JPH0435917B2 - - Google Patents
Info
- Publication number
- JPH0435917B2 JPH0435917B2 JP60143944A JP14394485A JPH0435917B2 JP H0435917 B2 JPH0435917 B2 JP H0435917B2 JP 60143944 A JP60143944 A JP 60143944A JP 14394485 A JP14394485 A JP 14394485A JP H0435917 B2 JPH0435917 B2 JP H0435917B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- wiring board
- solder layer
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はプリント配線板へ電子部品を実装す
る際の半田付け方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a soldering method for mounting electronic components on a printed wiring board.
（従来の技術）
プリント配線板へ電子部品を実装する方法とし
て、電子部品の接続端子を電気的及び機械的に接
続するプリント配線板の導体（以下パツドとい
う。）にクリーム半田を塗布し、電子部品を搭載
後、半田を溶解するリフロー半田付け方法が周知
である。(Prior art) As a method of mounting electronic components on a printed wiring board, cream solder is applied to the conductors (hereinafter referred to as pads) of the printed wiring board that electrically and mechanically connect the connection terminals of the electronic components. A reflow soldering method in which solder is melted after components are mounted is well known.
そして、本方法のパツド上に塗布するクリーム
半田の形状は、端子ピツチが1.27mmのときはパツ
ドとほぼ同等の寸法を有していた。 The shape of the cream solder applied to the pad in this method had almost the same size as the pad when the terminal pitch was 1.27 mm.
しかし、電子部品の小型化が進み、接続端子の
ピツチが0.65mmと従来の約半分になると、半田層
の寸法はパツド寸法と同一では、印刷機とプリン
ト基板の集積誤差によつて、半田溶融後に隣接す
る接続端子が導通してしまういわゆる半田ブリツ
ジの事故が発生する。 However, as electronic components become smaller and the pitch of connecting terminals becomes 0.65 mm, about half of the conventional size, if the dimensions of the solder layer are the same as the pad dimensions, the solder melts due to the integration error between the printing machine and the printed circuit board. Later, a so-called solder bridge accident occurs in which adjacent connection terminals become electrically connected.
そこで、これを防止するため、従来では、(1)プ
リント配線板のパツド１４に塗布するクリーム半
田１５の幅を、第７図に示すように、パツド１４
の幅よりもわずかに狭くし、又、(2)塗布するクリ
ーム半田の厚さを通常0.2mm程度のものを0.1mm以
下と薄くするなどの対策が施されていた。 Therefore, in order to prevent this, conventionally, (1) the width of the cream solder 15 applied to the pad 14 of the printed wiring board was adjusted so that the width of the cream solder 15 was
Measures were taken such as (2) reducing the thickness of the cream solder applied, which is normally about 0.2 mm, to 0.1 mm or less.
（発明が解決しようとする問題点）
しかしながら、前記の対策(1)では、塗布幅が狭
いので、半田の粘着力によつて半田が印刷機のマ
スクを通過せず、プリント配線板のパツドに半田
がのらない、つまり半田もれの事故が発生する。
又、前記対策(2)では、電子部品の接続端子が持つ
ている製造時のばらつきによる端子浮きを半田厚
みが不足するために吸収出来ず、リフロー後に未
半田という事故が発生する。(Problem to be Solved by the Invention) However, in the above solution (1), since the coating width is narrow, the solder does not pass through the mask of the printing machine due to the adhesive force of the solder, and the solder does not stick to the pads of the printed wiring board. Accidents such as solder not adhering or solder leakage occur.
In addition, with the above-mentioned measure (2), it is not possible to absorb terminal floating due to manufacturing variations in connection terminals of electronic components due to insufficient solder thickness, resulting in an accident of unsoldering after reflow.
したがつて、これら(1)，(2)の対策はいずれもが
技術的に満足できるものではなかつた。 Therefore, neither of these measures (1) and (2) were technically satisfactory.
この発明は前記従来技術の問題点を除去し、半
田印刷時の半田もれとリフロー後の未半田を防止
し、電子部品の接続端子とプリント配線板の接続
用導体との安定した半田付け方法を提供すること
を目的とする。 This invention eliminates the problems of the prior art, prevents solder leakage during solder printing and unsoldering after reflow, and provides a stable soldering method for connecting terminals of electronic components and connecting conductors of printed wiring boards. The purpose is to provide
（問題点を解決するための手段）
上記目的を達成するための半田付け方法を、実
施例に対応する第１〜６図を用いて説明すると、
本発明は電子部品の半田付け方法において、プリ
ント配線板３に設けられた複数個の長方形の接続
用導体４のうち、少なくともスキジー動作方向に
直列に配列された接続用導体４上に、ほぼ三角形
の半田層５を１つおきに倒立して形成し、電子部
品１の接続端子２を前記半田層５を印刷したプリ
ント配線板３の接続用導体４に重ね合せ、しかる
後に、加熱して半田層５を溶解し、電子部品１を
プリント配線板３に接着する工程によつたもので
ある。(Means for Solving the Problems) A soldering method for achieving the above object will be explained using FIGS. 1 to 6 corresponding to the embodiments.
