JP2002076629A - Compound multilayer interconnection board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To a compound multilayer interconnection board for reducing stress that is applied to a connection section (the connection section of electronic component elements and that of a multilayer substrate) due to thermal expansion and shrinkage by ambient temperature change, and improving thermal shock resistance. SOLUTION: The compound multilayer interconnection board comprises a ceramic circuit board 1 where the electronic component elements 3 are mounted to one main surface and an electrode pad 14 for connection is formed on the other main surface, and a glass epoxy circuit board 2 where an external terminal electrode 23 is formed on the end face and an electrode pad 22 for connection is formed on one main surface. The other main surface of the ceramic circuit board 1 is joined to one main surface of the glass epoxy circuit board 2 via an insulating adhesive 4 so that the electrode pad 14 for connection of the ceramic circuit board 1 is electrically connected to the electrode pad 22 for connection of the glass epoxy circuit board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite multilayer wiring board constituting high-frequency module components such as a voltage-controlled oscillator and an antenna filter used in communication equipment, particularly a mobile communication device.

[0002]

2. Description of the Related Art A voltage controlled oscillator will be described as an example of a conventional high frequency module component with reference to the drawings. The voltage controlled oscillator shown in FIG. 5 includes a multilayer wiring board 70 and a shield case 72. On a surface of the multilayer wiring board 70, various electronic component elements (not shown in the figure) such as a wiring pattern 73 for connecting a predetermined circuit and a resistor, a capacitor, a transistor, etc., which are connected to the wiring pattern 73 are mounted. The multilayer wiring board 70 includes insulating layers 71 a to 71 c made of a ceramic layer or a glass epoxy layer,
It comprises a predetermined wiring pattern (not shown in the figure) disposed between the layers 1a to 71c, and a via-hole conductor 74 penetrating in the thickness direction of the insulating layers 71a to 71c.

On the side surface of the multilayer wiring board 70, a semicircular end surface through-hole conductor is formed. The semicircular end surface through-hole conductor is used as an external terminal electrode 75.

The external terminal electrode 75, which is an end face through-hole electrode, and a predetermined wiring pattern are connected to a wiring pattern formed inside a predetermined inside or a wiring pattern formed on the surface.

[0005] A shield case 72 is provided on the surface of the multilayer wiring board 70, that is, on the component mounting surface so as to cover various electronic component elements.

A part (extended portion) 77 of the shield case 72 is arranged and connected to the external terminal electrode 75 at the ground potential. The periphery of the opening of the shield case 72 is the multilayer circuit board 7.
0 is in contact with the surface. A cutout 76 is formed at a portion where the wiring pattern 73 formed on the surface and the periphery of the opening of the shield case 72 intersect so as not to short-circuit with the wiring pattern 73.

[0007] Such a multilayer circuit board is manufactured as follows. The circuit board is shown as an example using a ceramic layer as an insulating layer.

First, a green sheet to be each of the ceramic layers 71a to 71c is prepared. The green sheet is
The shape is such that a plurality of substrate regions can be obtained by final cutting or division.

Next, a through-hole serving as a via-hole conductor or a semicircular through-hole conductor is formed in each ceramic green sheet by punching or the like. After that, on each ceramic green sheet, a conductor film serving as a predetermined wiring pattern,
A conductor member serving as a via-hole conductor and a conductor member of a conductor attached to the inner wall surface of the through hole are formed by a printing method of a conductive paste.

Then, each ceramic green sheet is
In accordance with the stacking order of the multilayer substrates 70, the laminated substrates in the large unfired state are formed by layering. Then, each multilayer circuit board 70
A dividing groove is formed in accordance with the region, and a baking process is performed.

After that, a division process is performed, predetermined electronic components are mounted on the surface of the substrate, and the shield case 72 is covered and joined. The dividing process may be performed after a predetermined electronic component is mounted on the surface of the substrate and the shield case 72 is covered. In the case of a laminated board made of glass epoxy,
The substrate is etched to form a circuit pattern. Apply and cure prepreg on the upper or lower surface of this substrate,
Copper is deposited on this surface by etching or electroless copper plating to form a circuit pattern, and at the same time, a through hole or a via hole with the lower layer is formed, which will later become an internal through hole. The application of the prepreg is repeated until the required number of layers is formed, thereby forming a plurality of parent substrates. Next, through-hole plating is performed on the divided portion of the parent substrate to form external terminal electrodes.

