JP2671527B2 - Microwave circuit module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A microwave circuit module formed by stacking dielectric plates is provided, which can be miniaturized and can reduce the number of assembling steps to achieve reliability and economy. In order to achieve the above, two dielectric plates are laminated, the lower dielectric plate is a ground conductor layer whose lower surface is entirely metallized, and a through hole or a notch for housing a microwave device is provided. The dielectric plate, which is stacked on the dielectric plate, has strip conductors that form a microstrip line on the lower surface, other circuit patterns, capacitor electrodes, and film-structured inductances that are formed by patterning the same conductor material. The same type of structure is used, and the resistance of the film structure and the terminal electrodes for external connection are provided. The above-mentioned dielectric plates are stacked, and the interlayer connection is made by vias or through holes. There are formed integrally accommodated in lacks through-holes or cut devices for microwave, by the terminal connected to the circuit pattern of the abutment of the dielectric plate, thereby constituting a microwave integrated circuit.

[Industrial applications]

The present invention relates to a microwave circuit module formed by stacking dielectric plates.

Due to the miniaturization and higher performance of wireless communication in recent years, remarkable development has been made in the fixed communication field as well as the mobile communication field.

For example, car phones, mobile phones, and home wireless phones are rapidly becoming widespread.

The microwave integrated circuits used in these mobile radios are
Advances in dielectric materials have led to the development of materials with low dielectric loss, a wide range of dielectric constants, and stable temperature characteristics, which promotes miniaturization and high performance, and is highly demanded for economic efficiency. There is.

[Conventional technology]

FIG. 2 shows a perspective view of a conventional microwave circuit module.

In a conventional microwave circuit module, as shown in FIG. 2, a strip conductor 92 forming a microstrip line and other circuit patterns 94 are patterned on the dielectric plate 92 of an alumina substrate with the same conductor material. Further, individual circuits 95 such as resistors and capacitors and microwave devices 3 such as transistors and diodes are mounted and soldered to the circuit pattern 94 to form a circuit.

The opposite surface of the dielectric plate 92 is closely fixed to the metal base 91 of the housing, and is completely covered and shielded by the metal cover 96.

[Problems to be solved by the invention]

However, it is characteristically preferable that the individual component 95 is a chip type having a small shape, and there is a limit to miniaturization for manually mounting this, and a dedicated automatic mounting machine is required from the viewpoint of reliability.

Also, since a large number of parts are used, it takes time to mount the parts 95, and the number of assembling steps of the microwave circuit module is increased.

Thus, it takes a lot of man-hours to assemble, and if the miniaturization is prioritized, an automatic mounting machine is required, which is expensive.

And so on.

The present invention has been made in view of the above problems, and an object thereof is to provide a microwave circuit module that can be miniaturized and can reduce the number of assembling steps to achieve reliability and economy.

[Means for solving the problem]

As shown in FIG. 1, the above problems are as follows. (1) Two dielectric plates 11 and 12 are laminated to form a lower dielectric plate 1
1 is a ground conductor layer 2 whose lower surface is entirely metallized and is provided with a through hole 4 for accommodating a microwave device 3 or a notch, and a dielectric plate 12 overlapping the dielectric plate 11 is a microstrip line on the lower surface. The strip conductor 21, other circuit patterns, the capacitor electrode 51, and the film-structured inductance are provided by patterning the same conductor material, and the upper surface has the same structure as the lower surface and the film-structured resistor 53. , The terminal electrodes 23 for external connection are provided, the dielectric plates 11 and 12 are stacked, and interlayer connection is performed by vias and through holes 42, and they are integrally formed. Alternatively, it is solved by the microwave circuit module of the present invention, which is housed in a notch and terminal-connected to the circuit pattern of the dielectric plate 12 at the end to form a microwave integrated circuit.

(2) In addition, in the middle of the dielectric plates (11) and (12) described in (1), there are strip conductors forming a microstrip line on the lower surface, other circuit patterns, capacitor electrodes, and the inductance of the film structure. At least one of the dielectric plates is provided by patterning the same conductor material, and further, if necessary, through holes or notches for accommodating microwave devices are provided at positions overlapping with those of the lowermost dielectric plate. It is laminated in the middle, the interlayer connection is made by vias and through holes to be integrally formed, the microwave device is housed in the through hole or notch, and the terminal connection is made to the circuit pattern of the dielectric plate at the end, It is solved by the microwave circuit module of the present invention, which constitutes a wave integrated circuit.

