JP2021077672A - Electronic apparatus - Google Patents

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JP2021077672A
JP2021077672A JP2019200703A JP2019200703A JP2021077672A JP 2021077672 A JP2021077672 A JP 2021077672A JP 2019200703 A JP2019200703 A JP 2019200703A JP 2019200703 A JP2019200703 A JP 2019200703A JP 2021077672 A JP2021077672 A JP 2021077672A
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printed circuit
circuit board
lid
electronic component
contact
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哲平 種村
Teppei Tanemura
哲平 種村
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Denso Corp
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Denso Corp
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  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

To properly ensure heat dissipation and electromagnetic wave resistance without reducing the degree of freedom in wiring electronic component.SOLUTION: An electronic apparatus 1 includes a printed circuit board 2, an electronic component 3 mounted on the printed circuit board, and a lid 11 composed of a metal material and covering the electronic component. The lid includes a contact portion 14 in contact with the surface of the printed circuit board, and a gap portion 15 not in contact with the surface of the printed circuit board on a side surface portion 13. Wiring of the electronic component is drawn out through the gap portion on the surface of the printed circuit board.SELECTED DRAWING: Figure 1

Description

本発明は、電子機器に関する。 The present invention relates to electronic devices.

従来より、電子機器の多機能化及び高性能化に伴い、電子機器に搭載される電子部品の高電力化及び高周波化が進んでいる。このような電子部品を車載等の厳しい電波環境及び温度環境下で使用する場合には、対象となる電子部品をシールドすることで、熱源を広面積に逃がして放熱性を向上させると共に、耐電磁波特性を向上させることができる。電子部品をシールドする構成として、例えば特許文献１には、リッドを接地するためのランドを全周に設け、リッドの側面部の下端部を全てプリント基板の表面に接触させることで、耐電磁波特性を向上させる構成が開示されている。又、例えば特許文献２には、電子部品を実装した後に、リッドを後付けで上方から搭載する構成が開示されている。 Conventionally, as electronic devices have become more multifunctional and have higher performance, the power and frequency of electronic components mounted on the electronic devices have been increasing. When such an electronic component is used in a harsh radio wave environment such as an in-vehicle environment and a temperature environment, the target electronic component is shielded to release a heat source over a wide area to improve heat dissipation and electromagnetic wave resistance. The characteristics can be improved. As a configuration for shielding electronic components, for example, in Patent Document 1, a land for grounding the lid is provided on the entire circumference, and the lower end of the side surface of the lid is brought into contact with the surface of the printed circuit board to have electromagnetic wave resistance. The configuration for improving the above is disclosed. Further, for example, Patent Document 2 discloses a configuration in which a lid is mounted from above after mounting an electronic component.

特開２０１２−１６４８５２４号公報Japanese Unexamined Patent Publication No. 2012-168524 特開２００２−９３９２８号公報JP-A-2002-93928

近年、電子部品のプロセス微細化に伴い、電子部品の小型化及び多端子化が進んでおり、電子部品を実装するプリント基板の配線設計が複雑化している。プリント基板の配線効率を高めるためにプリント基板の表層に配線を引出す場合がある。しかしながら、特許文献１の構成では、リッドを接地するためのランドが全周に設けられているので、電子部品からプリント基板の表層に配線を引出すことができない。そのため、多層プリント基板を用い、電子部品からの配線を多層プリント基板の内層に引回す必要があり、配線を最短経路で引回すことができない。又、特許文献２の構成では、プリント基板の表層に配線を引出した状態でリッドを後付けで上方から搭載すると、リッドが配線に接触してプリント基板が削れ、断線や短絡が発生する問題がある。このような事情から電子部品の配線自由度を低下させずに、放熱性及び耐電磁波特性を確保する構成が望まれている。 In recent years, with the miniaturization of electronic component processes, the miniaturization and multi-terminalization of electronic components have progressed, and the wiring design of printed circuit boards on which electronic components are mounted has become complicated. Wiring may be drawn out to the surface layer of the printed circuit board in order to improve the wiring efficiency of the printed circuit board. However, in the configuration of Patent Document 1, since the land for grounding the lid is provided on the entire circumference, it is not possible to draw out the wiring from the electronic component to the surface layer of the printed circuit board. Therefore, it is necessary to use a multilayer printed circuit board and route the wiring from the electronic component to the inner layer of the multilayer printed circuit board, and the wiring cannot be routed in the shortest path. Further, in the configuration of Patent Document 2, if the lid is retrofitted and mounted from above with the wiring drawn out on the surface layer of the printed circuit board, there is a problem that the lid comes into contact with the wiring and the printed circuit board is scraped, resulting in disconnection or short circuit. .. Under these circumstances, a configuration that ensures heat dissipation and electromagnetic wave resistance without reducing the degree of freedom in wiring of electronic components is desired.

本発明は、上記した事情に鑑みてなされたものであり、その目的は、電子部品の配線自由度を低下させることなく、放熱性及び耐電磁波特性を適切に確保することができる電子機器を提供することにある。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device capable of appropriately ensuring heat dissipation and electromagnetic wave resistance without reducing the degree of freedom in wiring of electronic components. To do.

請求項１に記載した電子機器（１）によれば、プリント基板（２）と、プリント基板上に実装されている電子部品（３）と、金属材料から構成され、電子部品を覆うリッド（１１）と、を備える。リッドは、その側面部（１３）に、プリント基板の表面に接する接触部（１４）と、プリント基板の表面に接しない隙間部（１５）とを有する。電子部品は、プリント基板の表面において隙間部を通じて配線が引出されている。 According to the electronic device (1) according to claim 1, a lid (11) composed of a printed circuit board (2), an electronic component (3) mounted on the printed circuit board, and a metal material and covering the electronic component. ) And. The lid has a contact portion (14) in contact with the surface of the printed circuit board and a gap portion (15) in contact with the surface of the printed circuit board on the side surface portion (13). Wiring of electronic components is drawn out through gaps on the surface of the printed circuit board.

