JPH03165102A - Microwave circuit module - Google Patents

Abstract

PURPOSE:To save assembly man-hour and to improve the reliability and economy by stacking dielectric boards, accommodating a microwave device into a throughhole, and connecting terminals to the circuit pattern of a dielectric board to form an integrated circuit. CONSTITUTION:A microwave device 3 is accommodated for packaging to dielectric boards 11, 12 by providing a throughhole to them and terminals of the device are connected to the circuit pattern of the dielectric board 12 placed at the butted position. A strip conductor 21 and the circuit pattern are provided in addition to circuit components, throughholes 42 are formed for connection board layers and the boards are laminated integrally. Conductor patterns other than the resistors 53 are all made of the same material to constitute a thick film onto the raw board before baking, and the boards are laminated and baked integrally. Thus, miniaturization is attained, the assembly man-hour is saved and the reliability and economy are improved.

Description

[Detailed Description of the Invention] [Summary] Regarding a microwave circuit module formed by laminating dielectric plates, the present invention provides a microwave circuit module that can be downsized, reduce assembly man-hours, and improve reliability and economy. For the purpose of The dielectric plate stacked on top of the dielectric plate has strip conductors forming a microstrip line and other circuit patterns on the bottom surface.
An electrode for a capacitor or an inductance with a film structure is provided by patterning the same conductor material, and the upper surface has the same structure as the bottom surface, and a resistor with a film structure and a terminal electrode for external connection are provided. The body plates are stacked and interlayer connections are made using vias and through holes to form an integrated structure.The microwave device is accommodated in the through hole or notch, and the terminal is connected to the circuit pattern of the dielectric plate at the end. Construct an integrated circuit.

[Industrial application field]

The present invention relates to a microwave circuit module formed by laminating dielectric plates.

2. Description of the Related Art In recent years, wireless communication has made remarkable progress in both the mobile communication field and the fixed communication field due to miniaturization and improved performance.

For example, car phones, mobile phones, or home wireless phones are rapidly becoming popular.

Due to advances in dielectric materials, microwave integrated circuits used in these mobile radios have been developed with materials that have low dielectric loss, a wide range of dielectric constants, and stable temperature characteristics.
It promotes miniaturization and high performance, and is highly economical (desired).

[Conventional technology]

FIG. 2 shows a perspective view of a conventional example of a microwave circuit module.

As shown in FIG. 2, a conventional microwave circuit module has a dielectric plate 92 of an alumina substrate patterned with strip conductors 92 constituting a microstrip line and other circuit patterns 94 using the same conductive material. Further, individual components 95 such as resistors and capacitors, microwave devices 3 such as transistors, diodes, and the like are mounted and connected to the circuit pattern 94 by soldering to form a circuit.

The opposite surface of this dielectric plate 92 is closely fixed to the metal base 91 of the casing, and is completely covered and shielded by a metal cover 96.

[Problem to be solved by the invention]

However, (1) the individual components 95 are preferably in the form of small chips because of their characteristics, and there is a limit to miniaturization if this mounting is carried out manually, and a dedicated automatic mounting machine is required from the viewpoint of reliability.

(2) Also, since a large number of parts are used, it takes time to mount these parts 95, and the number of man-hours required to assemble the microwave circuit module is increased.

■ Thus, assembly requires many man-hours, and if miniaturization is prioritized, an automatic mounting machine is required, which is expensive.

There were problems such as.

In view of these problems, it is an object of the present invention to provide a microwave circuit module that can be miniaturized, reduce the number of assembly steps, and be reliable and economical.

[Means to solve the problem]

The above problems are solved as shown in Fig. 1: (1) Two dielectric plates 11 and 12 are laminated, and the lower dielectric plate 11 is a ground conductor layer 2 whose entire lower surface is metallized. A dielectric plate 12 is provided with a through hole 4 or a notch for accommodating the device 3, and has a strip conductor 21 constituting a microstrip line, other circuit patterns, and a capacitor electrode 51 on its lower surface. An inductance with a membrane configuration is provided by patterning the same conductor material, and the upper surface has the same type of configuration as the lower surface, and a resistor 53 with a membrane configuration and a terminal electrode 23 for external connection are provided.
is provided, the dielectric plates 11 and 12 are stacked and interlayer connections are made by vias and through holes 42, and the microwave device 3 is accommodated in the through hole 4 or notch, and the end This problem is solved by the microwave circuit module of the present invention, which configures a microwave integrated circuit by connecting terminals to the circuit pattern of the dielectric plate 12.

