JPH06275774A - Connection device of circuit unit and circuit module using the connection device - Google Patents

Abstract

PURPOSE:To acquire a thin circuit module of high density by forming a plurality of electrodes connecting a thickness direction in a periphery of a frame-like substrate, by connecting electrodes in a periphery of a circuit unit to be mounted and by making an interior of a substrate space a containing region of a circuit. CONSTITUTION:A plurality of electrodes 12 connecting a thickness direction are formed in a periphery of a square frame-like substrate 11 in a connection device 10 of a circuit unit. A circuit unit 20 is connected on the frame-like substrate 10 by soldering an electrode 12 and an electrode 23. An inner space 15 of the frame-like substrate 11 is constituted as a containing region of a circuit component 22 to be mounted on the circuit unit 20 which is mounted on the inner space 15. Thereby, it is possible to connect a circuit unit to be mounted and connected to a lower circuit unit or a printed wiring at a minimum distance and to shorten package height.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit unit connecting device and a circuit module using the connecting device.

[0002] In the field of electronic / communication, reduction in size and weight is promoted, and power saving is also promoted. For this reason, a circuit board that has a very high degree of integration and enables high-density mounting is adopted.However, this mounting form is also extremely thin, and many signal lines and short circuits are used for connections between circuits. There is a demand for shorter signal transmission distance and less inductive interference to signal circuits.

[0003]

2. Description of the Related Art A conventional circuit module will be described with reference to FIG. 11. As shown in FIG. 11A, circuit components 1 and 2 are mounted in a high density on both sides and mounted in a square shape in plan view. The circuit board 3 has lead terminals 4 on the four sides.
4 is extended and bent so that the circuit board 3 is sufficiently higher than the height of the lower circuit component 2. The circuit module 5 is configured in this way.

An appropriate amount of solder paste 8 is supplied on the connection pattern of the circuit pattern 7 formed on the surface of the lower printed wiring board 6, and the lead terminals 4, 4 of the circuit module 5 are positioned on this. The circuit module 5 is mounted and mounted on the printed wiring board 6 by inserting the circuit module 5 into the reflow oven, melting the solder paste 8, taking it out, and connecting it by soldering.

[0005]

According to the conventional circuit module 5 described above, since the lead terminals 4 and 4 are extended to the four sides of the circuit board 3, the length of the lead terminals 4 and 4 is long. It is unsuitable for high-frequency signal processing and is susceptible to electrical inductive damage from the surroundings. Also,
Due to the lead terminals 4 and 4, the actual mounting area is large and the mounting height is considerably high. In view of the above conventional problems, it is an object of the present invention to provide a circuit module which has a small mounting area, can be mounted at a minimum height, and is less susceptible to inductive obstacles.

[0006]

The object of the present invention to solve the above-mentioned problems is to basically form a plurality of electrodes connected in the thickness direction around a frame-shaped substrate, By connecting electrodes around the circuit unit mounted on the frame-shaped substrate, the circuit unit can be connected to a circuit under the frame-shaped substrate, and a circuit mounted in the frame-shaped substrate internal space A connection device for a circuit unit, which serves as an accommodation area for circuit components mounted in the unit, and as a circuit module, a connection device for a circuit unit in which a plurality of electrodes for connecting the thickness direction around a frame-shaped substrate are formed. And a circuit unit mounted on at least a lower surface thereof and mounted and connected on a connecting device of the circuit unit, wherein the circuit component is housed in the frame-shaped substrate internal space.

[0007]

According to the circuit unit connecting device, which is the basis of the present invention, the circuit components on the lower side of the circuit unit mounted and mounted on the upper side are accommodated inside, so that the overall mounting height is minimized. It is possible to Since the electrodes formed around the lead wire are connected to the printed wiring board in a leadless manner, the electrodes can be connected in the shortest distance, and thus are less susceptible to inductive interference. Therefore, the mounting area can be reduced to the same size as the circuit unit. It is also possible to electrically shield the circuit if desired.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A circuit unit connecting device of the present invention and a circuit module using this connecting device will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of an embodiment of the present invention,
FIG. 3A shows the connection device of the circuit unit and the separated state of the circuit unit. In FIG. 1A, a circuit unit connecting device 10 has a plurality of electrodes 12 connected in the thickness direction around a rectangular frame-shaped substrate 11. Each of the electrodes 12 is composed of a land 13 and a semicircular groove conductor 14 which connects the lands 13 to each other in the vertical direction. The frame-shaped board 11 internal space 15 is configured as a housing area for circuit components mounted on a circuit unit mounted thereon.