[0012]

However, the conventional multilayer circuit board has the following problems.

Many of the electronic component elements mounted on a multilayer substrate are made of ceramic such as a chip resistor or the like based on a multilayer ceramic capacitor or a ceramic substrate. When a glass epoxy substrate is used as a substrate material, these ceramics are used. There is a large difference in thermal expansion between the material and a resin material represented by a glass epoxy substrate. For example,
The coefficient of thermal expansion of the ceramic material is approximately 6 to 8 × 10 ⁻⁶ m.
m / ° C., and the thermal expansion coefficient of the glass epoxy substrate is 11
１３13 × 10 ⁻⁶ mm / ° C.

The application of this multilayer substrate is a severe condition in which a large temperature change and severe vibration are applied to on-vehicle components such as automobiles, so that the glass epoxy multilayer substrate and each electronic component element mounted on the substrate are subjected to severe conditions. As a result, a difference in thermal expansion coefficient occurs, and the solder connection portion of each electronic component element cannot withstand a severe thermal shock test and breaks.

Further, when the multilayer wiring board is formed of a ceramic substrate, a glass epoxy board is generally used for the mounting board in general, and the outside of the multilayer wiring board is caused by thermal expansion and contraction between the mounting board and the multilayer wiring board. Disconnection occurs at the solder connection at the terminal electrode.

The present invention has been devised in view of the above-described problems, and is intended to reduce stress on connection portions (connection portions of electronic component elements and connection portions of a multilayer substrate) due to thermal expansion and contraction due to a change in ambient temperature. It is an object of the present invention to provide a composite multilayer wiring board capable of reducing heat resistance and improving thermal shock resistance.

Another object of the present invention is to provide a composite multilayer wiring board having a structure capable of improving productivity.

[0018]

According to the present invention, there is provided a ceramic circuit board having an electronic component element mounted on one main surface and connection electrode pads formed on the other main surface, and external terminal electrodes formed on an end surface. A glass epoxy circuit board having a connection electrode pad formed on one main surface thereof, wherein the ceramic circuit board is brought into contact with the connection electrode pad of the glass epoxy circuit board to contact the ceramic circuit board. A composite multilayer wiring board characterized in that the other main surface of the substrate and one main surface of the glass epoxy circuit board are joined via an insulating adhesive.

According to a second aspect of the present invention, the external dimensions of the glass epoxy circuit board are such that a blank area is formed on the outer peripheral portion of the other main surface of the ceramic circuit board when the glass epoxy circuit board is joined to the ceramic circuit board. That is, it is smaller than the external dimensions of the ceramic circuit board.

According to a third aspect of the present invention, there is provided at least one of a connection electrode pad formed on the other main surface of the ceramic circuit board and a connection electrode pad formed on one main surface of the glass epoxy circuit board. Means that the substrate is formed of a conductor film having a predetermined thickness.

According to the present invention, the upper circuit board on which the electronic component elements are mounted is formed of a ceramic circuit board, and the lower circuit board having external terminal electrodes is formed of a glass epoxy board.

For this reason, since the portion to be bonded to the mounting board (glass epoxy board) is the lower glass epoxy board, even at severe temperature conditions, the connection portion between them is
Cracks and peeling do not occur, and stable bonding can be maintained.

Further, since the electronic component element is mounted on the upper ceramic circuit board, cracks and peeling do not occur at the connecting portion of the electronic component element even under severe temperature conditions, and stable bonding can be maintained.

The electrical connection between the two circuit boards is made by connecting the connection electrode pads formed on the other main surface of the ceramic circuit board with the connection electrode pads formed on the one main surface of the glass epoxy circuit board. Because of the contact connection, stable connection can be maintained even under severe temperature change conditions.

In addition, the two circuit boards are joined by using an insulating adhesive material interposed at a portion (a wide area between the substrates) excluding the connection electrode pads. Thus, by adhering substantially the entire surface between the two substrates, even if a severe thermal shock is received, the stress can be dispersed over the entire surface of the substrate, and the reliability of mechanical bonding can be improved.