リッドの側面部に、プリント基板の表面に接しない隙間部を設け、電子部品からの配線を引出す際には、隙間部を通じて配線を引出すように構成したので、配線をプリント基板の内層に引回す必要がなくなると共に、リッドが配線に接触することもなくなる。これにより、電子部品の配線自由度を低下させることなく、放熱性及び耐電磁波特性を適切に確保することができる。 A gap portion that does not contact the surface of the printed circuit board is provided on the side surface of the lid, and when the wiring from the electronic component is pulled out, the wiring is drawn out through the gap portion, so that the wiring is routed to the inner layer of the printed circuit board. It is no longer necessary and the lid does not come into contact with the wiring. As a result, heat dissipation and electromagnetic wave resistance can be appropriately ensured without reducing the degree of freedom in wiring of electronic components.

請求項３に記載した電子機器（２１）によれば、第１プリント基板（２２）と、第１プリント基板上に実装されている第２プリント基板（２３）と、第２プリント基板上に実装されている電子部品（２４，２５）と、金属材料から構成され、電子部品を覆うリッド（４２）と、を備える。リッドは、その側面部（４４，４５）に、第１プリント基板の表面に接する接触部（５４，５９）と、第１プリント基板の表面に接しない隙間部（５５，６０）とを有する。電子部品は、第１プリント基板の表面において隙間部を通じて配線が引出されている。 According to the electronic device (21) according to claim 3, the first printed circuit board (22), the second printed circuit board (23) mounted on the first printed circuit board, and the second printed circuit board mounted on the second printed circuit board. It includes an electronic component (24, 25), and a lid (42) made of a metal material and covering the electronic component. The lid has a contact portion (54,59) in contact with the surface of the first printed circuit board and a gap portion (55, 60) in contact with the surface of the first printed circuit board on the side surface portion (44, 45). The wiring of the electronic component is drawn out through the gap on the surface of the first printed circuit board.

リッドの側面部に、第１プリント基板の表面に接しない隙間部を設け、電子部品からの配線を引出す際には、隙間部を通じて配線を引出すように構成したので、第１プリント基板上に第２プリント基板が実装され、第２プリント基板上に電子部品が実装されている構成においても、上記した請求項１に記載した発明と同様に、電子部品の配線自由度を低下させることなく、放熱性及び耐電磁波特性を適切に確保することができる。 A gap portion that does not contact the surface of the first printed circuit board is provided on the side surface of the lid, and when the wiring from the electronic component is pulled out, the wiring is pulled out through the gap portion. Even in a configuration in which two printed circuit boards are mounted and electronic components are mounted on the second printed circuit board, heat is dissipated without reducing the wiring freedom of the electronic components, as in the invention described in claim 1 above. Appropriate properties and electromagnetic wave resistance can be ensured.

第１実施形態を示し、電子部品が実装された状態を示す平面図A plan view showing a first embodiment and showing a state in which electronic components are mounted. 電子部品が実装された状態を示す縦断側面図Longitudinal side view showing the state in which electronic components are mounted リッドの平面図Top view of the lid リッドの側面図Side view of the lid リッドが取付けられた状態を示す平面図Top view showing the state where the lid is attached リッドが取付けられた状態を示す縦断側面図Longitudinal side view showing the state where the lid is attached 第２実施形態を示し、電子部品が実装された状態を示す平面図A plan view showing a second embodiment and showing a state in which electronic components are mounted. 電子部品が実装された状態を示す縦断側面図Longitudinal side view showing the state in which electronic components are mounted リッドの平面図Top view of the lid リッドの側面図Side view of the lid リッドの側面図Side view of the lid 製造工程を示す図（その１）The figure which shows the manufacturing process (the 1) 製造工程を示す図（その２）Diagram showing the manufacturing process (Part 2) 製造工程を示す図（その３）The figure which shows the manufacturing process (3) リッドが取付けられた状態を示す縦断側面図Longitudinal side view showing the state where the lid is attached

以下、電子機器の幾つかの実施形態について図面を参照して説明する。以下に示す各実施形態において、先行する実施形態で説明した内容に対応する部分には同一の参照符号を付し、重複する説明を省略することがある。 Hereinafter, some embodiments of the electronic device will be described with reference to the drawings. In each of the following embodiments, the same reference numerals may be given to the parts corresponding to the contents described in the preceding embodiments, and duplicate description may be omitted.

（第１実施形態）
第１実施形態について図１から図６を参照して説明する。図２は図１のＡ１−Ａ２に沿う縦断側面を示し、図６は図５のＡ３−Ａ４に沿う縦断側面を示す。電子機器１は、例えば車両に搭載される車載用の電子機器であり、平板形状のプリント基板２と、プリント基板２上に実装されている電子部品３とを有する。電子部品３は、例えば平面視にて矩形状のボールグリッドアレイパッケージ型（ＢＧＡ型）の半導体素子であり、半導体チップとパッケージ基板とがボンディングワイヤにより電気的に接続され、パッケージ基板の上面側に対する樹脂モールドにより全体として薄形矩形状のパッケージとして形成されている。パッケージ基板の実装面（裏面）には多数のはんだボールが格子状に設けられている。電子部品３は、例えばＳｏＣ（System on Chip）、電源ＩＣ（Integrated Circuit）、メモリ素子等である。 (First Embodiment)
The first embodiment will be described with reference to FIGS. 1 to 6. FIG. 2 shows a longitudinal side surface along A1-A2 of FIG. 1, and FIG. 6 shows a longitudinal side surface along A3-A4 of FIG. The electronic device 1 is, for example, an in-vehicle electronic device mounted on a vehicle, and includes a flat-plate-shaped printed circuit board 2 and an electronic component 3 mounted on the printed circuit board 2. The electronic component 3 is, for example, a ball grid array package type (BGA type) semiconductor element having a rectangular shape in a plan view. The semiconductor chip and the package substrate are electrically connected by a bonding wire to the upper surface side of the package substrate. It is formed as a thin rectangular package as a whole by a resin mold. A large number of solder balls are provided in a grid pattern on the mounting surface (back surface) of the package substrate. The electronic component 3 is, for example, a SoC (System on Chip), a power supply IC (Integrated Circuit), a memory element, or the like.