In a method for soldering electronic components, the present invention provides a method for soldering electronic components, in which a substantially triangular shape is applied to at least the connecting conductors 4 arranged in series in the squeegee operation direction among the plurality of rectangular connecting conductors 4 provided on the printed wiring board 3. The solder layers 5 are formed by inverting every other solder layer, and the connecting terminals 2 of the electronic component 1 are superimposed on the connecting conductors 4 of the printed wiring board 3 on which the solder layers 5 are printed, and then heated and soldered. This process involves melting the layer 5 and bonding the electronic component 1 to the printed wiring board 3.
（作用）
この発明によれば、プリント配線板の長方形の
パツド４に印刷するクリーム半田の形状を台形、
三角形その他ほぼ三角形とすると共に、交互に倒
立して逆三角形としたので、半田形状の三角形と
逆三角形のそれぞれのテーパ部５ａ，５ａ又は５
ｂ，５ｂ間の間隙l2がテーパ分だけパツド４間の
間隙l1よりも広くなり、このため、クリーム半田
の塗布厚さを標準の0.2mmとしても、印刷時の半
田もれやリフロー後の未半田という半田付け不良
を削減又は防止することが可能になつた。したが
つて、従来技術が持つていた問題点を一掃するこ
とが出来るようになつた。(Function) According to the present invention, the shape of the cream solder printed on the rectangular pad 4 of the printed wiring board is trapezoidal,
Triangular or almost triangular shapes are formed, and the tapered portions 5a, 5a or 5 of the solder-shaped triangles and the inverted triangles are alternately inverted to form inverted triangles.
The gap l2 between pads b and 5b becomes wider than the gap l1 between pads 4 by the taper, so even if the cream solder coating thickness is the standard 0.2 mm, solder leakage during printing or after reflow will occur. It has become possible to reduce or prevent soldering defects such as unsoldered parts. Therefore, it has become possible to eliminate the problems that the prior art had.
（実施例） 以下図面について本発明の実施例を説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図はこの発明の一実施例であるプリント配
線板への電子部品取付け状態を示す外観斜視図で
あつて、第２図にはプリント配線板の接続用導体
とこれに印刷する半田塗布形状の関係を示してあ
る。 FIG. 1 is an external perspective view showing a state in which electronic components are attached to a printed wiring board according to an embodiment of the present invention, and FIG. The relationship between is shown.
すなわち、第１図に示されるように、電子部品
１の接続端子２はプリント配線板３のパツド４に
半田付けによつて機械的及び電気的に接続されて
おり、このような構成にするためには次の(1)〜(4)
の工程を経て行なわれる。まず、(1)プリント配線
板３の長方形のパツド４に印刷によりクリーム半
田塗布を行なう。(2)この塗布半田層上に電子部品
１の接続端子２を搭載する。(3)加熱してさきに塗
布した半田層５を溶融して電子部品１をプリント
配線板３に半田付けを行なう。(4)これを洗浄して
完成する。 That is, as shown in FIG. 1, the connection terminal 2 of the electronic component 1 is mechanically and electrically connected to the pad 4 of the printed wiring board 3 by soldering. The following (1) to (4)
It is carried out through the following steps. First, (1) cream solder is applied to the rectangular pad 4 of the printed wiring board 3 by printing. (2) Mount the connection terminals 2 of the electronic component 1 on this coated solder layer. (3) Heat to melt the previously applied solder layer 5 and solder the electronic component 1 to the printed wiring board 3. (4) Wash and complete this.
そして、前記工程(1)すなわち、プリント配線板
３のパツド４へのクリーム半田塗布形状は、長方
形パツド４に対しパツド幅を１辺としたほぼ三角
形５とし、隣接するパツドにはこの三角形５を倒
立した形状つまり逆三角形に半田を塗布し、以下
のパツドに対してはこれを順次繰返す。したがつ
て、複数個のパツドには三角形のクリーム半田が
正逆交互に対向して順次配置されるようになり、
三角形のテーパ部５ａ，５ａ（あるいは５ｂ，５
ｂ）が互いに平行になり、この５ａ，５ａ（ある
いは５ｂ，５ｂ）間の間隙l2はパツド側の間隔l1
よりもテーパがついている部分だけ大きく、つま
りl2＞l1となる。 Then, in step (1), the shape of the cream solder applied to the pad 4 of the printed wiring board 3 is approximately a triangle 5 with one side of the pad width for the rectangular pad 4, and this triangle 5 is applied to the adjacent pad. Apply solder to the inverted shape, or inverted triangle, and repeat this for the following pads in sequence. Therefore, triangular cream solder is placed on multiple pads in order, facing each other alternately in forward and reverse directions.