(Operation)

That is, the resistance, capacitor, and inductance of the individual parts are dielectric plates whose characteristics such as dielectric constant, dielectric loss, and temperature characteristics are selected. It is possible to obtain a desired constant with a film structure on the dielectric plate or a counter electrode film sandwiching the dielectric plate using a material with low loss, so it is not necessary to use chip type circuit parts. Complete.

In the microwave device 3 such as a transistor or a diode, it is still insufficient in characteristics to form it on the dielectric plates 11 and 12 like the individual components, and the same semiconductor component as the conventional one is used. For this purpose, the through holes 4 and the notches are provided in the dielectric plates 11 and 12 to be accommodated therein, and the terminals are connected to the circuit pattern of the dielectric plate 12 at the end.

Each dielectric plate 12 and the intermediate dielectric plate are provided with strip conductors 21 and a circuit pattern in addition to circuit components, and are integrally formed by stacking while forming through holes 42 and vias for connection between the stacks. It

For example, by using dielectric plates 11 and 12 which are ceramic plates, a resistor 5
The patterns of the conductor layers other than 3 are all made of the same material, and it is possible to form a thick film on the plate before firing, stack these, and fire them integrally.

At this time, the resistor 53 is not provided in the inner intermediate layer, but is provided only in the uppermost layer after the lamination molding, because the film material is different from the other conductor materials and the manufacturing process is different, which makes it difficult to integrally form the resistor 53.

Thus, in the completed microwave circuit module, the entire lower surface of the lowermost layer serves as the ground conductor layer 2, and this surface is soldered and fixed to the metal substrate of the unit, and the input / output wiring is connected to the terminal electrode 23 on the upper surface of the uppermost layer. Use by connecting the power supply wiring.

At this time, the through-hole 4 on which the microwave device 3 is mounted is sealed by soldering the entire surface of the ground conductor layer 2. Therefore, the microwave device 3 may be in a bare chip state without a package, and further, the through-hole may be further formed. If the inside of 4 is sealed with resin, higher reliability can be easily obtained.

Further, the bare chip of the microwave device 3 becomes extremely small, which can contribute to miniaturization.

Thus, it is possible to provide a microwave circuit module which can be miniaturized and can reduce the number of assembling steps to achieve reliability and economy.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to examples shown in the drawings. The same reference numerals indicate the same objects throughout the drawings. FIG. 1 (a) is a configuration diagram of an embodiment of the present invention, and FIG. 1 (b) is a circuit diagram thereof.

In this embodiment, two dielectric plates are laminated, and FIG.
As shown in the circuit diagram of, a one-stage amplifier circuit for 2 to 4 GHz is configured.

The input is connected to the base of the microwave device 3 via the microstrip line through the DC power cut capacitor C1, and the output from the collector is connected to the outside through the microstrip line and the capacitor C2.

Power is supplied to the microwave device 3 through resistors R2 and R3.
The bias voltage divided by is supplied to the base electrode via the series resistance R1 and the inductance, and the bypass capacitors C3 and C4 are connected to each resistance end.

Further, the collector voltage is supplied by a resistor R4 and an inductor in series, and bypass capacitors C5 and C6 are connected before and after the collector voltage.

Therefore, this embodiment is composed of four resistors, six capacitors, and one transistor.

As shown in FIG. 1 (a), this circuit is composed of two dielectric plates 11 and 12 and a microwave device 3.
No resistors or capacitors of individual parts are used.

The lower dielectric plate 11 has a dielectric constant of about 10 with a thickness of 20 × 20 mm and a thickness of 0.65 mm.
The bottom surface of the ceramic plate is metallized to form the ground conductor layer 2, and a through hole 4 of 8 mm ^square is opened in the center, and the center is left as a band of 6 mm, and the other surface is penetrated with a pitch of 4 mm. A hole 42 is provided.

