JPH05315835A - Voltage controlled oscillator and manufacture thereof - Google Patents

Abstract

PURPOSE:To miniaturize and to reduce cost without deteriorating a carrier versus signal ratio by mounting electronic components on an upper side of a board, overlapping other board with a dielectric resonator accommodated thereon on its lower side and laminating both boards. CONSTITUTION:Electronic components 7, 7... are mounted to an upper side 1a of a board 1 and a board 2 is overlapped onto its lower side. A throughhole 20 with a dielectric resonator 3 accommodated therein is formed to a board 2 and the dielectric resonator 3 is mounted therein. The boards 1, 2 are overlapped to form a lamination structure. As a result, it is not required to mount the dielectric resonator 3 on the same face of the electronic components 7, 7... and the size of the voltage controlled oscillator is reduced by the mount area of the dielectric resonator 3. Furthermore, the boards 1, 2 are simply laminated, the lamination man-hour is halved especially when a ceramic is employed for a material type of the boards, and the manufacture cost is remarkably reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a voltage controlled oscillator suitable for a local oscillator of a mobile communication device and a manufacturing method thereof.

[0002]

2. Description of the Related Art Recently, mobile communication devices such as mobile phones and car phones have been used for various purposes. This mobile communication device is equipped with a voltage controlled oscillator for transmitting or receiving a carrier wave. FIG. 6 is a top perspective view of a surface mount type voltage controlled oscillator using a coaxial dielectric resonator, and FIG. 7 is a bottom view thereof. Circuit patterns 33, 33 made of conductors are formed on the upper surface 31a of the ceramic substrate 31, and the coaxial dielectric resonator 32 and resistors, capacitors, transistors are formed across the circuit patterns 33, 33. , Electronic components 34 such as diodes are mounted. Through-holes 35, 35 ... Are formed at predetermined positions in the circuit patterns 33, 33 ... Near the long side of the ceramic substrate 31. As shown in FIG. 7, the lower surface of the ceramic substrate 31 is separately connected to the through holes 35, 35, ... Of FIG. 6 at the positions where the through holes 35, 35 ,. A terminal electrode 62 for connecting with is formed.

A surface mount type voltage controlled oscillator using such a coaxial type dielectric resonator is manufactured as follows. Through holes on green sheet 35,35…
After providing a through hole corresponding to, using a conductor paste,
Circuit patterns 33, 33, terminal electrodes 62 and through holes 35, 35 are printed on a green sheet and sintered to form a ceramic substrate 31. Next is the circuit pattern
33,33… By printing cream solder on top of it, mounting resistors, capacitors, transistors, diodes and other electronic parts 34,34… and coaxial dielectric resonator 32, and passing the solder through a reflow furnace to melt the solder. , Electronic components 34, 34, and the dielectric resonator 32 are mounted.

FIG. 8 is an exploded top perspective view of a surface mount type voltage controlled oscillator using a stripline resonator. This voltage-controlled oscillator has a structure in which printed wiring layers 41, 42, 43, 44 are laminated, and circuit patterns 46, 46 ... Of conductors are formed on the upper surface 41a of the printed wiring layer 41, and these circuits are formed. Electronic components 45, 45, etc., such as resistors, capacitors, transistors, diodes, etc. are mounted over the patterns 46, 46. Circuit patterns 46, 4 near the long side of the printed wiring layer 41
Through holes 48, 48 are formed at predetermined positions of 6 ...
Through holes 49a, 49b are formed near one of the short sides to connect with a strip line described later. Through holes 51, 51 are formed on the upper surface 42a of the printed wiring layer 42 at positions facing the through holes 48, 48, and through holes 52 are formed at positions facing the through holes 49a, 49b.
a, 52b are formed. A ground electrode 50 made of a conductor is formed on the entire upper surface 42a of the printed wiring layer 42, not including the through holes 51, 51 ... And 52a, 52b.

