JP2002100697A - Electronic component and electronic device provided with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the reliability of connections when an electronic component is mounted on a mother board, even if the sizes of the electronic component such as a laminate type ceramic electronic component are increased. SOLUTION: A recessed portion 17 is formed on the side of an end face 13 of an electronic component main body 12, to provide an external connection terminal electrode 14 with a side electrode portion 18, which is formed at least on an inner side face of the recessed portion 17. When the external connection terminal electrode 14 is soldered to a conductive connection land 21 on a mother board 20, a solder fillet 22 is formed inward from an inside surface 16 of the recessed portion 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and an electronic device having such an electronic component.
In particular, the present invention relates to an improvement in the structure of an external connection terminal electrode in an electronic component.

[0002]

2. Description of the Related Art Electronic components of interest to the present invention include, for example, multilayer ceramic electronic components. The multilayer ceramic electronic component is also called a multilayer ceramic substrate, and includes an electronic component body having a multilayer structure including a plurality of ceramic layers.

[0003] Inside the electronic component body, wiring conductors are provided so as to form a desired circuit with passive elements such as capacitors, inductors and / or resistors. In addition, an active element such as a semiconductor IC chip and a part of a passive element are mounted on the outside of the laminate as needed.

[0004] Further, the laminated ceramic electronic component compounded as described above is mounted on a suitable wiring board and used to constitute a desired electronic device.

[0005] Such a multilayer ceramic electronic component is
For example, in the field of mobile communication terminals, LCR
Used as a composite high-frequency component, or in the computer field, as a component in which an active element such as a semiconductor IC chip is combined with a passive element such as a capacitor, an inductor or a resistor, or simply as a semiconductor IC package. are doing.

More specifically, the multilayer ceramic electronic component includes a PA module substrate, an RF diode switch,
It is widely used to form various electronic components such as filters, chip antennas, various package components, and composite devices.

FIG. 10 is a perspective view showing the appearance of a conventional multilayer ceramic electronic component 1. As shown in FIG. In FIG. 10, when the multilayer ceramic electronic component 1 is mounted on a wiring board (not shown), the surface facing the wiring board is shown facing upward.

The multilayer ceramic electronic component 1 has an electronic component body 2 having a multilayer structure composed of a plurality of ceramic layers stacked. On one end face 3 side in the laminating direction of the laminated structure provided by the electronic component body 2,
A plurality of external connection terminal electrodes 4 for electrical connection to a wiring board (not shown) are provided. These external connection terminal electrodes 4 are usually formed so as to extend not only on the end face 3 of the electronic component body 2 but also on the side face 5.

FIG. 11 is a schematic sectional view showing a state in which the above-mentioned multilayer ceramic electronic component 1 is mounted on a mother board 6 as a wiring board.

The multilayer ceramic electronic component 1 is arranged such that the end face 3 of the electronic component main body 2 faces the motherboard 6, and in this state, the external connection terminal electrodes 4 are connected to the connection conductive lands 7 on the motherboard 6. Soldered. As a result of the soldering, a solder fillet 8 is formed between the external connection terminal electrode and the connection conductive land 7.

[0011]

In the multilayer ceramic electronic component 1 as described above, as multifunctionalization proceeds,
The dimensions increase accordingly. Therefore, when the multilayer ceramic electronic component 1 is mounted on the motherboard 6, it is necessary that the bonding strength with the motherboard 6 be high or the bonding reliability be high. If the bonding strength or bonding reliability is low, the electronic device including the motherboard 6 on which the multilayer ceramic electronic component 1 is mounted may be disconnected due to deformation of the motherboard 6 that occurs when the electronic device falls. . Also, if the bonding strength or the bonding reliability is low, the heat cycle resistance will also be low.

From the viewpoint of the bonding strength or the bonding reliability, the mounting state as shown in FIG. 11 is disadvantageous. This is because the solder fillet 8 is
, The distance from the center of the electronic component body 2 to the solder fillet 8 is relatively long, and therefore the stress applied to the solder fillet 8 when the motherboard 6 is deformed is relatively large. When the temperature changes, the stress applied to the solder fillet 8 becomes relatively large due to the difference in the coefficient of linear expansion between the motherboard 6 and the electronic component body 2, and as a result, the joint part by the solder fillet 8 is damaged. This is because they are placed in situations that are likely to be affected.

