JP2015171110A - Electronic device, electronic apparatus and mobile object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device, an electronic apparatus and a mobile object, which can inhibit deterioration in characteristics associated with electromagnetic interference.SOLUTION: An electromagnetic device 1 comprises: a package (case) 2 which has a first region S1 sandwiched by a lid 27 and a conductive layer 302 included in a support substrate 3, and a second region S2 sandwiched by a conductive layer 2122 included in a bottom plate 212 and the conductive layer 302 included in the support substrate 3; an oscillation circuit 51 (first electric circuit) arranged in the first region S1, for causing a SAW resonator 4 to oscillate; and a multiplication circuit 52 and an output circuit 53 (both is second electric circuit) arranged in the second region S2, for processing a frequency signal output from the oscillation circuit 51.

Description

  The present invention relates to an electronic device, an electronic apparatus, and a moving object.

  Conventionally, an oscillator using a SAW resonator or a crystal resonator is known and widely used as a reference frequency source or an oscillation source of various electronic devices.

  Such an oscillator includes an oscillation circuit that oscillates a SAW (Surface Acoustic Wave) resonator and a crystal resonator, a multiplication circuit that multiplies an output frequency from the oscillation circuit, and an output frequency from the multiplication circuit in a predetermined output format. An output circuit for converting the data into an output is provided. By combining these circuits, a clock signal having a target frequency can be output from the output circuit.

  However, since these circuits are mounted in the same oscillator, other circuits may receive electromagnetic interference due to electromagnetic interference generated from one circuit, for example. As a result, the output signal may become unstable or the operation of the circuit may become abnormal. For example, abnormal oscillation in the oscillation circuit, increase in jitter in the output signal, increase in phase noise included in the output signal, and the like can be mentioned.

  One means for suppressing such problems due to electromagnetic interference is an electromagnetic shield. Patent Document 1 discloses a metal base, a first dielectric substrate having a first RF semiconductor device mounted on an upper surface, a second dielectric substrate having a second RF semiconductor device mounted on an upper surface, and a metal cover. An RF circuit module including the above is disclosed. In this RF circuit module, the first dielectric substrate is placed on the metal base, the second dielectric substrate is placed on the first dielectric substrate, and the second dielectric substrate is further placed. A metal cover is placed on the first dielectric substrate so as to enclose the substrate. As a result, the second RF semiconductor device can be electrically shielded by being shielded by the metal cover.

JP 2000-174204 A

  However, as a result of various studies, it has been found that when an oscillation circuit, a multiplier circuit, an output circuit, and the like are mounted in the same oscillator, selection of the mounting position of each circuit is important.

  However, Patent Document 1 does not provide any guideline for selecting the mounting position of each circuit. For this reason, the electromagnetic interference between the circuits is not sufficiently suppressed. Therefore, the characteristics of the oscillator may be deteriorated.

  An object of the present invention is to provide an electronic device, an electronic apparatus, and a moving body that can suppress deterioration of characteristics due to electromagnetic interference.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
The electronic device of this application example includes a first electric circuit that oscillates a vibrator,
A second electric circuit for converting a signal output from the first electric circuit into a signal different from the signal;
A first region in which the first electric circuit is disposed between the first electrodes having a reference potential, and the first electric circuit and the first electrode overlap in plan view And the second electric circuit is disposed so as to be sandwiched between the second electrodes having a reference potential, and the second electric circuit and the second electrode overlap in plan view. A container having a second region;
It is provided with.

  As a result, electromagnetic interference between the first electric circuit and the second electric circuit is reduced, so that deterioration in characteristics due to electromagnetic interference between the first electric circuit and the second electric circuit can be suppressed. An electronic device is obtained.

[Application Example 2]
In the electronic device according to this application example, the container includes a bottom plate having at least an insulating layer and a conductor layer, a side wall standing from the bottom plate, and a region surrounded by the side wall. The layer is preferably an electrode that is at a reference potential.

  Accordingly, the container functions as an electromagnetic shield layer that blocks or attenuates an external signal (noise). Furthermore, since the lid functions as a structure for improving the strength of the container, the mechanical strength of the container is increased, and the reliability of the container can be further increased.

[Application Example 3]
In the electronic device according to this application example, the container includes a lid body that has conductivity and is disposed so as to overlap the side wall and the region surrounded by the side wall in a plan view. Is preferably an electrode having a reference potential.
Accordingly, the container functions as an electromagnetic shield layer that blocks or attenuates an external signal (noise).

[Application Example 4]
The electronic device according to this application example includes a first surface and a second surface that are in a front-back relationship with each other, and the first surface is located between the first region and the second region such that the first surface faces the first region. Having a substrate provided on the
The substrate includes at least a first insulating layer, a second insulating layer, and a conductor layer between the first insulating layer and the second insulating layer, and the conductor layer is an electrode having a reference potential. It is preferable.

  As a result, the conductor layer blocks or attenuates a signal (noise) that is transmitted therethrough, and thus the function of the electromagnetic shield layer can be imparted to the substrate with a simple structure. As a result, the electronic device can be reduced in size and thickness.

[Application Example 5]
In the electronic device of this application example, when the container is viewed in plan, the substrate is disposed so as to overlap the side wall and the region surrounded by the side wall,
An electronic component constituting the first electric circuit is arranged on the first surface side of the substrate, and an electronic component constituting the second electric circuit is arranged on the second surface side of the substrate. It is preferable that

  As a result, the electronic components constituting the first electric circuit can be arranged on the first surface of the substrate, and the electronic components constituting the second electric circuit can be arranged on the second surface of the substrate. The wiring for electrically connecting the electronic components can be shortened, and the generation level of electromagnetic interference waves radiated from the wiring in the first electric circuit and the second electric circuit can be reduced. The possibility that the electromagnetic interference wave radiated from the side is transmitted can be reduced. In addition, the substrate acts to reinforce the container and contributes to further improving the reliability of the container.

[Application Example 6]
In the electronic device according to this application example, the conductor layer included in the bottom plate, the lid, and the conductor layer included in the substrate are electrically connected to each other.
Of the set of the conductor layer provided in the bottom plate and the set of the conductor layer provided in the substrate, and the set of the conductive layer provided in the substrate and the cover body, one set is the first electrode, and the other Is the second electrode,
When the container is viewed in plan, the conductor layer included in the bottom plate, the lid, and the conductor layer included in the substrate are each in a region where the electronic component on the first surface side is disposed, and It is preferable to cover a region where the electronic component on the second surface side is disposed.