Further, as in the second aspect, the outer dimensions of the ceramic circuit board are slightly larger than the outer dimensions of the glass epoxy circuit board. That is, in the manufacturing process of the ceramic circuit board, a large-sized ceramic substrate from which a plurality of circuit board areas can be extracted is used, and a glass epoxy board is pressed and adhered to the other main surface of each circuit board area with an insulating adhesive interposed therebetween. When this is done, the excess insulating adhesive can protrude into the margin area on the outer periphery of the other main surface of the ceramic circuit board. Accordingly, a stable connection between both circuit boards can be made without the presence of an insulating adhesive between the contact between the connection electrode pads of both circuit boards. In addition, since the dividing groove or cutting line of the large ceramic substrate is located in this blank area, even if the glass epoxy substrate is attached to the other main surface of each circuit element region of the large ceramic circuit board, the dividing of the large ceramic substrate can be performed. Alternatively, since the substrate can be handled as one large substrate up to the cutting process, the production efficiency is improved.

Further, since one or both of the connection electrode pads which are in contact with each other are conductor films protruding from the main surface of the substrate, the contact between the two conductor films is stabilized. However, as a result of contact between the two electrode pads, a gap is generated between the two circuit boards corresponding to the thickness of the protruding conductor film. Since the insulating adhesive is interposed in the gap, the adhesive layer has a sufficient thickness, and the stress due to the difference in the thermal expansion coefficient is easily absorbed.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a composite multilayer circuit board according to the present invention will be described in detail with reference to the drawings.

FIG. 1 is an external perspective view of a composite multilayer wiring board of the present invention, FIG. 2 is a partial structural cross-sectional view, and FIG. 3 is a partial structural exploded view. . The composite multilayer wiring board 10 includes, for example, a ceramic circuit board 1 having a two-layer structure and a glass epoxy board 2 having a single-layer structure. The ceramic circuit board 1 is composed of ceramic layers 1a and 1b, and an internal wiring pattern 11 is arranged between the layers. A via-hole conductor 12 is formed in the thickness direction of each of the ceramic layers 1a and 1b. A wiring pattern 13 on the front surface is formed on one main surface (front surface) of the ceramic circuit board 1. Electronic component elements 3 such as a multilayer ceramic capacitor, a chip resistor based on a ceramic substrate, and a transistor are connected to the wiring pattern 13 on the surface via, for example, solder 31 or the like. Further, a connection electrode pad for electrically connecting to the glass epoxy circuit board 2 disposed on the lower side is provided on the other main surface (back side: a bonding surface to be joined to the glass epoxy circuit board 2) of the ceramic circuit board 1. 14 is formed.

The glass epoxy circuit board 2 is made of, for example, one glass epoxy layer, and one main surface of the glass epoxy circuit board 2 (the bonding surface to be bonded to the ceramic circuit board 1) has a wiring. A pattern 21 is formed. Part of the wiring pattern 21 is used as a connection electrode pad 22. The planar outer dimensions of the glass epoxy circuit board 2 are different from those of the above-described ceramic circuit board 1 in the X direction and Y direction.
Both directions are slightly shorter and slightly smaller in shape. As a result, a blank area Z is formed on the outer periphery of the other main surface of the ceramic circuit board 1.

A semicircular recess penetrating in the thickness direction of the substrate is formed on the end surface of the glass epoxy circuit board 2,
In addition, a plurality of through-hole conductors 23 having a conductor film attached thereon are formed therein. This through-hole conductor 23
Are used as external terminal electrodes connected to the external mounting substrate 40 shown in FIG.

This external terminal electrode 23 is connected to a wiring pattern 21 formed on one main surface of the glass epoxy substrate 2.

The glass epoxy substrate 2 may be used as a laminated substrate composed of a plurality of glass epoxy layers. In this case, a wiring pattern constituting a predetermined circuit network and a wiring pattern for generating a predetermined function are arranged between the layers, and the external terminal electrodes 23 can be electrically connected to each other by the wiring patterns between the layers. . Further, a through-hole conductor that penetrates through the thickness direction of each insulating layer may be formed. Here, in the ceramic circuit board 1, each of the insulating layers 1a to 1c
The via-hole conductor penetrating through the through hole is formed by a conductor member packed in the through hole. In the glass epoxy circuit board 2, the conductor penetrating through the substrate in the thickness direction is a through hole in which a conductor film is applied to the inner wall of the through hole. It is formed of a conductor.

The ceramic circuit board 1 and the glass epoxy circuit board 2 are connected to a connection electrode pad 14 formed on the other main surface of the ceramic circuit board 1 and a connection electrode pad formed on one main surface of the glass epoxy circuit board 2. The electrode pads 22 are brought into contact with each other, for example, via an insulating adhesive 4 such as an epoxy resin containing no inorganic filler, which is applied while avoiding the connection electrode pads 22 on one main surface of the glass epoxy circuit board 2. The two circuit boards 1 and 2 are joined together.