プリント基板２は、例えばガラス繊維を含有したエポキシ樹脂等の絶縁基材４が多層に積層されている多層プリント基板であり、その表面及び層間に導体パターンが形成されていると共に、層間にグランドパターン５が形成されている。プリント基板２の表面には、上記した電子部品３の多数のはんだボールに対応し、電子部品３がはんだ接合されるための導通用のランド６が格子状（図１では６行６列）に設けられていると共に、後述するリッドが接地されるための接地用のランド７が設けられている。接地用のランド７は、導通用のランド６の全周を囲むように設けられている。即ち、接地用のランド７は、電子部品３の平面視の４辺を囲むように４箇所の配列群として設けられている。導通用のランド６及び接地用のランド７上には、印刷用のマスクを用いてはんだペーストが塗布（印刷）されることにより印刷体が設けられている。 The printed circuit board 2 is a multilayer printed circuit board in which an insulating base material 4 such as an epoxy resin containing glass fibers is laminated in multiple layers, and a conductor pattern is formed on the surface and between layers thereof, and a ground pattern is formed between the layers. 5 is formed. On the surface of the printed circuit board 2, the lands 6 for conduction for soldering the electronic components 3 are arranged in a grid pattern (6 rows and 6 columns in FIG. 1) corresponding to a large number of solder balls of the electronic components 3 described above. In addition to being provided, a grounding land 7 for grounding the lid, which will be described later, is provided. The grounding land 7 is provided so as to surround the entire circumference of the conduction land 6. That is, the grounding lands 7 are provided as a group of four arrangements so as to surround the four sides of the electronic component 3 in a plan view. A printed body is provided on the conduction land 6 and the grounding land 7 by applying (printing) a solder paste using a printing mask.

プリント基板２の表面には、導通用のランド６及び接地用のランド７を除く部分を覆うようにソルダーレジスト層８が設けられている。ソルダーレジスト層８は、プリント基板２の表面において導体パターンや絶縁基材４を保護すると共に、導通用のランド６及び接地用のランド７を露出させる最外層として形成されている。接地用のランド７は、ビア９を介してグランドパターン５と導通している。 A solder resist layer 8 is provided on the surface of the printed circuit board 2 so as to cover a portion other than the land 6 for conduction and the land 7 for grounding. The solder resist layer 8 is formed as an outermost layer that protects the conductor pattern and the insulating base material 4 on the surface of the printed circuit board 2 and exposes the land 6 for conduction and the land 7 for grounding. The grounding land 7 is electrically connected to the ground pattern 5 via the via 9.

電子部品３をプリント基板２に実装する工程では、電子部品３のはんだボールを導通用のランド６に対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。この加熱は、図示しないリフロー炉を通して行う。はんだペーストである印刷体とはんだボールとが溶融されて一体化され、その後に冷却され、はんだが硬化してはんだ接合部１０が形成されることで、電子部品３がプリント基板２に電気的及び物理的に接続される。 In the step of mounting the electronic component 3 on the printed circuit board 2, the solder balls of the electronic component 3 are aligned with and overlapped with the conduction land 6, heated while controlling the temperature, and solder-bonded. This heating is performed through a reflow oven (not shown). The printed body, which is a solder paste, and the solder balls are melted and integrated, then cooled, and the solder is cured to form the solder joint portion 10, so that the electronic component 3 is electrically and electrically attached to the printed circuit board 2. Physically connected.

図３及び図４に示すように、リッド１１は、平面視にて矩形状の天井面部１２と、４方向の側面部１３とを有する。側面部１３は、その下端部が櫛状に形成されており、リッド１１がプリント基板２に取付けられた状態でプリント基板２の表面に接する接触部１４と、プリント基板２の表面に接しない隙間部１５とが交互に配置されている。接触部１４は、上記した接地用のランド７に対応するように設けらている。隣り合う接触部１４の間隔、即ち、隙間部１５の幅は、隣り合う接地用のランド７の間隔と略同じである。 As shown in FIGS. 3 and 4, the lid 11 has a rectangular ceiling surface portion 12 and side surface portions 13 in four directions in a plan view. The lower end of the side surface portion 13 is formed in a comb shape, and a gap between a contact portion 14 that contacts the surface of the printed circuit board 2 with the lid 11 attached to the printed circuit board 2 and a gap that does not contact the surface of the printed circuit board 2. The portions 15 are arranged alternately. The contact portion 14 is provided so as to correspond to the above-mentioned grounding land 7. The distance between the adjacent contact portions 14, that is, the width of the gap portion 15, is substantially the same as the distance between the adjacent grounding lands 7.

図５及び図６に示すように、リッド１１は、電子部品３を覆うようにプリント基板２に取付けられる。この場合、電子部品３の上面３ａとリッド１１の天井面部１２の下面１２ａとの間には放熱ゲル１６が設けられる。放熱ゲル１６が設けられることで、電子部品３から発せられた熱の殆どは、放熱ゲル１６に直接伝わり、放熱ゲル１６からリッド１１の天井面部１２に伝わり、リッド１１の天井面部１２や側面部１３から拡散される。 As shown in FIGS. 5 and 6, the lid 11 is attached to the printed circuit board 2 so as to cover the electronic component 3. In this case, the heat radiating gel 16 is provided between the upper surface 3a of the electronic component 3 and the lower surface 12a of the ceiling surface 12 of the lid 11. By providing the heat radiating gel 16, most of the heat generated from the electronic component 3 is directly transmitted to the heat radiating gel 16 and transferred from the heat radiating gel 16 to the ceiling surface portion 12 of the lid 11, and the ceiling surface portion 12 and the side surface portion of the lid 11 It is diffused from 13.