The circuit unit 20 shown above the circuit unit connecting device 10 has a relatively high height circuit component 21 mounted and mounted on the upper side, and a relatively low height circuit component 22 on the lower side. Has been implemented.

Each of these circuit components 21 and 22 is a small surface mount type component (SMD) capable of high-density mounting. The upper circuit component 21 is, for example, a QFP type LSI.
, ICs, coils, etc., and the lower circuit component 22 can have a functional layout configuration by arranging, for example, resistors and capacitors.

The circuit board of the circuit unit 20 is composed of a double-sided or multi-layered printed wiring board, but the circuit pattern is omitted for convenience sake. Circuit parts 21,
22 is soldered and mounted on the connection pattern portion of the circuit pattern (not shown). On the periphery of the lower surface of the circuit unit 20, electrodes 12 around the connection device 10 of the circuit unit are provided.
The electrode 23 is formed corresponding to.

FIG. 1B shows a state in which the circuit unit 20 is connected to the electrodes 12 and 23 by soldering on the frame-shaped substrate 10.
Is partially broken away to show that the lower circuit component 22 is shown. In this way, the internal space 15 of the frame-shaped substrate 10 accommodates the circuit component 22 mounted on the lower side of the circuit unit 20.

As is apparent from FIG. 2B, the outer shape of the circuit unit connection device 10 is equal to or slightly smaller than the outer shape of the circuit unit 20. The circuit module 25 of the present invention is shown in FIG. The circuit pattern on the upper side is connected to the electrode 23 on the lower side by a via hole.

An embodiment of a method of manufacturing the circuit unit connection device 10 will be described with reference to FIG. In the plan view of FIG. 2A, completely symmetrical lands 13 are formed as copper foil patterns on both sides of a square glass epoxy resin substrate 27 by a printed board manufacturing technique, and circular small holes 28 are formed in quadrangular shapes. Provide along a straight line.

A linear first connection pattern 29 is connected to all the lands 13 and a second connection pattern 30 surrounding them is put together at one place. The holes 31 and 31 formed at the diagonal positions are reference holes, and the holes 31 and 31 are used for positioning in all the processing steps.

The inner surface of the circular small hole 28 is plated by electroless plating, and then copper is plated in the hole 28 via the connection patterns 29 and 30. Finally, the hole 28 including the land 13 is plated with gold to finish as shown in FIG.

That is, by cutting along the outer periphery of the land 13, the electrodes 13 in which the lands 13, 13 on both sides are connected by a semicircular groove conductor 14 are obtained. The inner space 15 on the inner side is also formed by cutting, but it can be arbitrarily implemented by another step or a simultaneous step.

This embodiment shows a basic manufacturing method, and it is suitable for mass production to continuously manufacture the connection device 10 of a large number of circuit units by a continuous substrate. The substrate material is not limited to glass epoxy resin, but BT
It is possible to apply a resin (bismaleimide triazine resin) or other similar known resin, and it is also possible to use a ceramic substrate if necessary. 1 is a rectangle, but FIG. 2 is a square.

The relationship with the printed wiring board will be described with reference to FIG. FIG. 3A is a perspective view showing a part of the printed wiring board 35.
Only the frame is arranged and formed. The circuit pattern is not shown.

In FIG. 3B, a side view of the positional relationship among the circuit unit connecting device 10, the circuit unit 20, and the printed wiring board 35 is shown in a vertically separated state for easy understanding. Therefore, only the lands 13 of the electrodes 12 of the connection device 10 of the circuit unit, the electrodes 23 of the circuit unit 20, and the connection patterns 36 of the printed wiring board 35 are exaggeratedly drawn thick. Actually 20μ
Since the thickness is about m, it is not clearly visible. As shown in the figure, it can be seen that the positions of all the electrodes 12 and 23 and the connection pattern 36 are exactly the same.