On the surface of the ceramic circuit board 1,
A shield case 5 that covers each of the electronic component elements 3 and the wiring patterns 13 is arranged, thereby forming the composite multilayer wiring board 10 shown in FIG.

The shield case 5 is connected and fixed to the wiring pattern 13 of the ground potential formed on the surface of the ceramic circuit board 1 via solder or the like.

The composite multilayer wiring board 10 is formed as follows.

First, a large ceramic circuit board from which a plurality of ceramic circuit boards 1 can be extracted is formed.

For example, a large ceramic green sheet serving as the ceramic layer 1a and a large ceramic green sheet serving as the ceramic layer 1b are prepared, and a through hole serving as the via hole conductor 12 is formed in each circuit board region of each green sheet. Form. Next, a conductive paste is supplied to the through holes of each circuit board region of the green sheet by printing a conductive paste, and a conductive film to be the wiring patterns 11 and 12 is formed on the surface thereof by printing the conductive paste. next,
Each green sheet is laminated to form a large unfired substrate, and a division groove is formed according to the area of each ceramic circuit board 1. Thereafter, for example, a conductive film to be the connection electrode pad 14 is formed on the other main surface of the large green circuit board by printing a conductive paste. Then, by firing, a large-sized ceramic circuit board from which a plurality of ceramic circuit boards 1 can be extracted is completed. Further, the glass epoxy substrate 2 is formed in another process. In a large-sized glass epoxy board on which a copper foil is stretched, an excess copper foil is removed by etching according to a wiring pattern 21 and a connection electrode pad 22 according to a predetermined circuit network. Further, a circular through hole and a semicircular concave portion on the side surface of the glass epoxy circuit board 2 and an external terminal electrode 23 made of a conductive film are formed in advance at a boundary portion to be each glass epoxy circuit board 2. A copper foil is formed on the inner surface, and nickel plating and gold plating are performed as necessary. Thereafter, a cutting process is performed for each area of each glass epoxy circuit board 2.

Here, the connection electrode pads 14 on the other main surface of the large-sized ceramic circuit board serving as the ceramic circuit board 1
Is formed after the green sheets are laminated and pressed, the thickness thereof is about 5 to 10 μm from the surface of the substrate.

Then, the connection electrode pad 22 formed on one main surface of the glass epoxy circuit board 2 is brought into contact with the connection electrode pad 14 in each circuit board region on the other main surface of the large-sized ceramic circuit board. An electrical connection is obtained between the circuit boards 1 and 2, and an insulating adhesive such as an epoxy resin containing no inorganic filler such as glass is interposed between the two circuits 1 and 2, and the circuit is heated in a pressurized state.

As a result, the adhesive interposed between the circuit boards 1 and 2 has a reduced viscosity, and the electrode pads 14 and 22 for connection are used.
Between the circuit boards 1, 2
This achieves substantially the entire surface adhesion except for the contact portions of the connection electrode pads 14 and 22. In this manner, the ceramic substrate and the glass epoxy substrate can be bonded and bonded with the insulating heat-resistant resin.

That is, the cut glass epoxy circuit boards 2 are adhered to the respective circuit board areas on the other main surface of the large ceramic circuit board.

Next, various electronic component elements 3 are mounted on one main surface of each circuit board area of the ceramic circuit board 1.
Solder by reflow soldering method. In addition, if necessary, the wiring pattern 13 that performs a functional operation is trimmed to adjust characteristics, and adjustment processing of various variable electronic components is performed. Further, the shield case 5 covers and fixes the electronic component elements 3 and the wiring patterns 13.

After that, the large ceramic circuit board is divided into the ceramic circuit boards 1 along the dividing grooves.

As a result, it is possible to obtain a composite multilayer wiring board 10 in which the glass epoxy circuit board 2 is adhered to the other main surface of each ceramic circuit board 1.

The composite multilayer wiring board 10 thus obtained
As shown in FIG. 4, is solder-bonded to a predetermined wiring pad 41 formed on the mounting board 40 by a solder. Specifically, solder cream is printed on an appropriate portion of the wiring pattern 41 of the mounting board 40, and then the external electrodes 23 of the composite multilayer wiring board are arranged so as to be positioned after printing the clean solder. After that, other electronic components are mounted on the mounting board 40 and are mounted through a reflow soldering process.