リッド１１をプリント基板２に取付ける工程では、リッド１１の側面部１３において接触部１４の端部を接地用のランド７に対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。はんだが硬化してはんだ接合部１７が形成されることで、リッド１１がプリント基板２に物理的に接続されると共に接地される。 In the step of attaching the lid 11 to the printed circuit board 2, the end portion of the contact portion 14 is aligned with the grounding land 7 on the side surface portion 13 of the lid 11 and overlapped, and the heating is performed while controlling the temperature to perform solder bonding. .. When the solder is hardened to form the solder joint portion 17, the lid 11 is physically connected to the printed circuit board 2 and grounded.

上記した構成では、リッド１１がプリント基板２に取付けられた状態では、リッド１１の側面部１３に隙間部１５が形成されていることで、側面部１３の下端部の全体がプリント基板２の表面に接するのではなく、側面部１３の下端部の一部のみがプリント基板２の表面に接する。即ち、リッド１１がプリント基板２に取付けられた状態では、電子部品３からの配線１８をプリント基板２の表面において隙間部１５を通じて引出すことが可能となる。 In the above configuration, when the lid 11 is attached to the printed circuit board 2, a gap portion 15 is formed in the side surface portion 13 of the lid 11, so that the entire lower end portion of the side surface portion 13 is the surface of the printed circuit board 2. Only a part of the lower end of the side surface 13 is in contact with the surface of the printed circuit board 2. That is, in the state where the lid 11 is attached to the printed circuit board 2, the wiring 18 from the electronic component 3 can be pulled out through the gap 15 on the surface of the printed circuit board 2.

第１実施形態によれば、以下に示す作用効果を得ることができる。電子部品１において、リッド１１の側面部１３にプリント基板２の表面に接しない隙間部１５を設け、電子部品３からの配線１８を、隙間部１５を通じて引出すように構成した。配線１８をプリント基板２の内層に引回す必要がなくなると共に、リッド１１が配線１８に接触することもなくなる。これにより、電子部品３の配線自由度を低下させることなく、放熱性及び耐電磁波特性を適切に確保することができる。 According to the first embodiment, the following effects can be obtained. In the electronic component 1, a gap portion 15 that does not contact the surface of the printed circuit board 2 is provided on the side surface portion 13 of the lid 11, and the wiring 18 from the electronic component 3 is drawn out through the gap portion 15. It is not necessary to route the wiring 18 to the inner layer of the printed circuit board 2, and the lid 11 does not come into contact with the wiring 18. As a result, heat dissipation and electromagnetic wave resistance can be appropriately ensured without reducing the degree of freedom of wiring of the electronic component 3.

又、電子部品３とリッド１１との間に放熱ゲル１６を設けたので、電子部品３から発せられた熱の拡散を放熱ゲル１６により促進させることができ、放熱性を高めることができる。以上は、電子部品３からの配線１８を図５中で右方向に引出す構成を例示したが、電子部品３からの配線１８を図５中で左方向や上下方向に引出す構成でも良い。又、４方向の側面部１３の全てに隙間部１５を設ける構成を例示したが、電子部品３からの配線１８を引出す方向の側面部１３のみに隙間部１５を設ける構成でも良い。隙間部１５を設ける箇所を必要最小限とすることで、放熱性及び耐電磁波特性をより適切に確保することができる。 Further, since the heat radiating gel 16 is provided between the electronic component 3 and the lid 11, the heat radiating gel 16 can promote the diffusion of heat generated from the electronic component 3, and the heat radiating property can be improved. In the above, the configuration in which the wiring 18 from the electronic component 3 is pulled out to the right in FIG. 5 is illustrated, but the wiring 18 from the electronic component 3 may be pulled out in the left direction or the vertical direction in FIG. Further, although the configuration in which the gap portions 15 are provided in all of the side surface portions 13 in the four directions is illustrated, the configuration in which the gap portions 15 are provided only in the side surface portions 13 in the direction in which the wiring 18 from the electronic component 3 is drawn out may be used. By minimizing the number of places where the gap 15 is provided, heat dissipation and electromagnetic wave resistance can be more appropriately ensured.

（第２実施形態）
第２実施形態について図７から図１３を参照して説明する。図８は図７のＡ５−Ａ６に沿う縦断側面を示す。第２実施形態は、第１プリント基板上に第２プリント基板が実装され、第２プリント基板上に電子部品が実装されている点で、前述した第１実施形態と異なる。第１プリント基板はマザー基板として機能し、第２プリント基板はモジュール基板として機能する。 (Second Embodiment)
The second embodiment will be described with reference to FIGS. 7 to 13. FIG. 8 shows a longitudinal side surface along A5-A6 of FIG. The second embodiment is different from the above-described first embodiment in that the second printed circuit board is mounted on the first printed circuit board and the electronic components are mounted on the second printed circuit board. The first printed circuit board functions as a mother board, and the second printed circuit board functions as a module board.

電子機器２１は、平板形状の第１プリント基板２２と、第１プリント基板２２上に実装されている第２プリント基板２３と、電子部品２４，２５とを有する。電子部品２４，２５は、例えばボールグリッドアレイパッケージ型の半導体素子であり、第２プリント基板２３の長手方向に並んで実装されている The electronic device 21 includes a flat plate-shaped first printed circuit board 22, a second printed circuit board 23 mounted on the first printed circuit board 22, and electronic components 24 and 25. The electronic components 24 and 25 are, for example, ball grid array package type semiconductor elements, and are mounted side by side in the longitudinal direction of the second printed circuit board 23.