The mounting state as shown in FIG. 11 is also disadvantageous for downsizing an electronic device including the motherboard 6 on which such a multilayer ceramic electronic component 1 is mounted. Because the solder fillet 8 is formed outside the electronic component body 2 as described above, the area required for mounting is required to be large, for example, about 1.2 to 2.0 times the electronic component body 2. Because you do. This hinders high-density mounting and hinders miniaturization of electronic devices.

It is an object of the present invention to provide an electronic component and an electronic device including such an electronic component, which can solve the above-described problems.

[0015]

According to the present invention, an electronic component main body is provided, and an external connection terminal electrode for electrical connection to a wiring board is provided on one end face side of the electronic component main body. It is directed to an electronic component, and in order to solve the above-described technical problem, a concave portion defined by an inner bottom surface and an inner side surface is provided on one end surface side of the electronic component body, and the external terminal electrode is at least It is characterized by including a side surface electrode portion formed on the inner side surface of the concave portion.

It is preferable that the external connection terminal electrode further includes an end surface electrode portion electrically connected to the above-mentioned side surface electrode portion and formed on one end surface of the electronic component body.

The end face electrode portion is preferably formed so as to continuously extend from the side face electrode portion.

Further, the external connection terminal electrode may further include a bottom electrode portion electrically connected to the side electrode portion and formed on the inner bottom surface of the concave portion.

The bottom electrode portion is preferably formed to extend continuously from the side electrode portion.

Further, it is preferable that the external connection terminal electrode having the bottom electrode as described above functions as a ground terminal.

In the electronic component according to the present invention, the concave portion is sandwiched by the two opposing inner surfaces even if it defines a space surrounded by the four inner surfaces.
In addition, an open groove-shaped space may be defined for the other opposing sides.

The present invention is particularly advantageously applied to a multilayer ceramic electronic component having an electronic component body having a laminated structure composed of a plurality of laminated ceramic layers.

In the case described above, one end face of the electronic component body on which the external connection terminal electrode is provided is preferably one end face in the stacking direction of the stacked structure.

The present invention is also directed to an electronic device including the electronic component as described above. This electronic device
An electronic component is provided, and a wiring board is provided so as to face one end surface of the electronic component main body and forms a conductive land for connection. The above-mentioned external connection terminal electrode is electrically connected to the connection conductive land.

In the electronic device according to the present invention, preferably, the external connection terminal electrode is soldered to the connection conductive land.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to a multilayer ceramic electronic component.

FIG. 1 is a perspective view showing the appearance of a multilayer ceramic electronic component 11 according to a first embodiment of the present invention. In FIG. 1, a multilayer ceramic electronic component 11 includes:
It is illustrated with the surface facing the wiring board (not shown) on which it is to be mounted facing upward. The same applies to FIGS. 3 to 9 described later.

The multilayer ceramic electronic component 11 has an electronic component body 12. Although not shown in FIG. 1, the electronic component body 12 has a laminated structure including a plurality of laminated ceramic layers. Although not shown in the drawing, various wiring conductors such as a conductor film and a via-hole conductor are provided in the electronic component body 12 in relation to a specific ceramic layer.

A plurality of external connection terminal electrodes 14 for electrical connection to a wiring board (not shown) are provided on one end surface 13 side of the electronic component body 12. In this embodiment, the end face 13 is located on one end side in the stacking direction of the plurality of ceramic layers in the electronic component body 12.

On the side of the end surface 13 of the electronic component body 12, a concave portion 17 defined by an inner bottom surface 15 and an inner side surface 16 is provided. The external connection terminal electrode 14 is
7 and an end surface electrode portion 19 formed on the end surface 13 of the electronic component body 12.
And The side surface electrode portion 18 and the end surface electrode portion 19 are electrically connected to each other. In this embodiment, the end surface electrode portion 19 is formed so as to extend continuously from the side surface electrode portion 18.

The number and area of the external connection terminal electrodes 14 can be arbitrarily changed as required.

The multilayer ceramic electronic component 1 as described above
1 can be manufactured basically using a lamination technique of a plurality of ceramic green sheets.

That is, first, a plurality of ceramic green sheets are prepared. This ceramic green sheet preferably contains a ceramic material that can be sintered at a temperature of 1000 ° C. or lower so that a wiring conductor can be formed using a conductive paste containing copper, for example.