A method of mounting the circuit unit 20 on the printed wiring board 35 will be described with reference to FIG. First, as shown in FIG. 5A, an appropriate amount of solder paste 38 is supplied to each of the electrodes 23 of the circuit unit 20 by an appropriate means, and the solder paste 38 is aligned with the connection device 10 of the circuit unit and overlapped.
It is inserted into a reflow oven, the solder is taken out in a molten state, solidified, and soldered to the upper land 13 of the connection device 10 of the circuit unit.

Next, as shown in FIG. 2B, a circuit unit connection device in which an appropriate amount of solder paste 39 is supplied to each of the connection patterns 36 of the printed wiring board 35 by an appropriate means to connect the circuit unit 20 by soldering 10 are aligned and piled up, inserted into a reflow oven, the solder is taken out in a molten state, solidified, and soldered and connected to the lower land 13 of the connecting device 10 of the circuit unit. In this case, the melting temperature of the solder is preferably lower than the melting point of the solder for connecting to the circuit unit 20.

As described above, all the circuits of the circuit unit 20 are wired and connected to the printed wiring board 35 via the electrodes 12 of the connection device 10 of the circuit unit in the shortest distance.
By the way, according to the results of trial production by the present inventors, the circuit board of the circuit unit 20 has four layers of 30 mm square and a thickness of 0.5.
mm, the thickness of the circuit unit connection device 10 is 1 mm, and the height of the circuit component 21 on the circuit unit 20 is 1.5 mm.
It has been confirmed that it is possible to sufficiently reduce the entire height to 3.5 mm or less by setting the height to mm. By arranging the circuit component 22 having a low height in the lower portion in this manner, it becomes possible to reduce the thickness of the connection device 10 of the circuit unit despite the high-density mounting.

Next, a method of manufacturing the circuit unit 20 will be described with reference to FIG. Each figure is a side view seen from one side. First, referring to FIG. 5, FIG. 5A shows a predetermined pattern on a multi-layered or double-sided circuit on a connection pattern on an upper side of a circuit board 40 formed by a printed wiring board technique, as shown in FIG. An appropriate amount of solder paste 41 and an epoxy resin adhesive 42 are applied and arranged between them.

As shown in FIG. 3C, the main body component 43 of the circuit component 21 is placed on the adhesive 42, and the lead terminals 44 on both sides are brought into contact with the solder paste 41. In this state, the adhesive 42 is cured by curing at 150 ° C., for example.
Is cured and the circuit component 21 is adhesively fixed onto the circuit board 40. In this way, as shown in FIG. 3D, it is turned upside down to proceed to the next step.

Referring to FIG. 6, which is the first manufacturing method,
The land 1 of the electrode 12 on and around the connection pattern of the circuit pattern on the lower surface which has been inverted in the final step of FIG.
An appropriate amount of solder paste 45 is supplied and arranged on each of the upper portions 3 as shown in FIG.

Next, as shown in FIG. 2B, a circuit unit connecting device 10 (the drawing is shown in cross section) similar to that described in FIG. 1 or 2 is provided on the surrounding solder paste 45. Then, the electrode portions 46 of the circuit component 22 are placed in contact with the solder paste 45 in the central portion.

In this state, the whole is inserted into a reflow oven, the solder pastes 41 and 45 are melted, taken out and the solder is solidified, and all the parts are collectively soldered and connected. This state is shown in FIG. As a result, the circuit module 20 is completed. Solder 4 in Figure (c)
1, 45 are not shown because most of the solder in the molten state will spread and creep up to the corners around the leads 44 and electrode portions 46.

Referring to FIG. 7, which is the second manufacturing method,
As shown in FIG. 5A, an appropriate amount of solder paste 45 is supplied onto the connection pattern of the circuit pattern on the lower surface which has been inverted in the final step of FIG.
A thermosetting adhesive 47 having heat resistance is thinly applied to the peripheral portion avoiding the second land 13.

Then, as shown in FIG. 2B, the connection device 10 (the drawing is shown in cross section) of the circuit unit similar to that described in FIG. 1 or 2 is provided on the peripheral adhesive 47. Then, the electrode portions 46 of the circuit component 22 are placed in contact with the solder paste 45 in the central portion.