第２プリント基板２３は、例えばガラス繊維を含有したエポキシ樹脂等の絶縁基材２６が多層に積層されている多層プリント基板であり、その表面、層間及び裏面に導体パターンが形成されていると共に、層間にグランドパターン２７が形成されている。第２プリント基板２３の表面には、上記した電子部品２４の多数のはんだボールに対応し、電子部品２４がはんだ接合されるための導通用のランド２８が格子状（図１では６行６列）に設けられ、電子部品２５の多数のはんだボールに対応し、電子部品２５がはんだ接合されるための導通用のランド２８が格子状（図１では６行６列）に設けられていると共に、後述するリッドが接地されるための接地用のランド２９が設けられている。第２プリント基板２３の表面には、導通用のランド２８及び接地用のランド２９を除く部分を覆うようにソルダーレジスト層３０が設けられている。接地用のランド２９は、ビア３１を介してグランドパターン２５と導通している。第２プリント基板２３の裏面には、導通用のランド３２が設けられていると共に、導通用のランド３２を除く部分を覆うようにソルダーレジスト層３３が設けられている。 The second printed circuit board 23 is a multilayer printed circuit board in which an insulating base material 26 such as an epoxy resin containing glass fibers is laminated in multiple layers, and a conductor pattern is formed on the front surface, the interlayer, and the back surface thereof, and the second printed circuit board 23 is formed. A ground pattern 27 is formed between the layers. On the surface of the second printed circuit board 23, lands 28 for conduction corresponding to a large number of solder balls of the electronic components 24 described above and for soldering the electronic components 24 are arranged in a grid pattern (6 rows and 6 columns in FIG. 1). ), Corresponding to a large number of solder balls of the electronic component 25, the lands 28 for conduction for soldering the electronic component 25 are provided in a grid pattern (6 rows and 6 columns in FIG. 1). A grounding land 29 for grounding the lid, which will be described later, is provided. A solder resist layer 30 is provided on the surface of the second printed circuit board 23 so as to cover a portion other than the land 28 for conduction and the land 29 for grounding. The grounding land 29 is electrically connected to the ground pattern 25 via the via 31. On the back surface of the second printed circuit board 23, a land 32 for conduction is provided, and a solder resist layer 33 is provided so as to cover a portion other than the land 32 for conduction.

電子部品２４，２５を第２プリント基板２３に実装する工程では、電子部品２４，２５のはんだボールを導通用のランド２８に対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。はんだが硬化してはんだ接合部３４が形成されることで、電子部品２４，２５が第２プリント基板２３に電気的及び物理的に接続される。 In the process of mounting the electronic components 24 and 25 on the second printed circuit board 23, the solder balls of the electronic components 24 and 25 are aligned and overlapped with respect to the land 28 for conduction, and heated while controlling the temperature to perform solder bonding. Do. By curing the solder and forming the solder joint portion 34, the electronic components 24 and 25 are electrically and physically connected to the second printed circuit board 23.

第１プリント基板２２は、例えばガラス繊維を含有したエポキシ樹脂等の絶縁基材３５が多層に積層されている多層プリント基板であり、その表面及び層間に導体パターンが形成されていると共に、層間にグランドパターン３６が形成されている。第１プリント基板２２の表面には、上記した第２プリント基板２３の裏面の導通用のランド３２に対応し、導通用のランド３７が設けられていると共に、後述するリッドが接地されるための接地用のランド３８が設けられている。又、第１プリント基板２２の表面には、導通用のランド３７及び接地用のランド３８を除く部分を覆うようにソルダーレジスト層３９が設けられている。接地用のランド３８は、ビア４０を介してグランドパターン３６と導通している。 The first printed circuit board 22 is a multilayer printed circuit board in which an insulating base material 35 such as an epoxy resin containing glass fibers is laminated in multiple layers, and a conductor pattern is formed on the surface and between layers thereof, and between the layers. The ground pattern 36 is formed. The front surface of the first printed circuit board 22 is provided with a land 37 for conduction corresponding to the land 32 for conduction on the back surface of the second printed circuit board 23 described above, and a lid to be described later is grounded. A land 38 for grounding is provided. Further, a solder resist layer 39 is provided on the surface of the first printed circuit board 22 so as to cover a portion other than the land 37 for conduction and the land 38 for grounding. The ground 38 for grounding is conducting with the ground pattern 36 via the via 40.

第２プリント基板２３を第１プリント基板２２に実装する工程では、第２プリント基板２３を第１プリント基板２２に対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。はんだが硬化してはんだ接合部４１が形成されることで、第２プリント基板２３が第１プリント基板２２に電気的及び物理的に接続される。尚、第２プリント基板２３が第１プリント基板２２上に実装された状態では、電子部品２４に導通する導通用のランド２８が第１プリント基板２２の表面に設けられている中継用のランド（図示せず）と導通し、その中継用のランドから電子部品２４からの配線が引出される。又、電子部品２５に導通する導通用のランド２８が第１プリント基板２２の表面に設けられている中継用のランド（図示せず）と導通し、その中継用のランドから電子部品２５からの配線が引出される。 In the step of mounting the second printed circuit board 23 on the first printed circuit board 22, the second printed circuit board 23 is aligned with and overlapped with the first printed circuit board 22, heated while controlling the temperature, and solder-bonded. By curing the solder and forming the solder joint 41, the second printed circuit board 23 is electrically and physically connected to the first printed circuit board 22. In the state where the second printed circuit board 23 is mounted on the first printed circuit board 22, the land 28 for conduction that conducts to the electronic component 24 is provided on the surface of the first printed circuit board 22 for relaying. (Not shown), and the wiring from the electronic component 24 is pulled out from the land for relaying. Further, the conduction land 28 conducting the electronic component 25 conducts with the relay land (not shown) provided on the surface of the first printed circuit board 22, and the relay land from the relay land 25 is transmitted from the electronic component 25. The wiring is pulled out.