Next, the specific ceramic green sheets are provided with through-holes for via-hole conductors, and these through-holes are filled with a conductive paste. Is printed to form a conductor film.

Further, a specific ceramic green sheet is provided with a through hole for providing the concave portion 17.

Next, the above-described plurality of ceramic green sheets are laminated and then pressed. At this time,
A ceramic green sheet provided with a through hole for providing the concave portion 17 is located at one end side in the laminating direction.

The thus obtained green laminate is cut into a predetermined size, if necessary, and then fired. Thereby, the laminated body after sintering, that is, the electronic component body 12 is obtained. Then, an external connection terminal electrode 14 is formed on the electronic component body 12, and
If necessary, other conductive films, printed resistors and insulating layers are formed, plated, and further, necessary active elements and passive elements are mounted, whereby the multilayer ceramic electronic component 11 is completed. You.

The side surface electrode portion 18 of the external connection terminal 14 is formed by forming a via hole conductor in a ceramic green sheet and forming a through hole for providing a recess 17 in the ceramic green sheet. It may be formed by exposing a part of the via-hole conductor on the upper surface.

The end face electrode portion 19 of the external connection terminal electrode 14 may be formed at the stage of the ceramic green sheet.

FIG. 2 is a sectional view schematically showing a state in which the above-mentioned multilayer ceramic electronic component 11 is mounted on a mother board 20 as a wiring board.

Referring to FIG. 2, multilayer ceramic electronic component 11 is arranged such that end face 13 of electronic component main body 12 faces motherboard 20. The connection conductive lands 21 formed on the motherboard 20
The external connection terminal electrodes 14 are electrically connected by soldering. FIG. 2 shows a solder fillet 22 formed by this soldering. Note that, instead of the solder, another conductive bonding material such as a conductive adhesive may be used.

As shown in FIG. 2, the external connection terminal electrode 14
Is formed on the inner surface 16 of the concave portion 17, the solder fillet 22 is formed inward from the inner surface 16 of the concave portion 17, so that the solder fillet 22 extends to the outside of the electronic component body 12. Can be prevented. Therefore, the area required for mounting the multilayer ceramic electronic component 11 can be reduced, which can contribute to high-density mounting.

Further, since the distance from the center of the electronic component body 12 to the solder fillet 22 can be made relatively short, when the motherboard 20 is deformed, the stress applied to the joint by the solder fillet 22 and the temperature change are reduced. When this occurs, the stress exerted on the joint by the solder fillet 22 due to the difference in the coefficient of linear expansion between the motherboard 20 and the electronic component body 12 can be made relatively small. Therefore, even if the size of the multilayer ceramic electronic component 11 is increased, the reliability of bonding can be maintained high.

Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 3 to 9, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

In the multilayer ceramic electronic component 31 according to the second embodiment shown in FIG. 3, the side electrode portion 18 of the external connection terminal electrode 14 is formed so as not to reach the inner bottom surface 15 of the concave portion 17. The end face electrode portion 19 is
Is formed so that it does not reach the peripheral portion.

In the multilayer ceramic electronic component 32 according to the third embodiment shown in FIG. 4, the side face electrode portion 18 of the external connection terminal electrode 14 is formed by the end face 13 and the inner bottom face 1 of the recess 17.
5 so as not to reach any of them. That is, the side surface electrode portion 18 and the end surface electrode portion 19 are electrically connected to each other, but are not formed to extend continuously.

In the multilayer ceramic electronic component 33 according to the fourth embodiment shown in FIG. 5, the external connection terminal electrode 14 further includes a bottom electrode portion 23 formed on the inner bottom surface 15 of the recess 17. Features. In this embodiment, the end face electrode part 19, the side face electrode part 18, and the bottom face electrode part 23 are formed so as to extend in series.

In the multilayer ceramic electronic component 34 according to the fifth embodiment shown in FIG. 6, the specific external connection terminal electrode 14a includes the side surface electrode portion 18, the end surface electrode portion 19, and the bottom surface electrode portion 23. External connection terminal electrode 14a
Are designed to function as ground terminals. In particular, the bottom electrode portion 23 is formed over substantially the entire inner bottom surface 15 of the recess 17.