In this state, the whole is inserted into a reflow oven to melt the solder pastes 41 and 45, cure the adhesive, take out and solidify the solder, and the circuit component 2
1 and 22 are connected by soldering. This gives a semi-finished state of the circuit module. This state is shown in FIG. Although the solders 41 and 45 are not shown in the figure (c), most of the solder is the lead 44 in the molten state.
This is because they spread so as to adhere to the corners around the electrode portion 46 and to creep up.

As shown in FIG. 3D, the solder paste 39 is supplied onto the connection pattern 36 on the printed wiring board 35, and the semi-finished product of the circuit module is inverted and placed on the solder paste 39 in this state. Insert into reflow oven.

The solder 39 melts and crawls along the electrode 12 of the circuit unit connecting device 10 to reach the electrode 23 of the circuit unit 20, and the printed wiring board 35, the circuit unit connecting device 10 and the circuit unit 20 are connected to each other. It will be connected by soldering.

This is because the height of the connecting device 10 of the circuit unit is thin and the electrode 12 is a concave groove, so that solder having good wettability can easily crawl up. In this way, when the circuit module 20 is completed, the soldering connection to the printed wiring board 35 can be performed at the same time.

A mode of the electrode 12 of the connection device 10 of the circuit unit will be described with reference to an enlarged partial perspective view of FIG. 8 and a partial sectional view thereof. FIG. 8A is the same as the above mode. A frame-shaped substrate 11 and electrodes 12 for connecting in the thickness direction are formed on the outer periphery of the frame-shaped substrate 11. As shown in the sectional view of FIG. It is possible to obtain a mounting area of the upper surface that is larger than the outer shape by the amount of L ₁ which is the area where the solder 49 is attached.

The embodiment shown in FIG. 3C has a frame-shaped substrate 11.
An electrode 50 for connecting the thickness direction is formed inside the periphery of the inner space 15 which is an accommodation area of the circuit component 22 mounted on the circuit unit 20 as shown in the sectional view of FIG. Can be largely secured.

Further, the embodiment shown in the perspective view of FIG. 7E and the cross-sectional view of FIG. 6F has electrodes 12 and 50 for connecting the thickness direction to both the outside and the inside of the periphery of the frame-shaped substrate 11. Since it can be individually connected to the printed wiring board 35 on both the outside and the inside, an extremely large number of connections can be made, and the mechanical connection strength can be obtained accordingly.

FIG. 9 shows an embodiment of the second invention of the present invention.
Will be described with reference to the side sectional view of FIG. According to the present invention, a plurality of electrodes 12 for connecting in the thickness direction are formed on the outer periphery of the connection device 10 of the circuit unit, and the metal plating 51 is formed on the periphery of the inside of the frame-shaped substrate.

The circuit unit 20 uses a four-layer circuit board in which circuit patterns for mounting and connecting the components 21, 22 and a power supply layer 52 as an inner layer and a large-area ground layer 53 are formed on both surfaces of the circuit board 40. .

Similarly, the printed wiring board 35 uses a four-layer circuit board on which a surface circuit pattern, a power supply layer 55 as an inner layer, and a large-area ground layer 56 are formed.

The circuit board 40 and the ground layers 53 and 56 of the printed wiring board 35 configured as described above are located at positions corresponding to the metal plating 51 of the connection device 10 of the circuit unit by a large number of via holes (not shown). Connection patterns are formed on the surface respectively, and the connection pattern and the metal plating 51 are soldered to set the internal space 15 to the ground potential and electrically shield the external space. Is something that can be done.

Therefore, the lower surface of the circuit unit 20 can be used as a processing circuit for high-frequency signals which needs to avoid electrical inductive interference with others. According to the present embodiment, it is possible to secure an electrically shielded space without making the thickness particularly thin, and thus a circuit configuration for such a purpose can be obtained. It goes without saying that the circuit connection between the circuit board 40 and the printed wiring board 35 is made by the surrounding electrodes 12.