図９に示すように、リッド４２は、天井面部４３と、電子部品２４側において第２プリント基板２３の短手方向に平行な第１側面部４４と、電子部品２５側において第２プリント基板２３の短手方向に平行な第２側面部４５と、第２プリント基板の長手方向に平行な第３側面部４６及び第４側面部４７とを有する。天井面部４３は、第１プリント基板２２及び第２プリント基板２３に取付けられた状態で電子部品２４の上方に配置される第１天井面部４８と電子部品２５の上方に配置される第２天井面部４９と、第１天井面部４８と第２天井面部４９とを連結する連結部５０とを有する。 As shown in FIG. 9, the lid 42 includes a ceiling surface portion 43, a first side surface portion 44 parallel to the lateral direction of the second printed circuit board 23 on the electronic component 24 side, and a second printed circuit board 23 on the electronic component 25 side. It has a second side surface portion 45 parallel to the lateral direction of the second printed circuit board, and a third side surface portion 46 and a fourth side surface portion 47 parallel to the longitudinal direction of the second printed circuit board. The ceiling surface portion 43 is a second ceiling surface portion arranged above the first ceiling surface portion 48 and the electronic component 25 arranged above the electronic component 24 in a state of being attached to the first printed circuit board 22 and the second printed circuit board 23. It has a 49 and a connecting portion 50 that connects the first ceiling surface portion 48 and the second ceiling surface portion 49.

図１０にも示すように、第１側面部４４は、第１天井面部４８に連なる第１傾斜部５１と、第２傾斜部５２と、第１傾斜部５１と第２傾斜部５２とを連結する第１連結部５３とを有する。第２傾斜部５２は、その下端部が櫛状に形成されており、リッド４２が取付けられた状態で第１プリント基板２２の表面に接する接触部５４と、第１プリント基板２２の表面に接しない隙間部５５とが交互に配置されている。リッド４２の第１側面部４４の第２傾斜部５２における接触部５４及び隙間部５５は、それぞれ第１実施形態で説明したリッド１１の側面部１３における接触部１４及び隙間部１５と同等である。 As shown in FIG. 10, the first side surface portion 44 connects the first inclined portion 51 connected to the first ceiling surface portion 48, the second inclined portion 52, and the first inclined portion 51 and the second inclined portion 52. It has a first connecting portion 53 to be formed. The lower end of the second inclined portion 52 is formed in a comb shape, and is in contact with the contact portion 54 in contact with the surface of the first printed circuit board 22 and the surface of the first printed circuit board 22 with the lid 42 attached. The gaps 55 that do not form are arranged alternately. The contact portion 54 and the gap portion 55 in the second inclined portion 52 of the first side surface portion 44 of the lid 42 are equivalent to the contact portion 14 and the gap portion 15 in the side surface portion 13 of the lid 11 described in the first embodiment, respectively. ..

図１１にも示すように、第２側面部４５は、第２天井面部４９に連なる第３傾斜部５６と、第４傾斜部５７と、第３傾斜部５６と第４傾斜部５７とを連結する第２連結部５８とを有する。第４傾斜部５７は、その下端部が櫛状に形成されており、リッド４２が取付けられた状態で第１プリント基板２２の表面に接する接触部５９と、第１プリント基板２２の表面に接しない隙間部６０とが交互に配置されている。リッド４２の第２側面部４５の第４傾斜部５７における接触部５９及び隙間部６０も、それぞれ第１実施形態で説明したリッド１１の側面部１３における接触部１４及び隙間部１５と同等である。 As shown in FIG. 11, the second side surface portion 45 connects the third inclined portion 56 connected to the second ceiling surface portion 49, the fourth inclined portion 57, and the third inclined portion 56 and the fourth inclined portion 57. It has a second connecting portion 58 to be formed. The lower end of the fourth inclined portion 57 is formed in a comb shape, and is in contact with the contact portion 59 that contacts the surface of the first printed circuit board 22 and the surface of the first printed circuit board 22 with the lid 42 attached. The gaps 60 that do not form are arranged alternately. The contact portion 59 and the gap portion 60 in the fourth inclined portion 57 of the second side surface portion 45 of the lid 42 are also equivalent to the contact portion 14 and the gap portion 15 in the side surface portion 13 of the lid 11 described in the first embodiment, respectively. ..

リッド４２を第１プリント基板２２及び第２プリント基板２３に取付けるまでの工程について図１２から図１５を参照して説明する。最初に、図１２に示すように、第２プリント基板２３を製造する。次に、図１３に示すように、電子部品２４，２５を第２プリント基板２３に実装する。次に、前述した図８に示すように、第２プリント基板２３を第１プリント基板３２に実装し、図１４に示すように、放熱ゲル６１，６２を電子部品２４，２５に配置する。そして、図１５に示すように、リッド４２を第１プリント基板２２及び第２プリント基板２３に取付ける。 The process of attaching the lid 42 to the first printed circuit board 22 and the second printed circuit board 23 will be described with reference to FIGS. 12 to 15. First, as shown in FIG. 12, the second printed circuit board 23 is manufactured. Next, as shown in FIG. 13, the electronic components 24 and 25 are mounted on the second printed circuit board 23. Next, as shown in FIG. 8 described above, the second printed circuit board 23 is mounted on the first printed circuit board 32, and the heat radiating gels 61 and 62 are arranged on the electronic components 24 and 25 as shown in FIG. Then, as shown in FIG. 15, the lid 42 is attached to the first printed circuit board 22 and the second printed circuit board 23.

リッド４２を第１プリント基板２２及び第２プリント基板２３に取付ける工程では、リッド４２の第１側面部４４の第１連結部５３及び第２側面部４５の第２連結部５８を第２プリント基板２３の接地用のランド２９に対して位置合わせして重ねると共に、第１側面部４４の接触部５４の端部及び第２側面部４３の接触部５９の端部を第１プリント基板３２の接地用のランド３８に対して位置合わせして重ね、温度制御しながら加熱し、はんだ接合を行う。はんだが硬化してはんだ接合部６３，６４が形成されることで、リッド４２が第１プリント基板２２及び第２プリント基板２３に物理的に接続されると共に接地される。 In the step of attaching the lid 42 to the first printed circuit board 22 and the second printed circuit board 23, the first connecting portion 53 of the first side surface portion 44 of the lid 42 and the second connecting portion 58 of the second side surface portion 45 are connected to the second printed circuit board. While aligning and overlapping with the grounding land 29 of 23, the end of the contact portion 54 of the first side surface portion 44 and the end of the contact portion 59 of the second side surface portion 43 are grounded on the first printed circuit board 32. It is aligned with the land 38 for use, overlapped, heated while controlling the temperature, and solder-bonded. When the solder is hardened to form the solder joints 63 and 64, the lid 42 is physically connected to the first printed circuit board 22 and the second printed circuit board 23 and is grounded.