The dielectric plate 12 laminated on the dielectric plate 11 is 20 × 20 mm thick.
It is a ceramic plate with a dielectric constant of about 30 of 0.3 mm.
A ground conductor layer 2 is formed on the entire left and right, leaving a strip of mm, two strip conductors 21 are formed on the center line of the strip, and electrodes 51 for capacitors C1 and C2 are formed on the ends of the strip as a conductor pattern. Corresponding to the capacitors C1 and C2, a part of the capacitor electrode 51 extends to the edge of the dielectric plate 12 and is used as the input / output terminal electrode 23, and capacitors are provided in the areas of the left and right ground conductor layers 2, respectively.
The electrode 51 for C3, C4 and the electrode 51 for capacitor C5 and a part of the capacitor C6 which was made a business trip to the terminal electrode 23 for external connection and the electrode 51 for capacitor C3, C5 to each strip conductor 21 A thick film resistor (R1) 53 is provided between the wiring to the through hole 42 and the capacitors C3 and C4, a resistor (R4) is similarly provided between the capacitors C5 and C6, and a resistor (R3 is provided between the capacitors C4 and C6). ), And a resistor (R2) is formed between the capacitor C4 and the through hole 42 provided in the ground conductor layer 2.

The two dielectric plates 11 and 12 as described above are superposed in a raw state before firing and integrally fired. However, each resistor is formed into a film after the lamination is formed.

As a result, the ground conductor layer 2 of the dielectric plate 12 is
It is connected to the ground conductor layer 2 on the lower surface through 11 through holes 42.

Next, the bare-chip microwave device 3 is housed in the through hole 4 and fixed by adhesive bonding between the two strip conductors 21 on the lower surface of the dielectric plate 12 at the end, and the ground conductor layers 2 at each end and both sides. Then, each electrode is connected by wire bonding, and the inside is filled with epoxy resin.

In the above embodiment, the one-stage amplifier circuit is shown as an example of the microwave circuit module, but the configuration circuit is not limited to this, and it is obvious that other circuits can be similarly applied.

Although the dielectric plates 11 and 12 were two laminated layers, the number of laminated layers, the material of the dielectric plate, the characteristics, the dimensions, and the shape and size of each created pattern are not limited to the above. Absent.

[Effects of the Invention] As described above, according to the present invention, it is possible to obtain a microwave circuit module which can be miniaturized, and which is capable of significantly reducing the number of assembling steps and achieving reliability and economy. .

[Brief description of the drawings]

FIG. 1 is an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional microwave circuit module. In the figure, 2 is a ground conductor layer, 3 is a microwave device, 4 is a through hole, 11,12,92 are dielectric plates, 21,92 is a strip conductor, 23 is a terminal electrode, 42 is a through hole, and 51 is a Capacitor electrodes, 53 are resistors, 94 is a circuit pattern, 95 is individual parts, and 96 is a metal cover.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-2-135802 (JP, A) JP-A-1-228202 (JP, A)

Claims (2)

(57) [Claims] 1. A microwave device (3) in which two dielectric plates (11) and (12) are laminated, and the lower dielectric plate (11) is a ground conductor layer (2) whose lower surface is entirely metallized. ) Is provided with a through hole (4) or a notch, and the dielectric plate (12) to be superposed on the dielectric plate (11) has a strip conductor (21) forming a microstrip line on the lower surface, Circuit pattern, electrode for capacitor (51)
And a film-structured inductance are provided by patterning the same conductor material, the same structure as the lower surface is formed, and a film-structured resistance (53) and a terminal electrode (23) for external connection are provided. The dielectric plates (11) and (12) are stacked, and interlayer connection is performed by vias and through holes (42) to be integrally formed, and the microwave device (3) is formed into the through hole (4) or the notch. The microwave circuit module is characterized in that the microwave integrated circuit is formed by connecting the terminals to the circuit pattern of the dielectric plate (12) at the end of the microwave integrated circuit. 2. A dielectric plate (11) (12) according to claim 1.
In the middle of this, a strip conductor that constitutes a microstrip line, other circuit patterns, capacitor electrodes and film-structured inductance are provided by patterning the same conductor material. The holes or notches are provided at positions overlapping with those of the lowermost dielectric plate, at least one of the dielectric plates is laminated, and interlayer connection is performed by vias or through holes to integrally form the micro plate. A microwave circuit module, characterized in that a wave device is housed in the through hole or notch and terminal-connected to a circuit pattern of a dielectric plate at the end to constitute a microwave integrated circuit.