A substantially U-shaped strip line 53 is formed on the upper surface 43a of the printed wiring layer 43, one end 53a of which is the through hole 52a, and the other end 53b thereof is the through hole 52.
It extends to a position facing b, and the through hole
Through holes 54, 54 are formed at positions facing 51, 51. Through holes 57, 57, ... Are provided on the upper surface 44a of the printed wiring layer 44 at positions facing the through holes 54, 54.
Are formed. A ground electrode 58 made of a conductor is formed on the entire upper surface 44a of the printed wiring layer 44, not including the through holes 57, 57 ... These printed wiring layers 41, 42, 43, 4
If 4 are stacked, the end 53a of the strip line 53,
53b is through hole 52a, 52b and through hole 49a, 49b
The circuit pattern 4 formed on the upper surface of the printed wiring layer 41 by
It is connected to 6,46 to form a stripline resonator. Further, on the lower surface of the printed wiring layer 44, through holes 57, 57 ...
The terminal electrode (not shown) formed in the unit is
7,57… and through holes 54,54… and through holes 51,51…
And through hole 48,48… and circuit pattern 46,46…
Connected with. In addition, the upper surface of the printed wiring layer 41, the printed wiring layer 43
The upper surface and the lower surface of the printed wiring layer 44 are shielded from high frequency electromagnetic waves by the ground electrodes 50 and 58.

A surface mount type voltage controlled oscillator using the above stripline resonator is manufactured as follows. Through holes 48, 48 ..., through holes 49 are formed in the respective green sheets forming the printed wiring layers 41, 42, 43, 44.
a, 49b, through hole 51,51…, through hole 52a, 52b,
Through holes for forming the through holes 54, 54 and the through holes 57, 57 are provided.

Circuit patterns 46, 46 ... Are printed on the upper surface of the green sheet forming the printed wiring layer 41 by using a conductor paste. Similarly, a conductor paste is used for the green sheet forming the printed wiring layers 42, 43, 44, and the ground electrode 50, the strip line 53, the ground electrode 58, the terminal electrode (not shown) on the lower surface of the printed wiring layer 44, the through holes 48, 48 ... , Through holes 49a, 49b
, Through holes 52a, 52b, through holes 54, 54, and through holes 57, 57 are printed. Next, the green sheets forming the printed wiring layers 41, 42, 43, 44 are pressure-bonded and sintered to form the printed wiring layers 41, 42, 43, 44 of the surface mount type voltage controlled oscillator shown in FIG. The circuit pattern 46, 46 ... of the printed circuit board is printed with cream solder, and the electronic parts 45, 45 ... such as resistors, capacitors, transistors, and diodes are mounted, and the solder is melted by passing through a reflow furnace. Implement 45 ...

[0008]

However, in the conventional voltage controlled oscillator shown in FIG. 6, the coaxial dielectric resonator 32 is used.
However, there is a problem that a large area is required for mounting and the size cannot be reduced. For example, if the oscillation frequency of the voltage controlled oscillator is 80
At ₀ MHz, the resonance frequency f ₀ of the coaxial dielectric resonator 32 is
If the relative permittivity ε _r of the ceramic material used for the coaxial dielectric resonator 32 is about 1300 MHz and ε _r = 70, the resonator length can be calculated by finding 1/4 wavelength. , Λ / (4 × √ε _r ) = (c / f ₀ ) / (4 × √ε _r ) ... (1) = {3 × 10 ⁸ / (1300 × 10 ⁶ )} / (4 × √70) (2) = 6.9 × 10 ^-3 (m) (where c is the speed of light in vacuum: 3 × 10 ⁸ m / s, and f ₀ is the resonance frequency: 1300 × 10 ⁶ Hz). If the cross section of the coaxial dielectric resonator 32 is 2 mm square, the external dimensions are 2 × 2 ×
There is a problem that it becomes 6.9 mm and a large mounting area is required.