  As a result, the conductor layer provided on the bottom plate, the lid, and the conductor layer provided on the substrate are equipotential, and since these cover the area where the electronic component is disposed, the function of the electromagnetic shield layer Can be further strengthened.

[Application Example 7]
In the electronic device according to this application example, one of the region sandwiched between the bottom plate and the substrate and the region sandwiched between the lid and the substrate is the first region, and the other is the first region. Two regions are preferred.
Accordingly, it is possible to suppress deterioration of characteristics due to electromagnetic interference while effectively using the internal space of the container, and thus a small, thin, and highly reliable electronic device can be obtained.

[Application Example 8]
In the electronic device of this application example, it is preferable that the first insulating layer and the second insulating layer of the substrate are made of ceramics.
Thereby, a board | substrate with high intensity | strength is obtained.

[Application Example 9]
An electronic apparatus according to this application example includes the electronic device according to the application example described above.
As a result, a highly reliable electronic device can be obtained.

[Application Example 10]
The moving body of this application example includes the electronic device of the application example described above.
Thereby, a mobile body with high reliability is obtained.

It is a perspective view which shows embodiment of the electronic device of this invention. It is sectional drawing of the electronic device shown in FIG. It is a top view of the base substrate which the electronic device shown in FIG. 1 has, (a) is a top view, (b) is the permeation | transmission figure of the lower surface seen from the upper side. It is sectional drawing of the electronic device shown in FIG. It is a perspective view which shows the state which removed the lid (lid body) of the electronic device shown in FIG. It is a top view of the support substrate which the electronic device shown in FIG. 1 has. It is a block diagram of the circuit which the electronic device shown in FIG. 1 has. FIG. 2 is a cross-sectional view and a top transparent view of a SAW resonator included in the electronic device shown in FIG. 1. It is the same figure as sectional drawing of the electronic device shown in FIG. 4, Comprising: It is the figure which showed the circuit with the block diagram. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. It is a perspective view which shows the motor vehicle to which the mobile body of this invention is applied.

  Hereinafter, an electronic device, an electronic apparatus, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

1. Electronic Device FIG. 1 is a perspective view showing an embodiment of an electronic device of the present invention. FIG. 2 is a cross-sectional view of the electronic device shown in FIG. FIG. 3 is a plan view of a base substrate (container) included in the electronic device shown in FIG. 1, wherein (a) is a top view and (b) is a transparent view of the bottom surface as viewed from above. FIG. 4 is a cross-sectional view of the electronic device shown in FIG. FIG. 5 is a perspective view showing a state in which the lid (lid) of the electronic device shown in FIG. 1 is removed. FIG. 6 is a plan view of a support substrate included in the electronic device shown in FIG. FIG. 7 is a block diagram of a circuit included in the electronic device shown in FIG. 8A and 8B are views of the SAW resonator included in the electronic device shown in FIG. 1, in which FIG. 8A is a cross-sectional view and FIG. FIG. 9 is the same view as the cross-sectional view of the electronic device shown in FIG. 4, and shows a circuit in a block diagram. In the following, for convenience of explanation, the upper side in FIG. 2 is referred to as “upper” and the lower side is referred to as “lower”. In FIG. 9, for convenience of explanation, illustration of electronic components is omitted.

  An electronic device 1 shown in FIG. 1 includes a package 2, a support substrate (substrate) 3 fixed in the package 2, a SAW resonator (vibrator) 4 and a circuit 5 mounted on the support substrate 3, And an electronic device constituting a voltage controlled SAW oscillator (VCSO). Hereinafter, each of these components will be described sequentially.

≪Package≫
As shown in FIGS. 1 and 2, the package 2 has a base substrate (container) 21 and a lid (lid body) 27 joined to the base substrate 21. In the package 2, an internal space S is provided between the base substrate 21 and the lid 27, and the support substrate 3, the SAW resonator 4, and the circuit 5 are accommodated and disposed in the internal space S.

  As shown in FIGS. 3A and 3B, the base substrate 21 has a box shape having a recess 211 opened on the upper surface. In other words, the base substrate 21 includes a plate-shaped bottom plate 212, a frame-shaped side wall 213 standing from the edge of the upper surface of the bottom plate 212, and a region 214 surrounded by the side wall 213. Yes. Since the base substrate 21 having such a shape has high mechanical strength, the reliability of the package 2 can be improved. The base substrate 21 has a substantially rectangular shape in plan view, and has a pair of side surfaces 21a and 21b extending in the major axis direction and a pair of side surfaces 21c and 21d extending in the minor axis direction.

  Further, the side surface 21a is provided with three cutout portions 231, 232, 233 extending from the upper surface to the lower surface, and the cutout portions 231, 232, 233 are arranged in the central portion so as to avoid both end portions of the side surface 21a. It is arranged close to. Similarly, the side surface 21b is also provided with three notches 234, 235, 236 extending from the upper surface to the lower surface, and these notches 234, 235, 236 avoid both ends of the side surface 21b. It is arranged near the center. As will be described later, casters are formed in these notches 231 to 236.

  Further, the side surface 21c is provided with a notch 237 extending from the upper surface to the lower surface, and the notch 237 is provided at the center of the side surface 21c. Similarly, the side surface 21d is also provided with a notch 238 extending from the upper surface to the lower surface, and the notch 238 is provided at the center of the side surface 21d. As will be described later, the claw portions 281 and 282 of the lid 27 are disposed in the notches 237 and 238, respectively.

  In addition, eight internal terminals 241, 242, 243, 244, 245, 246, 247, 248 are provided on the upper surface of the base substrate 21, and six external connection terminals (user terminals) are provided on the lower surface of the base substrate 21. ) 251, 252, 253, 254, 255, 256 are provided. These external connection terminals 251 to 256 include, for example, a power supply terminal, a GND terminal, and an output terminal. Further, castellations 261, 262, 263, 264, 265, 266, 267, 268 are arranged in the notches 231, 232, 233, 234, 235, 236, 237, 238.