Triangular taper portions 5a, 5a (or 5b, 5
b) are parallel to each other, and the gap l 2 between these 5a, 5a (or 5b, 5b) is the gap l 1 on the pad side
The tapered part is larger than that, that is, l 2 > l 1 .
したがつて、電子部品１の接続端子２のピツチ
が0.65mmのときにパツド寸法を0.3×2.1mmとする
と、l1，l2の関係はl2／l1＝1.4となり、約40％だ
け間隔を広くすることができる。このため、クリ
ーム半田の塗布厚さを標準の0.2mmとしても、印
刷時の半田もれやリフロー後の未半田という半田
付け不良を減少させることが可能になる。 Therefore, if the pitch of the connecting terminals 2 of the electronic component 1 is 0.65 mm and the pad dimensions are 0.3 x 2.1 mm, the relationship between l 1 and l 2 will be l 2 /l 1 = 1.4, which is only about 40%. The spacing can be widened. Therefore, even if the cream solder is applied to the standard thickness of 0.2 mm, it is possible to reduce soldering defects such as solder leakage during printing and unsoldered material after reflow.
第３図、第４図及び第５図はそれぞれパツドに
塗布する半田層の形状が異なつた実施例を示すも
のであり、第３図は台形５Ａで三角形の頂部をカ
ツトしたもの、第４図は第２図の三角形のコーナ
に丸味をつけたもの（５Ｂ）、第５図は第４図の
相似形５Ｃの場合で、パツド寸法よりも半田形状
を小さくしたものである。要するに、テーパをつ
けることによつて、隣接する半田層の間隔をパツ
ドの間隔よりも広くするように出来ればよい。 Figures 3, 4, and 5 show examples in which the shapes of the solder layers applied to the pads are different. Figure 3 shows a trapezoid 5A with the top of the triangle cut off, and Figure 4 shows an example in which the top of the triangle is cut off from a trapezoid 5A. 2 is a triangle with rounded corners (5B), and FIG. 5 is a similar shape 5C in FIG. 4, where the solder shape is smaller than the pad size. In short, it is sufficient if the gap between adjacent solder layers can be made wider than the gap between pads by tapering.
第６図はさらに他の実施例で、一般にパツド４
に半田層を印刷する場合に生ずる位置ずれの現象
は図示のようにスキジー動作方向に直列なパツド
即ち上下に配列されたパツド４Ａ，４Ｂで多発
し、スキジー動作方向に並列するパツド即ち、左
右に配列されたパツド１４Ａ，１４Ｂには少ない
ことから、左右に配置されたパツド１４Ａ，１４
Ｂには従来通りのパツドの長方形そのままの半田
層を形成し、上下に配置されたパツド４Ａ，４Ｂ
には本発明に係るほぼ三角形で一つおきに倒立し
た逆三角形のクリーム半田層を印刷して形成する
ようにしたものである。 FIG. 6 shows yet another embodiment, generally consisting of pad 4.
As shown in the figure, the phenomenon of positional deviation that occurs when printing a solder layer occurs frequently in the pads 4A and 4B that are in series with the squeegee operation direction, that is, the pads 4A and 4B that are arranged vertically, and on the pads that are parallel to the squeegee operation direction, that is, on the left and right sides. Since there are fewer pads 14A and 14B arranged, pads 14A and 14 arranged on the left and right
On B, a solder layer is formed with the same rectangular pad as before, and pads 4A and 4B arranged above and below are formed.
The cream solder layer according to the present invention is formed by printing an inverted triangular cream solder layer which is approximately triangular and every other inverted triangle.
第３〜６図の場合は、第２図実施例と同様の作
用効果があることはいうまでもない。 It goes without saying that the cases shown in FIGS. 3 to 6 have the same effects as the FIG. 2 embodiment.