On the other hand, in the conventional voltage controlled oscillator using the stripline resonator shown in FIG. 8, the area of the substrate can be small because the dielectric resonator is not used, but since it is a multilayer substrate structure, it is laminated. There is a problem that the number of steps to be performed is large and the manufacturing cost is increased. In addition, if the stripline that constitutes the stripline resonator provided inside the substrate is to be formed only by this stripline and the oscillation frequency of the voltage controlled oscillator is 800 MHz as described above, the dielectric Resonance frequency of the resonator is 1300MH
Since it is about z, the length L of the stripline is L = λ / (4 × √ε _r ) = (c / f ₀ ) / (4 × √ε _r ) = {3 × 10 ⁸ / (1300 × 10 ⁶ )} / (4 × √4.5) = 27.2 × 10 ^-3 (m) (However, the substrate is a glass epoxy substrate and the relative permittivity ε _r
Is ε _r = 4.5. ). Since it is difficult to put a stripline of this length in the substrate due to the size problem, in practice a capacitor is inserted in parallel so that the length of this stripline can be short. Therefore, the Q of the resonator is lowered, and the C / N (carrier to noi) of the oscillator is reduced.
There is also a problem that the se ratio) deteriorates. The present invention has been made in view of the above problems, and an object thereof is to provide a voltage-controlled oscillator that can be downsized without deteriorating C / N and can reduce manufacturing cost, and a manufacturing method thereof. Especially.

[0010]

A voltage controlled oscillator according to a first aspect of the present invention is a voltage controlled oscillator in which an electronic component and a dielectric resonator are mounted, wherein the electronic component is mounted on one side and the other side is mounted on the other side. Is a first substrate on which the dielectric resonator is mounted, and a second substrate on which a space for housing the dielectric resonator is formed.
A substrate, and the dielectric resonator is housed in the space, and a first substrate and a second substrate are laminated.

A voltage controlled oscillator according to a second aspect of the present invention is a method for manufacturing a voltage controlled oscillator in which an electronic component and a dielectric resonator are mounted, and the voltage controlled oscillator is mounted on the other surface of the first substrate on which the electronic component is mounted. It is characterized in that a dielectric resonator is mounted, and then a second substrate having a space for accommodating the dielectric resonator is laminated on the first substrate.

A voltage controlled oscillator according to a third aspect of the present invention is a method for manufacturing a voltage controlled oscillator in which an electronic component and a dielectric resonator are mounted, a first substrate having the electronic component mounted on one surface, and a dielectric. Laminating with a second substrate having a space for accommodating a resonator, then inserting a dielectric resonator into the space of the second substrate, and mounting the dielectric resonator on the other surface of the first substrate. Is characterized by.

A voltage controlled oscillator according to a fourth aspect of the present invention is a method for manufacturing a voltage controlled oscillator having an electronic component and a dielectric resonator mounted thereon, wherein a circuit pattern for mounting the electronic component is formed on one surface. A first substrate and a second substrate having a space for accommodating a dielectric resonator are stacked, an electronic component is then mounted on the circuit pattern, and the dielectric resonator is inserted in the space of the second substrate. The dielectric resonator is mounted on the other surface of the first substrate.

[0014]

In the first aspect of the present invention, the electronic component is mounted on one surface of the first substrate, and the dielectric resonator is mounted on the other surface.
A space for accommodating the dielectric resonator is not required on one surface of the first substrate, a mounting area is not required, and the number of stacking steps can be reduced. According to the second aspect of the present invention, since the second substrate having the space for accommodating the dielectric resonator mounted on the other surface of the first substrate is laminated, the positioning of the second substrate is facilitated and the assembly is performed. Work can be done quickly. According to the third aspect of the present invention, after the first substrate and the second substrate are laminated, the dielectric resonator is mounted on the first substrate through the space of the second substrate. Positioning during work becomes easy. According to the fourth aspect of the present invention, the first and second substrates are laminated, the electronic components are mounted on the circuit pattern of the first substrate, and the dielectric resonator is provided on the other surface of the first substrate through the space of the second substrate. Therefore, the electronic component and the dielectric resonator are separately assembled.