  Specifically, the internal terminal 241 and the external connection terminal 251 are arranged side by side in the notch 231 and are electrically connected via a castellation 261. Similarly, the internal terminal 242 and the external connection terminal 252 are arranged side by side in the notch 232 and are electrically connected via a castellation 262. The internal terminal 243 and the external connection terminal 253 are arranged side by side in the notch 233 and are electrically connected via a castellation 263. Further, the internal terminal 244 and the external connection terminal 254 are arranged side by side in the notch 234 and are electrically connected via a castellation 264. Further, the internal terminal 245 and the external connection terminal 255 are arranged side by side in the notch 235 and are electrically connected via a castellation 265. In addition, the internal terminal 246 and the external connection terminal 256 are arranged side by side in the notch 236 and are electrically connected via a castellation 266. The internal terminal 247 is disposed in the notch 237 and is electrically connected to the castellation 267. The internal terminal 248 is disposed in the notch 238 and is electrically connected to the castellation 268. The castellations 267 and 268 are electrically connected to the GND terminals included in the external connection terminals 251 to 256 via wirings (not shown) formed inside the base substrate 21, respectively. Further, the internal terminal 241 and the external connection terminal 251, the internal terminal 242 and the external connection terminal 252, the internal terminal 243 and the external connection terminal 253, the internal terminal 244 and the external connection terminal 254, the internal terminal 245 and the external connection terminal 255, and the internal terminal In addition to the state as described above, the electrical connection between the H.246 and the external connection terminal 256 may be connected via a via conductor formed through the base substrate 21 or the base substrate. 21 may be connected via the wiring formed in 21, or may be connected by a configuration in which a plurality of them and castellations are combined.

  The bottom plate 212 includes an insulating layer 2121 and a conductor layer 2122 provided on the upper surface of the insulating layer 2121.

  Among these, the insulating layer 2121 is obtained by, for example, sintering a ceramic green sheet such as aluminum oxide, aluminum nitride, silicon carbide, mullite, glass / ceramic.

  On the other hand, the conductor layer 2122, the internal terminals 241 to 248, the external connection terminals 251 to 256, and the castellations 261 to 268 described above are formed on a base layer such as tungsten (W) or molybdenum (Mo) with gold ( It is obtained by coating a plating layer such as Au) or copper (Cu). For this reason, the conductor layer 2122 functions as an electromagnetic shield layer that blocks or attenuates a signal (noise) that is transmitted therethrough.

  The conductor layer 2122 is electrically connected to the GND terminal via castellations 267 and 268 and wiring not shown. For this reason, the potential of the conductor layer 2122 becomes the reference potential (GND). The reference potential is not limited to GND (ground potential) and may be a constant DC voltage.

  On the other hand, the lid 27 has a box shape having a concave portion 271 opened on the lower surface. The lid 27 has a substantially rectangular outer shape corresponding to the base substrate 21 in plan view, and includes a pair of side surfaces 27a and 27b extending in the major axis direction and a pair of side surfaces 27c and 27d extending in the minor axis direction. ,have.

  Further, as shown in FIGS. 1 and 4, the lid 27 has claw portions 281 and 282 that protrude downward from the side surfaces 27 c and 27 d, and the claw portions 281 and 282 are notched portions of the base substrate 21. 237 and 238. Then, the claw portions 281 and 282 and the castellations 267 and 268 arranged in the notches 237 and 238 are joined with, for example, solder (metal brazing material) H, so that the lid 27 is attached to the base substrate 21. It is joined. In addition to the above, the claws 281 and 282 and the castellations 267 and 268 are joined using a conductive member (conductive joint member) such as a conductive adhesive, silver solder, or gold solder. Alternatively, the claw portions 281 and 282 and the castellations 267 and 268 may be melted by welding or the like. Further, as shown in FIGS. 1 and 2, concave side portions (notch portions) 291 and 292 that open to the lower surface are formed on the side surfaces 27a and 27b of the lid 27. Contact between the lid 27 and the internal terminals 241 to 246 is prevented.

  Such a lid 27 is made of a conductive member, for example, a metal material. As a result, the lid 27 is electrically connected to the GND terminal via the solder H, the castellations 267 and 268 and the wiring (not shown), so that the lid 27 shields or attenuates an external signal (noise). Function as. The metal material constituting the lid 27 is preferably a material whose linear expansion coefficient approximates that of the base substrate 21. For example, when the constituent material of the base substrate 21 is ceramic, an alloy such as Kovar is preferable. The lid 27 only needs to have conductivity at least on its surface. For example, the lid 27 may be plated or vapor-deposited on an insulating lid surface formed of a member such as ceramic, resin, or glass, or a member in which they are mixed. Further, a structure in which metal is attached by a method such as sputtering, coating, or printing or a method in which they are mixed may be used.

≪Support substrate≫
The support substrate 3 is composed of a low-temperature co-fired ceramic substrate (LTCC substrate). Thereby, the support substrate 3 with high strength is obtained. Moreover, a wiring pattern can be formed simultaneously, the manufacturing process of the electronic device 1 can be reduced, and the electrical conductivity of the conductor layer (wiring pattern) can be increased. The support substrate 3 may be a single layer substrate or a multilayer substrate. Further, the support substrate 3 is not limited to a low-temperature co-fired ceramic substrate. For example, a ceramic substrate other than the low-temperature co-fired ceramic substrate, a resin substrate (printed substrate) made of glass epoxy or other constituent member, glass, and the like. A substrate or the like may be used.

  Such a support substrate 3 has a plate shape. The support substrate 3 has a rectangular shape corresponding to the base substrate 21 in plan view, and a pair of side surfaces connecting the upper surface (first surface) and the lower surface (second surface) extend in the major axis direction. Side surfaces 3a and 3b and a pair of side surfaces 3c and 3d extending in the minor axis direction.

  Further, the side surface 3a is provided with three cutout portions 311, 312, 313 extending from the upper surface to the lower surface, and the cutout portions 311, 312, 313 are arranged in the center so as to avoid both end portions of the side surface 3 a. It is arranged close to. Similarly, the side surface 3b is also provided with three notches 314, 315, and 316 extending from the upper surface to the lower surface, and these notches 314, 315, and 316 avoid the both ends of the side surface 3b. It is arranged near the center. The notches 311, 312, 313, 314, 315 and 316 are formed with castellations 321, 322, 323, 324, 325 and 326.