By employing such a configuration, the external connection terminal electrode 14a functioning as a ground terminal can be directly connected to a motherboard (not shown) with a shortest distance and a large area. , Can enhance the ground effect.

In the multilayer ceramic electronic components 11 and 31 to 34 according to the first to fifth embodiments described with reference to FIG. 1 to FIG.
Although the space defined by the two inner surfaces 16 has been defined, as described below with reference to FIGS.
The recess may be sandwiched by two opposing inner surfaces and define a groove-like space that is open with respect to the other opposing sides.

In the multilayer ceramic electronic component 35 according to the sixth embodiment shown in FIG. 7, a concave portion 17a defining a groove-like space is formed. External connection terminal electrode 1
The mode of forming 4 is substantially the same as that of the multilayer ceramic electronic component 11 shown in FIG.

Also in the multilayer ceramic electronic component 36 according to the seventh embodiment shown in FIG. 8, a concave portion 17a defining a groove-like space is provided, and the external connection terminal electrode 14 is formed as shown in FIG. It has substantially the same forming mode as the mold ceramic electronic component 31.

The multilayer ceramic electronic component 37 according to the eighth embodiment shown in FIG. 9 also has a concave portion 17a for defining a groove-like space. A ground electrode 24 is formed on the inner bottom surface 15 of the recess 17a. Further, the external connection terminal electrode 14a is
And an end surface electrode 19,
Are formed so as not to reach the inner bottom surface 15 of the concave portion 17a. Although not shown, the external connection terminal electrode 14
May be formed to reach the inner bottom surface 15 and be electrically connected to the ground electrode 24.

According to the multilayer ceramic electronic components 35 to 37 shown in FIGS. 7 to 9, it is possible to apply, for example, cutting with a dicing saw to form the recess 17a.

Although the present invention has been described with reference to the various embodiments shown in the drawings, within the scope of the present invention,
In addition, some modifications are possible.

For example, the shape of the recess 17 or 17a can be arbitrarily changed.

The recess 17 or 17a may be used as a space for accommodating other electronic components.

The present invention can be applied not only to the multilayer ceramic electronic component but also to a non-laminate electronic component or to an electronic component other than the ceramic electronic component.

[0059]

As described above, according to the electronic component of the present invention, the concave portion defined by the inner bottom surface and the inner side surface is provided on one end surface side of the electronic component main body, and the electric connection to the wiring board is provided. Since the external connection terminal electrode for the electronic component has at least a side surface electrode portion formed on the inner side surface of the concave portion, when the electronic component is mounted on the wiring board by soldering, the solder fillet is removed. It can be directed inward from the inner surface of the recess.

Therefore, it is possible to prevent the solder fillet from being formed outside the electronic component main body, and it is possible to reduce the area required for mounting the electronic component and contribute to high-density mounting.

Further, the distance from the center of the electronic component body to the joint portion by the solder fillet can be made relatively short. Therefore, when the wiring board on which the electronic component is mounted is deformed, the stress applied to the solder fillet or the difference in the coefficient of linear expansion between the electronic component body and the wiring board when a temperature change occurs. Can be reduced. Therefore, even if the size of the electronic component is increased, it is possible to maintain high reliability regarding the bonding.

In the electronic component according to the present invention, when the external connection terminal electrode is further electrically connected to the side surface electrode portion and further includes an end surface electrode portion formed on one end surface of the electronic component main body, Reliability can be further improved.

In the case where the external connection terminal electrode is further electrically connected to the side surface electrode portion and further includes a bottom surface electrode portion formed on the inner bottom surface of the concave portion, the connection reliability is further improved. be able to.

As described above, when the external connection terminal electrode is provided with the bottom electrode portion, if this external connection terminal electrode is made to function as a ground terminal, the ground potential of the electronic component can be reduced in the shortest distance. In addition, since it can be connected to the wiring board with a relatively large area, the ground effect can be enhanced. This makes the structure particularly suitable for high frequency components.

Further, when the electronic component body has a laminated structure composed of a plurality of laminated ceramic layers, the present invention is advantageously applied to a laminated ceramic electronic component such as a multilayer ceramic substrate. Can be applied. In this case, when the external connection terminal electrode is provided on one end surface side in the laminated structure of the electronic component body, a through hole is provided in a specific one of the plurality of ceramic green sheets laminated to obtain the electronic component body. By doing so, the concave portion, which is a feature of the present invention, can be formed in the electronic component body.