（発明の効果）
以上詳細に説明したように本発明によれば、プ
リント配線板の長方形パツドすなわち接続用導体
に印刷するクリーム半田の形状をパツド幅を底辺
とする三角形に近い形状あるいはその相似形状と
し、しかも、一つおきに倒立した逆三角形とした
ので、微小端子部品用の半田印刷作業時の半田も
れや電子部品のばらつきによるリフロー後の未半
田を防止することが出来るようになり、このた
め、プリント配線板組立工程における半田修正作
業等の削減と、高品質の半田付けが実現出来る優
れた効果を奏する。(Effects of the Invention) As described above in detail, according to the present invention, the shape of the cream solder printed on the rectangular pad of a printed wiring board, that is, the connection conductor, is a shape close to a triangle with the pad width as the base, or a shape similar thereto. Moreover, since every other part is an inverted triangle shape, it is possible to prevent solder leakage during solder printing work for minute terminal parts and unsolder after reflow due to variations in electronic parts. Therefore, it is possible to reduce solder correction work and the like in the printed wiring board assembly process, and to realize high-quality soldering.
第１図はこの発明に係るプリント配線板の外観
斜視図、第２図はこの発明の主要部である半田塗
布状態の一実施例を示す平面図、第３〜６図はそ
れぞれこの発明の主要部である半田塗布状態の他
の実施例を示す平面図、第７図は従来の半田塗布
状態を示す平面図である。
１……電子部品、２……接続端子、３……プリ
ント配線板、４，１４……パツド（接続用導体）、
５，１５……クリーム半田層、５ａ，５ｂ……テ
ーパ部。
Fig. 1 is an external perspective view of a printed wiring board according to the present invention, Fig. 2 is a plan view showing an embodiment of the solder application state which is the main part of the invention, and Figs. 3 to 6 are the main parts of the invention. FIG. 7 is a plan view showing another embodiment of the solder application state, which is a conventional solder application state. 1... Electronic component, 2... Connection terminal, 3... Printed wiring board, 4, 14... Pad (connecting conductor),
5, 15...cream solder layer, 5a, 5b...tapered portion.
Claims (1)
けられた接続端子のリフロー半田付け方法におい
て、 プリント配線板に設けられた複数個の長方形の
接続用導体のうち、少なくともスキジー動作方向
に直列に配列された複数の接続用導体上に接続用
導体の列方向の辺を底辺とするほぼ三角形の半田
層を印刷により１つおきに倒立して形成し、電子
部品の接続端子を前記半田層を設けたプリント配
線板の接続用導体に重ね合せ、しかる後に、加熱
して半田層を溶解し、電子部品とプリント配線板
に接着することを特徴とする電子部品の半田付け
方法。[Scope of Claims] 1. In a reflow soldering method for connecting conductors of a printed wiring board and connection terminals provided on an electronic component, at least one of a plurality of rectangular connecting conductors provided on the printed wiring board is connected to a squeegee. On a plurality of connection conductors arranged in series in the operating direction, a nearly triangular solder layer with the side in the column direction of the connection conductors as the base is formed by printing every other solder layer upside down, thereby forming connection terminals for electronic components. A method for soldering electronic components, comprising: superimposing the solder layer on a connecting conductor of a printed wiring board provided with the solder layer, and then heating to melt the solder layer and bonding the electronic component to the printed wiring board. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14394485A JPS625690A (en) | 1985-07-02 | 1985-07-02 | Soldering of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14394485A JPS625690A (en) | 1985-07-02 | 1985-07-02 | Soldering of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS625690A JPS625690A (en) | 1987-01-12 |
| JPH0435917B2 true JPH0435917B2 (en) | 1992-06-12 |
Family
ID=15350687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14394485A Granted JPS625690A (en) | 1985-07-02 | 1985-07-02 | Soldering of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625690A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62199979U (en) * | 1986-06-10 | 1987-12-19 | ||
| JPH01161369U (en) * | 1988-04-27 | 1989-11-09 | ||
| JPH02172292A (en) * | 1988-12-24 | 1990-07-03 | Fujitsu General Ltd | Solder bonding method for electronic parts |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742998A (en) * | 1980-08-22 | 1982-03-10 | Isato Nakao | Water repellent treatment of paper |
| JPS58132941A (en) * | 1982-02-02 | 1983-08-08 | Sharp Corp | Lead-connecting method for part-mounting substrate |
| JPS59158585A (en) * | 1983-02-26 | 1984-09-08 | 日本電気ホームエレクトロニクス株式会社 | Method of printing by preventing droop of cream-like solder |
| JPS6058600B2 (en) * | 1984-01-17 | 1985-12-20 | 株式会社ケンウッド | How to attach electronic components to printed wiring boards |
-
1985
- 1985-07-02 JP JP14394485A patent/JPS625690A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS625690A (en) | 1987-01-12 |
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