  As shown in FIG. 6, the cutout portions 311 to 316 are located on the inner side (center side of the base substrate 21) than the cutout portions 231 to 236 formed in the base substrate 21 in plan view. Yes. Further, the notch 311 is provided so as to be aligned with the notch 231 and overlap the internal terminal 241. Similarly, the notch 312 is provided so as to be aligned with the notch 232 and overlap the internal terminal 242, and the notch 313 is aligned with the notch 233 and overlap the internal terminal 243. The notch 314 is provided so as to be aligned with the notch 234 and overlap the internal terminal 244, and the notch 315 is aligned with the notch 235 and overlap the internal terminal 245. The notch 316 is provided so as to be aligned with the notch 236 and overlap the internal terminal 246.

  On the other hand, the side surface 3c is provided with a notch 317 extending from the upper surface to the lower surface, and the notch 317 is disposed at the center of the side surface 3c. Similarly, the side surface 3d is also provided with a notch 318 extending from the upper surface to the lower surface, and the notch 318 is disposed at the center of the side surface 3d. Casters 327 and 328 are formed in the notches 317 and 318, respectively.

  Further, as shown in FIG. 6, the cutout portions 317 and 318 are located on the inner side (center side of the base substrate 21) than the cutout portions 237 and 238 formed in the base substrate 21 in a plan view. Yes. Further, the notch 317 is provided to align with the notch 237 and overlap with the internal terminal 247, and the notch 318 is provided to align with the notch 238 and overlap with the internal terminal 248. ing.

  As shown in FIGS. 5 and 6, the support substrate 3 configured as described above is fixed to the base substrate 21 with eight solders H <b> 1 to H <b> 8. However, the material for fixing the support substrate 3 to the base substrate 21 is not limited to solder. For example, a metal brazing material such as gold brazing or silver brazing, a conductive adhesive, or the like may be used. The castellations 321, 322, 323, 324, 325, 326, 327, 328 and the internal terminals 241, 242, 243, 244, 245, 246, 247, 248 may be melted and joined.

  The solder H1 is located on the internal terminal 241 and forms a fillet in the notch 311. This fixes the support substrate 3 to the base substrate 21 and electrically connects the internal terminal 241 and the castellation 321. Connected to. Similarly, the solder H2 is located on the internal terminal 242 and forms a fillet in the notch 312. This fixes the support substrate 3 to the base substrate 21, and also the internal terminal 242 and the castellation 322. Are electrically connected. Further, the solder H3 is located on the internal terminal 243 and forms a fillet in the notch 313, whereby the support substrate 3 is fixed to the base substrate 21 and the internal terminal 243 and the castellation 323 are connected. Electrically connected. Further, the solder H4 is located on the internal terminal 244 and forms a fillet in the notch 314, whereby the support substrate 3 is fixed to the base substrate 21 and the internal terminal 244 and the castellation 324 are connected. Electrically connected. Further, the solder H5 is located on the internal terminal 245 and forms a fillet in the notch 315, thereby fixing the support substrate 3 to the base substrate 21 and connecting the internal terminal 245 and the castellation 325 to each other. Electrically connected. Further, the solder H6 is located on the internal terminal 246 and forms a fillet in the notch 316, whereby the support substrate 3 is fixed to the base substrate 21 and the internal terminal 246 and the castellation 326 are connected. Electrically connected. Also, the solder H7 is located on the internal terminal 247, and a fillet is formed in the notch 317, whereby the support substrate 3 is fixed to the base substrate 21 and the internal terminal 247 and the castellation 327 are connected. Electrically connected. Further, the solder H8 is located on the internal terminal 248 and forms a fillet in the notch 318, thereby fixing the support substrate 3 to the base substrate 21 and connecting the internal terminal 248 and the castellation 328 to each other. Electrically connected.

  Note that the support substrate 3 according to the present embodiment is composed of a low-temperature co-fired ceramic substrate as described above, and includes two insulating layers 301 and 301 and a conductor layer 302 provided therebetween. (See FIG. 9). For this reason, the conductor layer 302 functions as an electromagnetic shield layer that blocks or attenuates a signal (noise) that is transmitted therethrough. In addition, gold (Au), silver (Ag), copper (Cu), and alloys thereof can be used as the constituent material of the conductor layer 302, so that the electrical conductivity of the conductor layer 302 can be increased. Thereby, the function as an electromagnetic shielding layer can be improved more.

  The conductor layer 302 is electrically connected to a castellation 327 formed in the notch 317 of the support substrate 3 and a castellation 328 formed in the notch 318. Therefore, the conductor layer 302 is electrically connected to the GND terminal via the castellations 327 and 328 and wiring (not shown), and the potential of the conductor layer 302 becomes the reference potential (GND).

  Note that the number of layers in the support substrate 3 is not particularly limited, and may be three or more. In that case, the insulating layer 301 and the conductor layer 302 may be alternately stacked, or the conductor layer 302 may include one layer and three or more insulating layers 301.

≪Circuit≫
As shown in FIGS. 2, 5, and 6, the circuit 5 is mounted on the support substrate 3 with a wiring pattern (not shown) formed on the upper surface, the lower surface, and the inside of the support substrate 3, and is connected by the wiring pattern. A plurality of circuit elements (electronic components) 59. The wiring pattern is connected to the castellations 321 to 326, whereby the wiring pattern and the external connection terminals 251 to 256 are electrically connected.

As shown in FIG. 7, such a circuit 5 includes an oscillation circuit 51 that oscillates the SAW resonator 4, a multiplication circuit 52 that multiplies the output frequency f ₁ from the oscillation circuit 51, and a multiplication circuit 52. And an output circuit 53 that converts the output frequency f _n (= f ₁ × n) into a predetermined output format (CMOS, LV-PECL, LVDS, etc.) and outputs it. The multiplier circuit 52 includes a band-pass filter, passes the frequency f _n superimposed on the output frequency f ₁ from the oscillation circuit 51, and passes other frequencies (... F ₁ × (n−1), f ₁ X (n + 1)... Is attenuated to output the output frequency f _n .