According to the electronic device of the present invention, since the electronic component as described above has a structure in which it is mounted on the wiring board, as described above, high reliability can be obtained for bonding the electronic component to the wiring board. Sex can be given.

In the above electronic device, when the external connection terminal electrode is soldered to the connection conductive land on the wiring board, the solder fillet formed by this soldering does not extend outside the electronic component body. As a result, the area required for mounting electronic components can be reduced, and high-density mounting can be achieved, so that the electronic device can be reduced in size.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a multilayer ceramic electronic component 11 according to a first embodiment of the present invention.

FIG. 2 is a sectional view schematically showing a state in which the multilayer ceramic electronic component 11 shown in FIG. 1 is mounted on a motherboard 20.

FIG. 3 is a perspective view showing an appearance of a multilayer ceramic electronic component 31 according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing an appearance of a multilayer ceramic electronic component 32 according to a third embodiment of the present invention.

FIG. 5 is a perspective view showing an appearance of a multilayer ceramic electronic component 33 according to a fourth embodiment of the present invention.

FIG. 6 is a perspective view showing the appearance of a multilayer ceramic electronic component according to a fifth embodiment of the present invention.

FIG. 7 is a perspective view showing an appearance of a multilayer ceramic electronic component 35 according to a sixth embodiment of the present invention.

FIG. 8 is a perspective view showing an appearance of a multilayer ceramic electronic component according to a seventh embodiment of the present invention.

FIG. 9 is a perspective view showing an appearance of a multilayer ceramic electronic component 37 according to an eighth embodiment of the present invention.

FIG. 10 is a perspective view showing the appearance of a conventional multilayer ceramic electronic component 1.

11 is a multilayer ceramic electronic component 1 shown in FIG.
FIG. 2 is a cross-sectional view schematically showing a state where is mounted on a motherboard 6.

[Explanation of symbols]

11, 31-37 Multilayer ceramic electronic component (electronic component) 12 Electronic component body 13 End face 14, 14a External connection terminal electrode 15 Inner bottom face 16 Inner side face 17, 17a Depression 18 Side face electrode section 19 End face electrode section 20 Mother board (wiring board) 21) conductive land for connection 22 solder fillet 23 bottom electrode 24 ground electrode

Claims (12)

[Claims] 1. An electronic component, comprising: an electronic component main body, wherein an external connection terminal electrode for electrical connection to a wiring board is provided on one end surface side of the electronic component main body. A concave portion defined by an inner bottom surface and an inner side surface is provided on the one end surface side of the component body, and the external connection terminal electrode includes at least a side surface electrode portion formed on the inner side surface of the concave portion. parts. 2. The electronic device according to claim 1, wherein the external connection terminal electrode further includes an end surface electrode portion electrically connected to the side surface electrode portion and formed on the one end surface of the electronic component body. Electronic components. 3. The electronic component according to claim 2, wherein the end face electrode portion is formed to extend continuously from the side face electrode portion. 4. The external connection terminal electrode according to claim 1, further comprising a bottom surface electrode portion electrically connected to the side surface electrode portion and formed on the inner bottom surface of the concave portion. Electronic components according to the above. 5. The electronic component according to claim 4, wherein said bottom electrode portion is formed to extend continuously from said side electrode portion. 6. The electronic component according to claim 4, wherein the external connection terminal electrode including the bottom electrode portion functions as a ground terminal. 7. The electronic component according to claim 1, wherein the recess defines a space surrounded by the four inner surfaces. 8. The recess according to claim 1, wherein the recess is sandwiched by two opposing inner surfaces and defines a groove-shaped space that is open with respect to the other opposing sides. Electronic components according to the above. 9. The electronic component according to claim 1, wherein the electronic component body has a laminated structure including a plurality of laminated ceramic layers. 10. The electronic component according to claim 9, wherein the one end surface of the electronic component body on which the external connection terminal electrode is provided is one end surface in a stacking direction of the stacked structure. 11. The electronic component according to claim 1, further comprising: a wiring board disposed so as to face the one end surface of the electronic component body and forming a conductive land for connection. An electronic device, wherein the external connection terminal electrode is electrically connected to the connection conductive land. 12. The electronic device according to claim 11, wherein the external connection terminal electrode is soldered to the connection conductive land.