In the structure described above, in the present invention, the upper circuit board on which the electronic component elements 3 are mounted is constituted by the ceramic circuit board 1, and the lower circuit board electrically connected to the ceramic circuit board 1. The board is made of a glass epoxy circuit board 2. Then, the external circuit is joined to the external circuit by an external terminal electrode 23 formed on the end face of the glass epoxy circuit board 2.

For this reason, it is mounted on a glass epoxy substrate which is diversified as the mounting substrate 40, and even under severe temperature conditions, the external terminal electrodes 23 and their solder joints caused by the difference in the coefficient of thermal expansion are formed on the external terminal electrodes 23. Cracks and peeling do not occur in the portion 41, and stable joining can be maintained.

Further, since the electronic component element 3 is mounted on the ceramic circuit board 1, even under severe temperature conditions, cracks or peeling does not occur at the connection portion of the electronic component element 3, for example, at the joint of the solder 31, and the electronic component element 3 is stable. Maintained bonding can be maintained.

The circuit boards 1 and 2 are electrically connected to each other by connecting electrode pads 14 formed on the other main surface of the ceramic circuit board 1 and on one main surface of the glass epoxy circuit board 2. Because of the contact connection with the connection electrode pad 22, stable electric connection can be maintained even under severe temperature change conditions.

The circuit boards 1 and 2 are joined by using an insulating adhesive 4 interposed at a portion (a wide area between the substrates) excluding the connection electrode pads 14 and 22. Thus, by adhering substantially the entire surface between the substrates 1 and 2, even if a severe thermal shock is received, the stress can be dispersed over the entire surface, and the reliability of mechanical joining can be improved.

The outer dimensions of the ceramic circuit board 1 are smaller than the outer dimensions of the glass epoxy circuit board 2.
It is getting bigger. That is, a large-sized ceramic substrate from which a plurality of circuit board regions can be extracted in a manufacturing process of the ceramic circuit board 1 is used, and a glass epoxy board 2 is attached to the other main surface of each circuit board area with an insulating adhesive 4 interposed therebetween. At the time of (heat-compression bonding), the surplus insulating adhesive 4 can protrude into the margin region Z on the outer periphery of the other main surface of the ceramic circuit board 1.

Thus, the connection between the connection electrode pads 14 and 22 of the circuit boards 1 and 2 can be reliably performed. Further, since the division or cutting line of the large ceramic substrate is located in this margin, even if the glass epoxy substrate 2 is adhered to the other main surface of each circuit element region of the large ceramic circuit board, the division of the large ceramic substrate will not occur. Alternatively, since the processing up to the cutting process can be handled as one large substrate, the production efficiency is high.

Since the ceramic circuit board 1 on which the electronic component elements 3 are mounted is slightly larger, a sufficient component mounting area can be secured. At the same time, since the glass epoxy circuit board 2 is slightly smaller, the mounting area occupied by the mounting board 40 can be reduced.

Further, one of the connection electrode pads which are in contact with each other, for example, the connection electrode pad 14 on the ceramic circuit board 1 side is a conductor film projecting from the other main surface of the circuit board 1 by 5 to 10 μm. , Both electrode pads 14, 22
Can be stably contacted.

Moreover, as a result of the contact between the electrode pads 14 and 22, a gap is generated between the circuit boards 1 and 2 corresponding to the protruding thickness. The insulating adhesive 4 is interposed in this gap. That is, the adhesive layer has a sufficient thickness, and the stress due to the difference in thermal expansion coefficient is easily absorbed.

When soldered to the mounting board 40, the solder fillet formed on the external terminal electrodes 23 is concealed in a blank space of the ceramic circuit board 1 in a planar manner, so that the solder fillet is occupied on the mounting board 40. Since the area is small and strong mounting is possible, and an impact is hardly applied to the solder joint from the outside, there is no deterioration.

Next, an embodiment of an antenna switching module using the composite multilayer wiring board of the present invention as another example of a high-frequency module will be described. The antenna module is a switch module for switching and using an antenna between the transmission module and the reception module, and has a large circuit configuration including a switch and a filter.