  The oscillation circuit 51 and the multiplication circuit 52 of the present embodiment are each a circuit in which a plurality of discrete components are arranged, and the output circuit 53 is an integrated circuit. For this reason, the circuit element 59 includes, for example, a chip coil (chip inductor) 591, a chip capacitor 592, a varicap (variable capacitance diode) 593 and a resistor included in the oscillation circuit 51, and a multiplication circuit 52. A chip coil (chip inductor) 594 constituting the pass filter, a chip capacitor 595 and a resistor, an IC chip 596 constituting the output circuit 53, and the like are included. However, the oscillation circuit 51 and the multiplication circuit 52 may be integrated circuits similarly to the output circuit 53, or at least two circuits of the oscillation circuit 51, the multiplication circuit 52, and the output circuit 53 are included in one integrated circuit. It may be configured.

For example, the following effects can be exhibited by using discrete circuits in which the oscillation circuit 51 and the multiplication circuit 52 are not integrated circuits. The output frequency from the oscillation circuit 51 can be adjusted by replacing the chip coil 591 and the chip capacitor 592 included in the oscillation circuit 51 with ones having different inductances or capacitances, whereby the output frequency f _{1 is set} to a desired value. Can be adjusted to the frequency. Further, it is possible to adjust the passband of the band-pass filter by replacing the chip coil 594 and the chip capacitor 595 included in the multiplier circuit 52 to a different one of inductance or capacitance, thereby, other than the output frequency f _n The frequency can be further attenuated, and spurious (unnecessary signal) can be suppressed. Thus, various adjustments of the electronic device 1 can be easily performed by using the circuit in which the discrete components are arranged without using the oscillation circuit 51 and the multiplication circuit 52 as an integrated circuit. Since the output circuit 53 has little room for adjustment like the oscillation circuit 51 and the multiplication circuit 52, the circuit 5 can be reduced in size by being an integrated circuit.

  The circuit 5 may include, for example, a temperature compensation circuit in addition to the circuits 51, 52, and 53. In addition, when the frequency to be output from the electronic device 1 can be output from the oscillation circuit 51, the multiplication circuit 52 may be omitted. The circuit 5 includes a SAW resonator 4 for outputting a first frequency signal, an oscillation circuit 51 and a multiplication circuit 52 (first set), and a second frequency signal having a frequency different from that of the first frequency signal. Including a SAW resonator 4, an oscillation circuit 51 and a multiplier circuit 52 (second set), a switching circuit for switching between the first set and the second set, and an output circuit 53. By switching between one set and the second set, one of the first frequency signal and the second frequency signal may be selected and output from the output circuit 53.

≪SAW resonator≫
As shown in FIGS. 8A and 8B, the SAW resonator 4 includes a package 45 and a SAW resonator piece 41 accommodated in the package 45.

  The package 45 includes a ceramic base substrate 46 having a recess 461 opened on the upper surface, and a plate-like metal cover 47 joined to the ceramic base substrate 46 so as to close the opening of the recess 461. Yes. Further, internal terminals 481 and 482 that are electrically connected to the SAW resonator element 41 are provided on the bottom surface of the recess 461, and vias (through electrodes) (not shown) are provided on the bottom surface of the ceramic base substrate 46. External connection terminals 483 and 484 electrically connected to the internal terminals 481 and 482 and external connection terminals 485 and 486 for joining to the support substrate 3 are provided.

  The SAW resonator element 41 includes a quartz substrate 411 having a longitudinal shape, an IDT (comb electrode) 412 provided on the upper surface of the quartz substrate 411, and a pair of reflectors 413 and 414 disposed on both sides of the IDT 412. , Bonding pads 415 and 416, and extraction electrodes 417 and 418 that electrically connect the IDT 412 and the bonding pads 415 and 416. In addition, instead of the SAW resonator piece 41, a crystal resonator piece using quartz as a substrate material, for example, an AT-cut or SC-cut crystal resonator piece, a MEMS (Micro Electro Mechanical Systems) resonator piece, or the like The vibrator piece using the substrate material may be used. Further, as a substrate material of the SAW resonator piece 41, the MEMS vibrator piece, and the vibrator piece, a piezoelectric single crystal such as lithium tantalate and lithium niobate, and a piezoelectric material such as lead zirconate titanate as well as quartz. A piezoelectric material such as ceramics or a silicon semiconductor material may be used. As a means for exciting the SAW resonator piece 41, the MEMS vibrator piece, and the vibrator piece, one using a piezoelectric effect may be used, or electrostatic driving using a Coulomb force may be used.

  The IDT 412 is composed of a pair of electrodes 412 a and 412 b provided at the center in the longitudinal direction of the quartz substrate 411. The pair of electrodes 412a and 412b are arranged so that the electrode fingers of the electrode 412a and the electrode fingers of the electrode 412b are engaged with each other. When a voltage is applied between the pair of electrodes 412a and 412b, periodic distortion occurs between the electrode fingers due to the piezoelectric effect of the crystal substrate 411, and surface acoustic waves are excited on the crystal substrate 411. The excited surface acoustic wave propagates along the continuous direction of the electrode fingers.

  The pair of reflectors 413 and 414 are disposed on both sides of the IDT 412 in the longitudinal direction of the crystal substrate 411. The reflectors 413 and 414 have a function of reflecting the surface acoustic wave excited by the IDT 412 and propagating to the quartz substrate 411 toward the IDT 412.

  The IDT 412 and the reflectors 413 and 414 as described above are formed so as to be shifted to one end side in the longitudinal direction of the quartz substrate 411, and a pair of bonding pads 415 on the upper surface of the other end side of the quartz substrate 411, 416 is arranged. Further, the bonding pad 415 and the electrode 412a are electrically connected via the lead electrode 417, and the bonding pad 416 and the electrode 412b are electrically connected via the lead electrode 418.

  Such a SAW resonator element 41 is disposed on the ceramic base substrate 46 via a bonding member. Bonding pads 415 and 416 are electrically connected to internal terminals 481 and 482 via bonding wires.