上記した構成では、リッド４２が第１プリント基板２２及び第２プリント基板２３に取付けられた状態では、リッド４２の第１側面部４４において隙間部５５が形成されていることで、第１側面部４４の下端部の全体が第１プリント基板２２の表面に接するのではなく、第１側面部４４の下端部の一部のみが第１プリント基板２２の表面に接する。即ち、リッド４２が第１プリント基板２２及び第２プリント基板２３に取付けられた状態では、電子部品２４からの配線を第１プリント基板２２の表面において隙間部５５を通じて図７や図８中で左方向に引出すことが可能となる。又、リッド４２の第２側面部４５において隙間部５９が形成されていることで、第２側面部４５の下端部の全体が第１プリント基板２２の表面に接するのではなく、第２側面部４５の下端部の一部のみが第１プリント基板２２の表面に接する。即ち、リッド４２が第１プリント基板２２及び第２プリント基板２３に取付けられた状態では、電子部品２５からの配線を第１プリント基板２２の表面において隙間部５９を通じて図７や図８中で右方向に引出すことが可能となる。 In the above configuration, when the lid 42 is attached to the first printed circuit board 22 and the second printed circuit board 23, a gap portion 55 is formed in the first side surface portion 44 of the lid 42, so that the first side surface portion is formed. The entire lower end of the 44 is not in contact with the surface of the first printed circuit board 22, but only a part of the lower end of the first side surface 44 is in contact with the surface of the first printed circuit board 22. That is, in a state where the lid 42 is attached to the first printed circuit board 22 and the second printed circuit board 23, the wiring from the electronic component 24 is passed through the gap 55 on the surface of the first printed circuit board 22 to the left in FIGS. 7 and 8. It is possible to pull out in the direction. Further, since the gap portion 59 is formed in the second side surface portion 45 of the lid 42, the entire lower end portion of the second side surface portion 45 does not come into contact with the surface of the first printed circuit board 22, but the second side surface portion. Only a part of the lower end of the 45 is in contact with the surface of the first printed circuit board 22. That is, in a state where the lid 42 is attached to the first printed circuit board 22 and the second printed circuit board 23, the wiring from the electronic component 25 is passed through the gap 59 on the surface of the first printed circuit board 22 to the right in FIGS. 7 and 8. It is possible to pull out in the direction.

第２実施形態によれば、以下に示す作用効果を得ることができる。電子機器２１において、リッド４２の第１側面部４４に第１プリント基板２２の表面に接しない隙間部５５を設け、電子部品２４からの配線を、隙間部５５を通じて引出し、第２側面部４５に第１プリント基板２２の表面に接しない隙間部５９を設け、電子部品２５からの配線を、隙間部５９を通じて引出すように構成した。第１プリント基板２２上に第２プリント基板２３が実装され、第２プリント基板２３上に電子部品２４，２５が実装されている構成においても、第１実施形態と同様の効果を得ることができ、電子部品２４，２５の配線自由度を低下させることなく、放熱性及び耐電磁波特性を適切に確保することができる。 According to the second embodiment, the following effects can be obtained. In the electronic device 21, the first side surface portion 44 of the lid 42 is provided with a gap portion 55 that does not contact the surface of the first printed circuit board 22, and the wiring from the electronic component 24 is drawn out through the gap portion 55 to the second side surface portion 45. A gap 59 that does not come into contact with the surface of the first printed circuit board 22 is provided, and the wiring from the electronic component 25 is drawn out through the gap 59. Even in a configuration in which the second printed circuit board 23 is mounted on the first printed circuit board 22 and the electronic components 24 and 25 are mounted on the second printed circuit board 23, the same effect as in the first embodiment can be obtained. , It is possible to appropriately secure heat dissipation and electromagnetic wave resistance characteristics without lowering the degree of freedom of wiring of the electronic components 24 and 25.

又、リッド４２を第１プリント基板２２及び第２プリント基板２３の両方に接地するように構成したので、耐電磁波特性をより適切に確保することができる。尚、この場合も、電子部品２４，２５からの配線を図７や図８中で上下方向に引出す構成でも良い。 Further, since the lid 42 is configured to be grounded to both the first printed circuit board 22 and the second printed circuit board 23, the electromagnetic wave resistance characteristics can be more appropriately ensured. In this case as well, the wiring from the electronic components 24 and 25 may be drawn out in the vertical direction in FIGS. 7 and 8.

（その他の実施形態）
本開示は、実施例に準拠して記述されたが、当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、更には、それらに一要素のみ、それ以上、或いはそれ以下を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。 (Other embodiments)
The present disclosure has been described in accordance with the examples, but it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and modifications within a uniform range. In addition, various combinations and forms, as well as other combinations and forms containing only one element, more or less, are also within the scope of the present disclosure.

第１実施形態において、プリント基板２に実装されている電子部品の個数や配置態様、電子部品から配線を引出す態様は例示した以外でも良く、それらの態様に応じてリッド１１の形状やサイズをどのように構成しても良い。第２実施形態において、第１プリント基板２２に実装されている第２プリント基板２３の個数や配置態様、第２プリント基板２３に実装されている電子部品の個数や配置態様、電子部品から配線を引出す態様は例示した以外でも良く、それらの態様に応じてリッド４２の形状やサイズをどのように構成しても良い。 In the first embodiment, the number and arrangement modes of the electronic components mounted on the printed circuit board 2 and the mode of drawing out the wiring from the electronic components may not be exemplified, and the shape and size of the lid 11 may be adjusted according to these modes. It may be configured as follows. In the second embodiment, the number and arrangement mode of the second printed circuit board 23 mounted on the first printed circuit board 22, the number and arrangement mode of the electronic components mounted on the second printed circuit board 23, and the wiring from the electronic components. The mode of drawing out may be other than those illustrated, and the shape and size of the lid 42 may be configured according to those modes.