In the case of the antenna module, a switch circuit is formed by mounting electronic components 3 such as a PIN diode on the upper ceramic circuit board 1. A filter pattern of a strip line is formed on the lower glass epoxy circuit board 2. At this time, the frequency of the filter can be adjusted at the stage of the glass epoxy circuit board 2 on the lower side. In this way, necessary processing such as trimming can be performed when the lower glass epoxy circuit board 2 is formed, and processing can be performed independently of the formation of the upper ceramic circuit board 1.

As a result, after the ceramic circuit board 1 and the glass epoxy circuit board 2 are bonded to each other, the adjustment of the characteristics and the trimming can be omitted or a very small trimming can be completed.

The lower glass epoxy circuit board 2
When a filter pattern is formed by a strip line, and a switch circuit is formed by mounting an electronic component element 3 such as a PIN diode on an upper ceramic circuit board 1, a filter by a strip line is used. Is shielded from the outside by the circuit of the ceramic substrate, and the shield case 5 becomes unnecessary depending on the module. Thereby, the substrate area can be further reduced.

Further, since the upper ceramic circuit board 1 can be used in common, a glass epoxy circuit board 2 (having different characteristics and frequencies by changing the filter pattern) to be attached to a large ceramic board is selected. By combining them, the members can be shared and the mass production effect can be enhanced.

In the above embodiment, the connection electrode pads 14 on the ceramic circuit board 1 side have a substantial thickness, but the connection electrode pads 22 on one main surface of the glass epoxy circuit board 2 side. May also be made to protrude from the main surface of the substrate.

[0064]

As described above, according to the composite multilayer wiring board of the present invention, the ceramic circuit board and the glass epoxy circuit board are bonded together. The ceramic circuit board on which the electronic component element is mounted and the glass epoxy circuit board on the side mounted on the mounting board are formed. As a result, it is possible to effectively suppress the deterioration of the joint, that is, the soldered portion due to the difference in the coefficient of thermal expansion between the ceramic circuit board and the electronic component element and between the glass epoxy circuit board and the mounting board.

The ceramic circuit board is a large-sized board as compared with the glass epoxy circuit board. Moreover,
It does not have external terminal electrodes. For this reason, the component mounting surface of the electronic component element can be widely used, the mounting area is small, and the number of component mounting points can be increased.
The composite multilayer wiring board is small and can be mounted at high density.

Also, since at least one of the connection electrode pads connected to each other protrudes from the substrate by a predetermined thickness, the electrical connection between the two can be ensured, the stable electrical connection can be maintained, and the physical connection can be maintained. Since an insulating adhesive can be interposed in the gap to be formed, a stable mechanical joining is achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a composite multilayer wiring board of the present invention.

FIG. 2 is a partial cross-sectional view of the composite multilayer wiring board of the present invention.

FIG. 3 is an exploded sectional view of a portion corresponding to FIG. 2;

FIG. 4 is a partial side view when mounted on a mounting board of the present invention.

FIG. 5 is a perspective view of a conventional multilayer wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic circuit board 2 Glass epoxy circuit board 3 Electronic component 4 Insulating adhesive material 5 Shield case 11 Internal wiring pattern 12 Via hole conductor 13 Surface wiring pattern 14 Connection electrode pad on ceramic circuit board side 21 Glass epoxy circuit board side Wiring pattern 22 Connection electrode pad on glass epoxy circuit board side 40 Mounting board

Claims (3)

[Claims] 1. A ceramic circuit board having an electronic component element mounted on one main surface and a connection electrode pad formed on the other main surface, and an external terminal electrode formed on an end surface, and a connection electrode formed on one main surface. A glass epoxy circuit board formed with a pad, wherein the connection electrode pad of the ceramic circuit board and the connection electrode pad of the glass epoxy circuit board are brought into contact with each other, and the other main surface of the ceramic circuit board and the A composite multilayer wiring board wherein one main surface of a glass epoxy circuit board is joined via an insulating adhesive. 2. The external dimensions of the glass epoxy circuit board are such that when joined to the ceramic circuit board, a blank area is formed on the outer peripheral portion of the other main surface of the ceramic circuit board. 2. The composite multilayer wiring board according to claim 1, wherein the composite multilayer wiring board is smaller than an external dimension. 3. The connection circuit according to claim 1, wherein at least one of the connection electrode pad formed on the other main surface of the ceramic circuit board and the connection electrode pad formed on one main surface of the glass epoxy circuit board is connected to the main board. 2. The composite multilayer wiring board according to claim 1, wherein the surface is formed of a conductive film having a predetermined thickness.