  Such a SAW resonator 4 can easily cope with a high frequency (for example, a frequency in the GHz band) as compared with, for example, an AT cut crystal resonator. Therefore, by using the SAW resonator 4, the electronic device 1 suitable for high-frequency output is obtained. More specifically, since the frequency of the AT-cut quartz resonator depends on the thickness of the quartz substrate, the quartz substrate becomes thinner and more difficult to process as the frequency increases. On the other hand, since the frequency of the SAW resonator depends not on the thickness of the quartz substrate but on the distance between the electrode fingers of the IDT, the higher the frequency, the shorter the distance between the electrode fingers. Can be easily performed by an existing patterning technique. For this reason, the electronic device 1 suitable for high frequency is obtained by using the SAW resonator.

Such a SAW resonator 4 is connected to the support substrate 3 by a conductive bonding member such as solder, conductive adhesive, silver brazing, or gold brazing, and is connected to the oscillation circuit 51 via the conductive bonding member. Electrically connected.
The configuration of the electronic device 1 has been described in detail above.

  In the electronic device 1 having such a configuration, the internal space S is divided via the support substrate 3. Specifically, in the internal space S, a first region S1 sandwiched between the lid 27 and the support substrate 3 and a second region S2 sandwiched between the bottom plate 212 and the support substrate 3 are formed. . In FIG. 9, the first region S1 is indicated by sparse dots, and the second region S2 is indicated by dense dots.

  In the first area S1 and the second area S2, the above-described circuit 5 is separately arranged. Specifically, the oscillation circuit 51 shown in FIG. 7 is arranged in the first region S1, and the multiplication circuit 52 and the output circuit 53 shown in FIG. 7 are arranged in the second region S2. In FIG. 9, the oscillation circuit 51, the multiplication circuit 52, and the output circuit 53 are shown as block diagrams.

  Here, the first region S <b> 1 is a region sandwiched between the lid 27 and the support substrate 3. As described above, the lid 27 has conductivity, and the support substrate 3 includes the conductor layer 302. It has. Therefore, at least a part of the first region S1 is covered with a pair of electrodes (first electrodes) facing each other.

  On the other hand, the second region S2 is a region sandwiched between the bottom plate 212 and the support substrate 3. As described above, the bottom plate 212 includes the conductor layer 2122, and the support substrate 3 includes the conductor layer 302. I have. Therefore, at least a part of the second region S2 is covered with a pair of electrodes (second electrodes) corresponding to each other.

  In the first region S1 and the second region S2, the signal (noise) from the outside can be cut off or attenuated, so that they are electromagnetically separated from each other. Note that the first electrode and the second electrode may be interchanged with each other.

  The inventor has an oscillation circuit 51 (first electric circuit) that oscillates the SAW resonator 4, a multiplication circuit 52 that processes a frequency signal output from the oscillation circuit 51, and an output circuit 53 (both are second electric circuits). Circuit), the generation level of electromagnetic interference and the resistance to electromagnetic interference were found to be different from each other. Specifically, it has been found that the oscillation circuit 51 has a relatively low resistance to electromagnetic interference, while the multiplier circuit 52 and the output circuit 53 have a relatively high generation level of electromagnetic interference waves.

  Therefore, in the present embodiment, the oscillation circuit 51 is arranged in the first region S1, and the multiplication circuit 52 and the output circuit 53 are arranged in the second region S2. As a result, for example, electromagnetic interference waves generated from the multiplication circuit 52 and the output circuit 53 are suppressed or prevented from affecting the operation of the oscillation circuit 51. Further, it is possible to suppress or prevent each circuit 5 from becoming abnormal due to an electromagnetic interference wave from the outside. As a result, it is possible to suppress deterioration in the characteristics of the electronic device 1 such as abnormal oscillation of the oscillation circuit 51, increase in jitter in the signal output from the output circuit 53, and increase in phase noise included in the output signal.

  The arrangement of the oscillation circuit 51, the multiplication circuit 52, and the output circuit 53 is not limited to the above, and for example, the oscillation circuit 51 is arranged in the second region S2, and the multiplication circuit 52 and the output circuit 53 are arranged in the first region. You may make it arrange | position to S1. Further, when the circuit 5 includes a circuit other than the oscillation circuit 51, the multiplication circuit 52, and the output circuit 53, the circuit 5 functions to process a frequency signal (signal) output from the oscillation circuit 51 (for example, oscillation) In the case of a circuit having a function of converting a signal different from a signal), it may be arranged in a region different from the oscillation circuit 51. By arranging in this way, it is possible to suppress or prevent an abnormality of the circuit 5 due to electromagnetic interference while effectively using the internal space S of the package 2, and thus a small, thin and highly reliable electronic device 1 is obtained.

  Further, when the generation level of the electromagnetic interference wave is compared between the multiplier circuit 52 and the output circuit 53, it cannot be generally stated, but the multiplier circuit 52 often has a higher generation level. For example, the oscillation circuit 51 And the output circuit 53 may be arranged in the first area S1, and the multiplication circuit 52 may be arranged in the second area S2. Conversely, the oscillation circuit 51 and the output circuit 53 are arranged in the second area S2. The multiplication circuit 52 may be arranged in the first region S1.

  In consideration of exchanging the chip coil 591 and the chip capacitor 592 included in the oscillation circuit 51 as described above, it is preferable to dispose the oscillation circuit 51 in the first region S1 from the viewpoint of easy replacement. . Similarly, when considering the replacement of the chip coil 594 and the chip capacitor 595 included in the multiplier circuit 52, it is preferable to arrange the multiplier circuit 52 in the second region S2.

  In addition, by using a laminated substrate including the conductor layer 302 as the support substrate 3, the function of the electromagnetic shield layer can be imparted to the support substrate 3 with a simple structure, so that the electronic device 1 can be reduced in size and thickness. However, the characteristic degradation of the electronic device 1 can be suppressed.

  Further, when the package 2 is viewed in plan, the support substrate 3 is disposed so as to overlap with the side wall 213 of the base substrate 21 and the region 214 surrounded by the side wall 213. Thereby, the support substrate 3 not only separates the internal space S but also acts to reinforce the package 2 and contributes to further improving the reliability of the package 2.