図面中、１，２１は電子機器、２はプリント基板、２２は第１プリント基板、２３は第２プリント基板、３，２４，２５は電子部品、１１はリッド、１３は側面部、４２はリッド、４４は第１側面部（側面部）、４５は第２側面部（側面部）、１４，５４，５９は接触部、１５，５５，６０は隙間部である。 In the drawings, 1, 21 are electronic devices, 2 is a printed circuit board, 22 is a first printed circuit board, 23 is a second printed circuit board, 3, 24, 25 are electronic components, 11 is a lid, 13 is a side surface, and 42 is a lid. , 44 are the first side surface portion (side surface portion), 45 is the second side surface portion (side surface portion), 14, 54, 59 are contact portions, and 15, 55, 60 are gap portions.

Claims (5)

プリント基板（２）と、
前記プリント基板上に実装されている電子部品（３）と、
金属材料から構成され、前記電子部品を覆うリッド（１１）と、を備え、
前記リッドは、その側面部（１３）に、前記プリント基板の表面に接する接触部（１４）と、前記プリント基板の表面に接しない隙間部（１５）とを有し、
前記電子部品は、前記プリント基板の表面において前記隙間部を通じて配線が引出されている電子機器（１）。 Printed circuit board (2) and
The electronic component (3) mounted on the printed circuit board and
A lid (11) made of a metal material and covering the electronic component is provided.
The lid has a contact portion (14) in contact with the surface of the printed circuit board and a gap portion (15) in contact with the surface of the printed circuit board on its side surface portion (13).
The electronic component is an electronic device (1) in which wiring is drawn out through the gap on the surface of the printed circuit board. 前記リッドは、前記プリント基板の表面に接地している請求項１に記載した電子機器。 The electronic device according to claim 1, wherein the lid is grounded to the surface of the printed circuit board. 第１プリント基板（２２）と、
前記第１プリント基板上に実装されている第２プリント基板（２３）と、
前記第２プリント基板上に実装されている電子部品（２４，２５）と、
金属材料から構成され、前記電子部品を覆うリッド（４１）と、を備え、
前記リッドは、その側面部（４４，４５）に、前記第１プリント基板の表面に接する接触部（５４，５９）と、前記第１プリント基板の表面に接しない隙間部（５５，６０）とを有し、
前記電子部品は、前記第１プリント基板の表面において前記隙間部を通じて配線が引出されている電子機器（２１）。 The first printed circuit board (22) and
The second printed circuit board (23) mounted on the first printed circuit board and
The electronic components (24, 25) mounted on the second printed circuit board and
A lid (41) made of a metal material and covering the electronic component is provided.
The lid has a side surface portion (44, 45), a contact portion (54, 59) in contact with the surface of the first printed circuit board, and a gap portion (55, 60) not in contact with the surface of the first printed circuit board. Have,
The electronic component is an electronic device (21) in which wiring is drawn out through the gap on the surface of the first printed circuit board. 前記リッドは、前記第１プリント基板及び第２プリント基板の両方に接地している請求項３に記載した電子機器。 The electronic device according to claim 3, wherein the lid is grounded to both the first printed circuit board and the second printed circuit board. 前記接触部及び前記隙間部は、櫛状に形成されている請求項１から４の何れか一項に記載した電子機器。 The electronic device according to any one of claims 1 to 4, wherein the contact portion and the gap portion are formed in a comb shape.
JP2019200703A 2019-11-05 2019-11-05 Electronic apparatus Pending JP2021077672A (en)

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JPH01115245U (en) * 1988-01-27 1989-08-03
JPH09153696A (en) * 1995-11-30 1997-06-10 Kyocera Corp Electronic component having shield case and manufacture thereof
JP2001160698A (en) * 1999-12-01 2001-06-12 Mitsubishi Electric Corp Electromagnetic shielding structure of electronic circuit board
JP2001308235A (en) * 2000-04-26 2001-11-02 Sharp Corp Semiconductor module
JP2002076629A (en) * 2000-08-31 2002-03-15 Kyocera Corp Compound multilayer interconnection board
JP2003309397A (en) * 2002-04-15 2003-10-31 Toyo Commun Equip Co Ltd Structure of electronic device
JP2011165685A (en) * 2008-06-03 2011-08-25 Sharp Corp Shield case mounting substrate
JP2012164852A (en) * 2011-02-08 2012-08-30 Murata Mfg Co Ltd Shielding structure of semiconductor package
JP2015171110A (en) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 Electronic device, electronic apparatus and mobile object

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01115245U (en) * 1988-01-27 1989-08-03
JPH09153696A (en) * 1995-11-30 1997-06-10 Kyocera Corp Electronic component having shield case and manufacture thereof
JP2001160698A (en) * 1999-12-01 2001-06-12 Mitsubishi Electric Corp Electromagnetic shielding structure of electronic circuit board
JP2001308235A (en) * 2000-04-26 2001-11-02 Sharp Corp Semiconductor module
JP2002076629A (en) * 2000-08-31 2002-03-15 Kyocera Corp Compound multilayer interconnection board
JP2003309397A (en) * 2002-04-15 2003-10-31 Toyo Commun Equip Co Ltd Structure of electronic device
JP2011165685A (en) * 2008-06-03 2011-08-25 Sharp Corp Shield case mounting substrate
JP2012164852A (en) * 2011-02-08 2012-08-30 Murata Mfg Co Ltd Shielding structure of semiconductor package
JP2015171110A (en) * 2014-03-10 2015-09-28 セイコーエプソン株式会社 Electronic device, electronic apparatus and mobile object

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