(2) Also, in the middle of the dielectric plate aυaz described in (1),
The strip conductor constituting the microstrip line, other circuit patterns, capacitor electrodes, and inductance of the membrane structure are provided on the bottom surface by patterning the same conductor material, and if necessary, through holes or cuts to accommodate the microwave device are provided. A microwave-use This problem is solved by the microwave circuit module of the present invention, which configures a microwave integrated circuit by accommodating a device in a through hole or a notch and connecting the device to a circuit pattern on an abutting dielectric plate.

[For production]

In other words, individual components such as resistors, capacitors, and inductances are made of dielectric plates with selected characteristics such as permittivity, dielectric loss, and temperature characteristics.Capacitors are made of materials with a high dielectric constant, and resistors and inductances are made of dielectric plates with selected characteristics such as dielectric constant, dielectric loss, and temperature characteristics. The desired constant can be obtained by using a material with low body loss and forming a film on a dielectric plate, or by forming a counter electrode into a film structure with a dielectric plate in between, so chip-type circuit components cannot be used. No need to worry.

Microwave devices such as transistors and diodes 3
However, it is still insufficient in terms of characteristics to form them on the dielectric plates 11.12 in the same way as the individual components, and since the same semiconductor components as the conventional ones are used, the dielectric plates 11.1 are used for this mounting.
A through-hole 4 or a notch is provided in 2 to house it, and a terminal is connected to the circuit pattern of the dielectric plate 12 at the end.

In addition to circuit components, strip conductors 21 and circuit patterns are provided on each dielectric plate 12 and the intermediate layer dielectric plate, and through-holes 42 and vias are formed for connection between the laminated layers, which are then laminated and integrally formed. be done.

For example, dielectric plates 11 and 12 made of ceramic plates are used, and all conductor layer patterns other than the resistor 53 are made of the same material.
It is possible to form a thick film on a plate in a raw state before firing, stacking these, and firing them as one body.

At this time, the resistor 53 is not provided in the internal intermediate layer, but is provided only in the uppermost layer after lamination molding, since the film material is different from other conductor materials and the manufacturing process is different, making it difficult to form an integral layer.

In this way, the completed microwave circuit module has the entire bottom surface of the bottom layer as the ground conductor layer 2, which is tightly fixed to the metal board of the unit by soldering, and the input/output wiring is connected to the terminal electrode 23 on the top surface of the top layer. and power supply wiring.

At this time, the through hole 4 in which the microwave device 3 is mounted is sealed by soldering the entire surface of the ground conductor layer 2.
The microwave device 3 may be in the form of a pair of chips without a package, and if the inside of the through hole 4 is sealed with resin, higher reliability can be easily obtained.

Moreover, the paired chips of the microwave device 3 can be extremely small, contributing to miniaturization.

In this way, it is possible to provide a microwave circuit module that can be downsized, reduce the number of assembly steps, and be reliable and economical.

〔Example〕

The present invention will be specifically described below with reference to embodiments shown in the drawings. The same reference numerals indicate the same objects throughout the figures. Figure 1 (
FIG. 1A shows a configuration diagram of an embodiment of the present invention, and FIG. 1B shows a circuit diagram thereof.

In this embodiment, two dielectric plates are laminated to form a one-stage amplifier circuit for 2 to 4 GHz, as shown in the circuit diagram of FIG. 1(b).

The input passes through a DC power cut capacitor CI and is connected to the base of the microwave device 3 via a microstrip line, and the output from the collector passes through the microstrip line and is connected to the outside via a capacitor C2.

Power is supplied to the microwave device 3 through resistors R2 and R.
A bias voltage divided by 3 is supplied to the base electrode via a series resistor R1 and an inductance, and bypass capacitors C3 and C4 are connected to each resistor terminal.

In addition, the collector voltage is supplied by a series resistor R4 and an inductance, and bypass capacitors C5C6 are connected before and after.

Therefore, this embodiment consists of four resistors, six capacitors, and one transistor.

As shown in Figure 1(a), this circuit consists of two dielectric plates II and 12 and a microwave device 3, and does not use any individual resistors or capacitors. .