  In the present embodiment, the oscillation circuit 51 is disposed in the first region S1, and the multiplication circuit 52 and the output circuit 53 are disposed in the second region S2. Preferably, the support substrate 3 facing the first region S1 is provided. The oscillation circuit 51 is disposed on the upper surface, and the multiplication circuit 52 and the output circuit 53 are disposed on the lower surface of the support substrate 3 facing the second region S2. By arranging in this way, the wiring for electrically connecting the electronic components in the oscillation circuit 51 can be shortened, and the wiring for electrically connecting the electronic components in the multiplication circuit and the output circuit 53 can be shortened. Therefore, the generation level of electromagnetic interference waves radiated from the wiring in the oscillation circuit 51, the multiplication circuit 52, and the output circuit 53 can be reduced. Furthermore, since the wiring in each circuit can be shortened, the possibility that an electromagnetic interference wave radiated from each circuit to another circuit is transmitted can be reduced. Therefore, the generation level of the electromagnetic interference wave from each circuit can be suppressed, and the electrons such as abnormal oscillation of the oscillation circuit 51, increase in jitter in the signal output from the output circuit 53, and increase in phase noise included in the output signal can be suppressed. The characteristic deterioration of the device 1 can be suppressed.

  Further, as shown in FIG. 9, casters 267 and 268, internal terminals 247 and 248, solders H7 and H8, and casters are provided between the conductor layer 2122 included in the bottom plate 212 and the conductor layer 302 included in the support substrate 3. 327 and 328 are electrically connected to each other. Similarly, between the lid 27 and the conductor layer 302 included in the support substrate 3, as shown in FIG. 9, solder H and H, castellations 267 and 268, internal terminals 247 and 248, solder H7 and H8, and casters Are electrically connected to each other via the connections 327 and 328. Thereby, the conductor layer 2122 and the conductor layer 302 can be made equipotential, and the lid 27 and the conductor layer 302 can be made equipotential. As a result, the function of the electromagnetic shield layer covering the first region S1 and the second region S2 can be further strengthened, and the characteristic deterioration of the electronic device 1 due to electromagnetic interference between the circuits 5 can be further suppressed.

  Furthermore, the castellations 267 and 268 are electrically connected to the GND terminal by a wiring (not shown), so that these conductors at the same potential are electrically grounded. Thereby, the function of the electromagnetic shielding layer which covers 1st area | region S1 and 2nd area | region S2 will be further strengthened.

  Further, when the package 2 is viewed in plan, the conductor layer 2122 provided on the bottom plate 212, the lid 27, and the conductor layer 302 provided on the support substrate 3 are each provided with the circuit element (electronic component) 59 included in the oscillation circuit 51. It is preferable to cover the region and the region where the circuit element (electronic component) 59 included in the multiplier circuit 52 and the output circuit 53 is disposed. In other words, in the plan view, the first electrode constituted by the lid 27 and the conductor layer 302 described above overlaps the region where the circuit element (electronic component) 59 included in the oscillation circuit 51 is disposed. The first electrode S1 is included in the first region S1. Similarly, the second electrode constituted by the conductor layer 2122 and the conductor layer 302 described above in the plan view has the multiplier circuit 52 and the output circuit 53. It overlaps with the area where the circuit element (electronic component) 59 is arranged, and these overlapping areas are included in the second area S2. As a result, the first region S1 and the second region S2 are sandwiched and covered by the conductor layer that spreads over a common range in plan view, so that the function of the electromagnetic shield layer that covers the first region S1 and the second region S2 is achieved. It can be further strengthened.

  In this case, the conductor layer 2122 and the conductor layer 302 do not need to cover the entire area where the circuit element 59 is arranged. For example, the conductor layer 2122 and the conductor layer 302 may be partially missing or meshed. Also good. Specifically, if the area where the circuit element 59 is disposed covers an area ratio of 80% or more, the necessary and sufficient function of the electromagnetic shield layer is exhibited.

  The area where the circuit elements 59 are arranged is a rectangular area having a minimum area when assuming a rectangle including all the circuit elements 59 arranged on the upper surface or the lower surface of the support substrate 3. Say.

  In the electronic device 1, the lid 27 is fixed to the side surfaces 21 c and 21 d of the base substrate 21. For this reason, the electronic device 1 has a structure in which the support substrate 3 suppresses the long-axis and short-axis directions of the base substrate 21 and the lid 27 suppresses the long-axis direction of the base substrate 21. Thereby, the bending of the base substrate 21 is further reduced, and the mechanical strength of the base substrate 21 can be further increased.

  Further, as shown in FIGS. 3 and 6, the maximum separation distance L1 between the notches 311 to 316 and the center O of the base substrate 21 in plan view is such that the side surfaces 21a and 21b of the external connection terminals 251 to 256 ( It is shorter than the maximum distance L2 between the portion in contact with the outer edge of the lower surface and the center O of the base substrate 21. Further, a rectangular first region circumscribing the external connection terminals 251, 253, 254, and 256 includes a rectangular second region circumscribing the notches 311, 313, 314, and 316. As a result, the solders H1 to H6 that join the base substrate 21 and the support substrate 3 can be arranged closer to the center O, and thus are generated due to a difference in thermal expansion between the base substrate 21 and the support substrate 3. Stress to be reduced. Therefore, breakage of the base substrate 21 and the support substrate 3, generation of cracks in the solders H1 to H6, and the like can be reduced more effectively.

  In the present embodiment, the case where the support substrate 3 is provided with the notches 317 and 318 and the castellations 327 and 328 is described. However, the notches 317 and 318 and the castellations 327 and 328 are It may be omitted. In this case, the conductor layer 302 included in the support substrate 3 is connected to the castellations 267 and 268 via one of the castellations 321 to 326 (for example, one electrically connected to the GND terminal) and a wiring (not shown). If electrically connected, the same effect as described above can be obtained.

2. Next, an electronic apparatus including the electronic device 1 will be described.

  FIG. 10 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 11 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 12 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 incorporates an electronic device 1 that functions as a filter, a resonator, a reference clock, and the like.

  In addition to the personal computer (mobile personal computer) shown in FIG. 10, the mobile phone shown in FIG. 11, and the digital still camera shown in FIG. , Inkjet discharge devices (for example, inkjet printers), laptop personal computers, tablet personal computers, storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, televisions, video cameras, Video recorders, car navigation devices, real-time clock devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations , Videophone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various It can be applied to measuring equipment, instruments (eg, vehicle, aircraft, ship instrument), flight simulator, head mounted display, motion and race, motion tracking, motion controller, PDR (pedestrian position measurement), etc. .