[0015]

The present invention will be described in detail below with reference to the drawings showing the embodiments thereof. (Embodiment 1) FIG. 1 is an exploded top perspective view of a voltage controlled oscillator according to the present invention. Circuit patterns 8, 8 ... Made of conductors are formed on the upper surface 1a of the substrate 1, which is the first substrate, and the electronic parts 7, such as resistors, capacitors, transistors, and diodes, are formed across the circuit patterns 8, 8. 7 ... is implemented. Through-holes 5, 5, ... Are formed at predetermined positions of the circuit patterns 8, 8 ... Near the long side of the substrate 1,
A through hole 6 connected to a dielectric resonator described later is formed near one short side (right side in the drawing).

The substrate 2, which is the second substrate, has the same size as the substrate 1. At the center of the substrate 2, the long side is the substrate 2
A rectangular through hole 20 is provided which is parallel to the long side portion and forms a space for accommodating the laminated dielectric resonator 3. Terminal electrodes 12, 12, ... Are formed on the upper surface 2a of the substrate 2 at positions facing the through holes 5, 5 ,.
A ground electrode 10 made of a conductor is formed in a portion not including 12,12 .... U-shaped grooves 11, 11 ... Are formed on the side surface of the long side of the substrate 2 where the terminal electrodes 12, 12 ... Are formed.

Further, between the U-shaped grooves 11, 11 formed on the side surfaces of the long sides of the substrate 2, U-shaped grooves 15, 11 formed in the same shape as the U-shaped grooves 11, 11 ,. 15 are formed with a proper distance. Terminal electrodes 12, 12 ... on the inner surface of the U-shaped groove 11, 11 ...
A conductor connected to the U-shaped groove 15,15 ...
A conductor connected to the ground electrode 10 is formed on the inner surface of the.

The laminated dielectric resonator 3 has a rectangular parallelepiped shape and is provided with a terminal portion 14 and a ground portion 13. The terminal portion 14 is located on the upper surface and side surface on one short side. The dielectric resonator 3 is housed in a through hole 20 formed in the substrate 2 with the terminal portion 14 facing upward, and attached to the substrate 1 with a conductive adhesive. By laminating the substrate 2 on the lower surface side of the substrate 1, the terminal electrodes 12, 12, ... Are connected to the circuit patterns 8, 8 ... By the through holes 5. Further, the terminal portion 14 of the dielectric resonator 3 is connected to the circuit pattern 8 through the through hole 6 to form a voltage controlled oscillator.

FIG. 2 is a bottom view of the voltage controlled oscillator shown in FIG. 1. On the bottom surface of the substrate 2, terminal electrodes 18, 18 ... Connected to the conductors formed on the inner surfaces of the U-shaped grooves 11, 11 ,. U-shaped groove
Terminal electrode 1 connected to the conductor formed on the inner surface of 15,15 ...
9,19… are formed. These terminal electrodes 18,18
, 19, 19 are used to connect the voltage controlled oscillator to a circuit board (not shown).

When the voltage controlled oscillator is constructed in this way, it is not necessary to mount the dielectric resonator 3 on the same surface as the electronic parts 7, 7, ... Can be downsized and downsized. Also, the thickness can be reduced. For example, if the laminated dielectric resonator 3 having a thickness of 1 mm is used, the thickness of the substrate 1 is 0.6 mm, the thickness of the substrate 2 is 1 mm, and the height of a metal case (not shown) covering the upper surface of the substrate 1 is 0.6 mm. As a result, the thickness of the voltage controlled oscillator can be made as thin as 2.2 mm. Moreover, since only the substrate 1 and the substrate 2 need to be laminated, the number of laminating steps can be halved and the manufacturing cost can be significantly reduced when the substrate material is a ceramic substrate, as compared with the case where the ceramic substrates are laminated in multiple layers.

FIG. 3 is a cross-sectional view of the laminated dielectric resonator 3. The laminated dielectric resonator 3 includes a terminal portion 14, a ground portion 13, an electrode line 21 and a ceramic material 22, and the terminal portion 14 is
Electrode line 21 disposed inside the laminated dielectric resonator 3
It is connected to the grounding part 13 via.

In the laminated dielectric resonator 3, as shown in FIGS. 4 and 5, the terminal portion 24 is formed with a through hole 26 formed in the center thereof so that the electrode line 27 disposed inside the terminal portion 24 is formed. A structure in which one end is connected and the other end is connected to the ground electrode 25 through the electrode line 27 can also be used.