An embodiment of the third invention of the present invention is shown as a side sectional view in each of FIGS. 10 (a) and 10 (b).
According to FIG. 7A, the circuit units 20 and 20a are stacked in parallel in four stages by using four connection devices 10 of the circuit units. Of course, in the lower three-stage circuit unit 20a, only the lower circuit component 22 is mounted and mounted without mounting the circuit component on the upper side, and the overall thickness is reduced. An upper circuit component 21 is mounted and mounted on the uppermost circuit unit 20.

As for the circuit connection of each circuit unit 20, 20a, various connections can be made through the connection device 10 of the circuit unit, and of course parallel connection or connection between arbitrary circuit units 20, 20a and printed wiring board. You can also connect between 35. Also in this embodiment, the second shown in FIG.
The invention can be applied to any place. Note that the number of stacked layers can be set arbitrarily.

According to FIG. 2B, the circuit unit 20 shown in FIG. 1 is laminated in three stages via the circuit unit connecting devices 10 and 10a, but the upper two stage circuit unit connecting device 10a is on the upper side. The height of the circuit component 21 to which the height is added is used. Therefore, the internal space 15 of the connection device 10a of the circuit unit is a storage area including the upper circuit component 21.

Also in this embodiment, it is possible to connect between the arbitrary circuit units 20 and between the printed wiring boards 35,
The combination with the second invention of FIG. 9 as well as the combination with that of FIG. (A) can be arbitrarily applied and implemented. Similarly, the number of stacked layers can be arbitrary.

[0048]

As described above in detail, according to the circuit unit connecting device of the present invention, the circuit unit to be mounted and connected can be connected to the lower circuit unit or the printed wiring board at the shortest distance, and its mounting. The height can be very low. Since mechanical connection strength can be obtained by connecting electrodes at multiple points, it is not necessary to use reinforcing means such as screwing.

According to the circuit module using the connection device of this circuit unit, since the circuit configuration is housed in the internal space of the frame-shaped connection device, various applications other than high-density mounting, for example, high-performance shield shielding are performed. It can be easily realized.

According to the present invention, the various embodiments may be combined not only individually but arbitrarily and as needed. As described above, according to the present invention, it is possible to carry out the invention in accordance with the demand for miniaturization and thinning, and its practical effect is extremely remarkable.

[Brief description of drawings]

FIG. 1 is an embodiment of the present invention.

FIG. 2 is a method for manufacturing a circuit unit connection device.

[Figure 3] Relationship with printed wiring board

FIG. 4 Mounting method on printed wiring board

FIG. 5: Method of manufacturing circuit unit (No. 1)

FIG. 6 is a circuit unit manufacturing method (2).

FIG. 7: Method of manufacturing circuit unit (Part 3)

FIG. 8: Aspects of electrodes of connection device of circuit unit

FIG. 9: One embodiment of the second invention of the present invention

FIG. 10: One embodiment of the third invention of the present invention

FIG. 11 Conventional circuit module

[Explanation of symbols]

 10 Circuit Unit Connection Device 11 Frame-shaped Substrate 12 Electrode 15 Internal Space 20 Circuit Unit 21, 22 Circuit Components 23 Electrode 35 Printed Wiring Board 36 Connection Pattern 38, 39 Solder Paste 40 Circuit Board 41 Solder Paste 42 Adhesive 45 Solder Paste 47 Adhesive 50 Electrodes 53, 56 Ground layer

Claims (2)

[Claims] 1. A plurality of electrodes (12) connecting in the thickness direction are formed around a frame-shaped substrate (11), and electrodes (around the circuit unit (20) mounted on the frame-shaped substrate ( 23)
The circuit unit can be connected to the circuit under the frame-shaped board by connecting the above-mentioned circuit board, and the accommodation area for the circuit component (22) mounted on the circuit unit in which the frame-shaped board internal space (15) is mounted. A device for connecting a circuit unit, characterized in that 2. A circuit unit connection device (10) having a plurality of electrodes (12) for connecting in the thickness direction around a frame-shaped substrate (11), and a circuit component (2) at least on the lower surface.
2) and a circuit unit (20) mounted and connected on the connection device, and the frame-shaped board internal space (15)
A circuit module, characterized in that the circuit component (22) is housed therein.