Lower layer dielectric plate! 1 is 20×201!1ffl thickness 0.
A 65mm ceramic plate with a dielectric constant of about 1O, the entire bottom surface of which is metallized as a ground conductor layer 2, and an 8m layer in the center.
M-sized through holes 4 are drilled, and a 6 mm strip is left in the center, and through holes 42 are provided on the other surface at a pitch of 4 mm.

The dielectric plate 12 laminated on the dielectric plate 11 has a size of 20×2
011Iffl A ceramic plate with a dielectric constant of about 30 and a thickness of 0.3 aun.The lower surface has a ground conductor layer 2 on the left and right surfaces, leaving a 6 mm strip in the center, and two strip conductors 21 on the center line of the strip. Electrodes 51 for capacitors CI and C2 are formed in a conductive pattern at the ends, and on the top surface, corresponding to capacitors C1 and C2, a portion extends to the edge of the dielectric plate 12 and serves as a terminal electrode 23 for input/output. Capacitor electrode 5
1, and a capacitor C3 in the left and right ground conductor layer 2 areas, respectively.
, the electrode 51 for the capacitor C4, and the electrode 51 for the capacitor C5, and the electrode 51 for the capacitor C6, which is partially protruded to serve as a terminal electrode 23 for external connection, and the electrode 5 for the capacitors C3 and C5.
1 through holes 42 provided in each strip conductor 21
, a thick film resistor (R1) 53 between capacitors C3 and C4, a resistor (R4) between capacitors C5 and C6, and a resistor (R3) between capacitors C4 and C6.
A resistor (R2) is formed between the capacitor C4 and the through hole 42 provided in the ground conductor layer 2.

Both dielectric plates II and 12 are overlapped in a raw state before firing and fired to form an integral body. However, each resistor is formed into a film after lamination is formed.

Thereby, the ground conductor layer 2 of the dielectric plate 12 is connected to the ground conductor layer 2 on the lower surface via the through hole 42 of the dielectric plate 11.

Next, insert the paired chip microwave device 3 into the through hole 4.
The strip conductors 21 are bonded and fixed between the two strip conductors 21 on the lower surface of the dielectric plate 12 at the end, and each tin part and the ground conductor layer 2 on both sides are connected to each electrode by wire bonding.
The inside is filled with epoxy resin.

In the above embodiment, a one-stage amplifier circuit is shown as the microwave circuit module in the second example, but the constituent circuits are not limited to this, and it is obvious that other circuits can be similarly applied.

In addition, although the dielectric plate IT, 12 was a two-layer stack, the number of bond layers, the material, characteristics, and dimensions of the dielectric plate, as well as the shape and size of each created pattern, are limited to those mentioned above. isn't it.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to obtain a microwave circuit module which can be miniaturized, and which can significantly reduce assembly man-hours and improve reliability and economy, and has great effects.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional example of a microwave circuit module. In the figure, 2 is a ground conductor layer, 3 is a microwave device, 4 is a through hole, 11.12.92 is a dielectric plate,
21, 9e are strip conductors,

Claims (2)

[Claims] (1) Two dielectric plates (11) and (12) are stacked, the lower dielectric plate (11) is a ground conductor layer (2) whose entire lower surface is metallized, and the microwave device (3) is The dielectric plate (12), which is provided with a through hole (4) or notch to accommodate the strip conductor (21) constituting the microstrip line on the lower surface, is stacked on the dielectric plate (11).
, other circuit patterns, capacitor electrodes (51), and inductance with a membrane structure are provided by patterning the same conductor material, and the same type of configuration as the bottom surface is made on the upper surface, and a resistor (53) with a membrane structure, an external A terminal electrode (23) for connection is provided, the dielectric plates (11) and (12) are stacked, interlayer connections are made between vias and through holes, and the microwave device (3) is formed integrally. is housed in the through hole (4) or notch, and terminals are connected to the circuit pattern of the abutting dielectric plate (12) to form a microwave integrated circuit. (2) In the middle of the dielectric plates (11) and (12) according to claim (1), there is a strip conductor constituting a microstrip line on the bottom surface, other circuit patterns, capacitor electrodes, and inductances of the film structure that are the same. At least one dielectric plate is laminated, which is provided by patterning the conductor material, and if necessary, a through hole or cutout for accommodating a microwave device is provided at a position overlapping with that of the dielectric plate of the lowest layer. The microwave device is housed in the through hole or notch, and the terminal is connected to the circuit pattern of the dielectric plate at the end, so that the microwave device A microwave circuit module comprising an integrated circuit.