Next, a manufacturing process of the voltage controlled oscillator according to the present invention will be described. 1, through-holes corresponding to the through holes 5, 5 ..., Through holes 6 are provided in the green sheet, and the circuit patterns 8, 8 ..., Through holes 5, 5 ... Ceramic substrate 1 by printing and sintering
To create. The substrate 2 is a green sheet with a U-shaped groove 1
1, 11 ..., U-shaped grooves 15, 15 ... and through-holes corresponding to the rectangular through-holes 20 are provided, and silver paste is used to form terminal electrodes 12, 12 ..., ground electrodes 10, U-shaped on the green sheet. Groove 11,11 ...,
The U-shaped grooves 15, 15 ... And the terminal electrodes on the back surface of the substrate 2 (not shown) are printed and sintered to form the ceramic substrate 2.

Next, a resistor, a capacitor, a transistor are formed on the circuit patterns 8, 8 ...
Electrodes for mounting electronic parts 7, 7 ... such as diodes are printed, and electronic parts 7, 7 ... For resistors, capacitors, transistors, diodes, etc. are mounted on each, and the solder is melted by passing through a reflow furnace to produce electronic parts. The components 7, 7 ... Are mounted.
Then, the laminated dielectric resonator 3 is connected to the center of the back surface of the substrate 1.
14 is connected to the through hole 6 with the upper side, and is attached using solder or a conductive adhesive.

The substrate 2 having the same size as the substrate 1 is attached to the substrate 1 by soldering or using a conductive adhesive so that the laminated dielectric resonator 3 enters the rectangular through hole 20 and voltage is applied. Create a controlled oscillator.

(Embodiment 2) A substrate 1 is prepared in the same manner as in Embodiment 1, and electronic components 7, 7 such as resistors, capacitors and transistors are mounted over the circuit patterns 8, 8 ... The substrate 2 is also made in the same manner as in the first embodiment. Next, the substrate 2 having the same dimensions as the substrate 1 is attached to the back surface of the substrate 1 by using solder or a conductive adhesive. Then, the laminated dielectric resonator 3 is inserted into the rectangular through hole 20 of the substrate 2 and the terminal 14
Is turned upward and is inserted so as to be connected to the through hole 6, and is attached to the back surface of the substrate 1 using solder or a conductive adhesive to manufacture a voltage controlled oscillator.

(Embodiment 3) This is a method of manufacturing the substrate 1 and the substrate 2 as a multi-layer substrate when both the substrate 1 and the substrate 2 are ceramic substrates. The through holes for forming the through holes 5, 5 ... And the through holes 6 are provided in the green sheet forming the substrate 1, and the circuit patterns 8, 8 ..., Through holes 5, 5 ... And the through holes 6 are formed by using silver paste. , And U-shaped grooves 15, 15 ... And rectangular through holes 20 are provided in the green sheet forming the conductor and forming the substrate 2, and the terminal electrode 12 is formed by using silver paste. , 12 ..., U-shaped grooves 11, 11 ..., U-shaped grooves 15, 15 ... A green sheet for forming the substrate 1 by forming conductors forming the terminal electrodes and the ground electrode 10 on the back surface of the substrate 2 not shown, and After press-bonding with the green sheet forming the substrate 2, sinter-molding,
The substrate 1 and the substrate 2 are manufactured as a multilayer substrate.

After that, electronic components 7, 7 such as resistors, capacitors, transistors, diodes, etc. are mounted over the circuit patterns 8, 8 by soldering or a conductive adhesive, and through holes are formed in the back surface of the substrate 2. The laminated dielectric resonator 3 is inserted into the portion 20 with the terminal 14 facing upward, and is attached by soldering or using a conductive adhesive to produce a voltage controlled oscillator.