3. Next, the moving body provided with the electronic device 1 will be described.

  FIG. 13 is a perspective view showing an automobile to which the moving body of the present invention is applied. An electronic device 1 is mounted on the automobile 1500. The electronic device 1 includes, for example, keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine control, brake The present invention can be widely applied to electronic control units (ECUs) such as systems, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  As mentioned above, although the electronic device, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiments, the present invention is not limited to this, and the configuration of each unit is an arbitrary configuration having the same function Can be substituted. In addition, any other component may be added to the present invention.

  In the above-described embodiment, the configuration using the SAW resonator piece as the vibrator piece has been described. However, the vibrator piece is not limited to this, for example, an AT-cut quartz crystal vibrator (thickness shear vibrator). A piece may be used, or a tuning fork vibrator (bending vibrator) piece may be used. In the above-described embodiment, the configuration in which the electronic device is applied to the voltage-controlled SAW oscillator (VCSO) has been described. However, the electronic device can also include a SAW oscillator (SPSO), a crystal oscillator (SPXO), a voltage, Control oscillators (VCXO), temperature compensated crystal oscillators (TCXO), crystal oscillators with temperature chambers (OCXO), MEMS oscillators, inertial sensors such as acceleration sensors and gyro sensors, and force sensors such as tilt sensors It can be applied to various physical quantity sensors.

DESCRIPTION OF SYMBOLS 1 ... Electronic device 2 ... Package 21 ... Base substrate 21a, 21b, 21c, 21d ... Side surface 211 ... Recessed 212 ... Bottom plate 2121 ... Insulating layer 2122 ... Conductive layer 213 ... Side wall 214 ... Area 231, 232, 233, 234, 235, 236, 237, 238... Notch 241, 242, 243, 244, 245, 246, 247, 248... Internal terminal 251, 252, 253, 254, 255, 256 ...... External connection terminals 261, 262, 263, 264, 265, 266, 267, 268 ... Castellation 27 ... Lids 27a, 27b, 27c, 27d ... Side surfaces 271 ... Recessed parts 281, 282 ... Claw parts 291 , 292... Defect 3. Support substrate 301. Insulating layer 302... Conductor layers 3 a, 3 b and 3 c 3d: Side surface 311, 312, 313, 314, 315, 316, 317, 318 ... Notch 321, 322, 323, 324, 325, 326, 327, 328 ... Castellation 4 ... SAW resonator 41 …… SAW resonator element 411 …… Quartz substrate 412 …… IDT
412a, 412b ... Electrodes 413, 414 ... Reflectors 415, 416 ... Bonding pads 417, 418 ... Lead electrodes 45 ... Packages 46 ... Ceramic base substrates 461 ... Recesses 47 ... Metal covers 481, 482 ... ... Internal terminals 483, 484 ... External connection terminals 485, 486 ... External connection terminals 5 ... Circuit 51 ... Oscillation circuit 52 ... Multiplication circuit 53 ... Output circuit 59 ... Circuit element (electronic component)
591 …… Chip coil 592 …… Chip capacitor 593 …… Varicap 594 …… Chip coil 595 …… Chip capacitor 596 …… IC chip 1100 …… Personal computer 1102 …… Keyboard 1104 …… Main body 1106 …… Display unit 1108 …… Display unit 1200 …… Cellular phone 1202 …… Operation buttons 1204 …… Earpiece 1206 …… Speaker 1208 …… Display unit 1300 …… Digital still camera 1302 …… Case 1304 …… Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer 1500 …… Automobile H, H1, H2, H3 H4, H5, H6, H7, H8 ...... solder L1, L2 ...... maximum distance O ...... center S ...... internal space S1 ...... first region S2 ...... second region

Claims (10)

A first electric circuit for oscillating the vibrator;
A second electric circuit for converting a signal output from the first electric circuit into a signal different from the signal;
A first region in which the first electric circuit is disposed between the first electrodes having a reference potential, and the first electric circuit and the first electrode overlap in plan view And the second electric circuit is disposed so as to be sandwiched between the second electrodes having a reference potential, and the second electric circuit and the second electrode overlap in plan view. A container having a second region;
An electronic device comprising:   The container includes a bottom plate having at least an insulating layer and a conductor layer, a side wall erected from the bottom plate, and a region surrounded by the side wall, and the conductor layer is an electrode having a reference potential. The electronic device according to claim 1.   The container includes a lid body that has conductivity and is disposed so as to overlap with the side wall and a region surrounded by the side wall in plan view, and the lid body is an electrode having a reference potential. The electronic device according to claim 2. A first surface and a second surface that are in a front-back relationship with each other, the substrate having a substrate provided between the first region and the second region so that the first surface faces the first region; ,
The substrate includes at least a first insulating layer, a second insulating layer, and a conductor layer between the first insulating layer and the second insulating layer, and the conductor layer is an electrode having a reference potential. The electronic device according to claim 3. When the container is viewed in plan, the substrate is disposed so as to overlap the side wall and the region surrounded by the side wall,
An electronic component constituting the first electric circuit is arranged on the first surface side of the substrate, and an electronic component constituting the second electric circuit is arranged on the second surface side of the substrate. The electronic device according to claim 4. The conductor layer included in the bottom plate, the lid, and the conductor layer included in the substrate are electrically connected to each other,
Of the set of the conductor layer provided in the bottom plate and the set of the conductor layer provided in the substrate, and the set of the conductive layer provided in the substrate and the cover body, one set is the first electrode, and the other Is the second electrode,
When the container is viewed in plan, the conductor layer included in the bottom plate, the lid, and the conductor layer included in the substrate are each in a region where the electronic component on the first surface side is disposed, and The electronic device according to claim 5, which covers a region where the electronic component on the second surface side is disposed.   5. The region between the bottom plate and the substrate and the region sandwiched between the lid and the substrate are one of the first region and the other is the second region. The electronic device according to any one of 6.   The electronic device according to claim 4, wherein the first insulating layer and the second insulating layer of the substrate are made of ceramics.   An electronic apparatus comprising the electronic device according to claim 1.   A moving body comprising the electronic device according to claim 1.

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