case is also very good. Become.

Further, even if the thick portion is formed in order to make the multiple electronic components have the same thickness, since the thick portion is formed in the necessary region in the dividing step, the size of the substrate does not increase. In addition, since there are no additional steps in the manufacturing process, the manufacturing cost can be maintained as usual.

[Brief description of drawings]

FIG. 1 is a plan view of a multiple electronic component of the present invention with a resin mold omitted.

FIG. 2 is a sectional view of the multiple electronic component of the present invention.

3A and 3B are views for explaining a dividing step in the manufacturing process of the multiple electronic component of the present invention, in which FIG. 3A is a side view and FIG. 3B is a plan view.

FIG. 4 is a plan view of a conventional multiple electronic component without a resin mold.

FIG. 5 is a cross-sectional view of a conventional multiple electronic component.

FIG. 6 is a top view showing a state in which a conventional multiple electronic component is stored in a storage case, and (a) shows a good storage state,
(B) shows a defective storage situation.

[Explanation of symbols]

 10 ... Multiple electronic components 1 Insulation substrate 2 Common electrode pads 3a to 3d Front surface electrode pads 3z Common Electrode pads extending from the electrode pads 4a to 4d ... Chip capacitors 5, 2a, 2b-Thickness portion 5a ... Conductive film pad 5b ... Solder layers 6a-4d, 6z ... Leads Terminal 7: Resin mold 8: Over glass

Claims (1)

[Scope of utility model registration request] 1. A multiple electronic component comprising a plurality of chip components mounted on one main surface of a rectangular insulating substrate so as to be parallel to a short side of the insulating substrate. A multiple electronic component, wherein a thick portion composed of a conductive film pad and a solder layer formed on the conductive film pad is arranged at an end of a short side of the substrate.