In Examples 1 and 2, ceramic substrates are used as the substrate 1 and the substrate 2, but the substrate 1 and the substrate 2
One or both of them may be composed of a flexible substrate made of glass epoxy. Substrate 1 in Examples 1, 2 and 3
Although the solder is used to mount the electronic components 7, 7 ... Of resistors, capacitors, transistors, diodes, etc., they may be mounted using a conductive adhesive. Also, the circuit patterns 8, 8 ...
A silver paste is used to form the ground electrode 10, the terminal electrode 12, the U-shaped grooves 11, 11 ... And the U-shaped grooves 15, 15.
A conductor paste other than the silver paste, such as a copper paste or a gold paste, may be used.

[0030]

As described in detail above, according to the first aspect of the invention, the dielectric resonator is mounted on the surface of the first substrate different from the surface on which the electronic components are mounted. The size of the voltage controlled oscillator can be reduced without requiring a mounting area. Further, as compared with the voltage controlled oscillator using the stripline resonator, since only the first substrate and the second substrate are laminated, the number of laminating steps is small and the manufacturing cost can be reduced. Furthermore, since a dielectric resonator is used, a voltage controlled oscillator with good C / N can be provided at low cost.

In the second and third inventions, the electronic component and the dielectric resonator are separately mounted on the first substrate, and the second substrate is laminated on the side on which the dielectric resonator is mounted. Therefore, it becomes easy to position each other when assembling, and the efficiency of the assembling work can be improved.

According to the fourth aspect of the invention, after the first and second substrates are laminated, the electronic components and the dielectric resonator are mounted on different surfaces, so that there is no waste in the assembly work.
Efficient assembly can be performed.

[Brief description of drawings]

FIG. 1 is an exploded top perspective view of a voltage controlled oscillator according to the present invention.

2 is a bottom view of the voltage controlled oscillator shown in FIG. 1. FIG.

FIG. 3 is a cross-sectional view of a laminated dielectric resonator.

FIG. 4 is a perspective view showing another configuration of the laminated dielectric resonator.

5 is a cross-sectional view of the laminated dielectric resonator shown in FIG.

FIG. 6 is an exploded top perspective view of a conventional voltage controlled oscillator.

FIG. 7 is a bottom view of the voltage controlled oscillator shown in FIG.

FIG. 8 is an exploded top perspective view of another conventional voltage controlled oscillator.

[Explanation of symbols]

 1, 2 substrate 3 laminated dielectric resonator 5, 6 through hole 7 electronic component 8 circuit pattern 10 ground electrode 12 terminal electrode 20 through hole 23 laminated dielectric resonator

Claims (4)

[Claims] 1. A voltage controlled oscillator having an electronic component and a dielectric resonator mounted, wherein the electronic component is mounted on one surface and the dielectric resonator is mounted on the other surface, and A second space in which a space for housing the dielectric resonator is formed
A voltage-controlled oscillator, comprising: a substrate; and a first substrate and a second substrate which are stacked so that the dielectric resonator is housed in the space. 2. A method of manufacturing a voltage controlled oscillator having an electronic component and a dielectric resonator mounted, wherein the dielectric resonator is mounted on the other surface of the first substrate having the electronic component mounted on one surface, and then the dielectric resonator is mounted. A method of manufacturing a voltage controlled oscillator, comprising: stacking a second substrate having a space for housing a body resonator on the first substrate. 3. A method of manufacturing a voltage controlled oscillator having an electronic component and a dielectric resonator mounted thereon, wherein the first substrate has the electronic component mounted on one surface, and a second space having a space for housing the dielectric resonator. A method of manufacturing a voltage controlled oscillator, comprising stacking the dielectric resonator on a substrate, then inserting a dielectric resonator into the space of the second substrate, and mounting the dielectric resonator on the other surface of the first substrate. .. 4. A method of manufacturing a voltage controlled oscillator having an electronic component and a dielectric resonator mounted thereon, comprising: a first substrate having a circuit pattern for mounting the electronic component on one surface; and a dielectric resonator. A second substrate having a space for accommodating is laminated, then electronic components are mounted on the circuit pattern, a dielectric resonator is inserted into the space of the second substrate, and the other surface of the first substrate is provided with the dielectric resonator. A method for manufacturing a voltage controlled oscillator, which comprises mounting a dielectric resonator.