JP2562797Y2 - Wiring board - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board, and more particularly to a structure of a side electrode.

[0002]

2. Description of the Related Art A wiring substrate such as a thick film substrate on which a thick film functional element is integrally formed on a surface or a multilayer film substrate on which an element or a conductor is formed, Conventionally, a silver-palladium electrode is generally used as a solderable side electrode provided on a side surface for connection between conductors on a substrate or connection to an external circuit. This silver-palladium electrode
It is formed by applying the powder mixed in a binder to the side surface of the wiring board and then firing at 600 ° C. or higher.

As described above, since the side electrodes are conventionally formed by firing at a high temperature, a thick-film functional element (for example, having a resistance value of which the characteristics are changed by receiving heat at the firing temperature or the soldering temperature). In a wiring board on which the adjusted resistors) and elements are mounted, the characteristics of these elements change or are damaged when the side electrodes are baked. It cannot be placed on top. For this reason, conventionally, as shown in FIG. 3A, after forming a conductor pattern on a substrate material 2 including a large number of substrates 1, the substrate is divided for each substrate 1 to form a side electrode 3. In the process of mounting the element 4 on the substrate 1 by the automatic mounting machine,
Had been manufactured.

As described above, conventionally, it is necessary to fire the side electrode 3 at a high temperature. Therefore, the mounting of the element 4 whose characteristics change at the firing temperature on the wiring board 1 is limited after the side electrode 3 is formed. For this reason, it is necessary to form and mount the element 4 for each substrate 1, which hinders improvement in manufacturing efficiency.

Further, the silver-palladium electrode needs to be plated after being formed by firing, and there is a problem that the plating solution may cause corrosion of the side electrode 3 and other conductors.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a wiring board having a side electrode which can form a side electrode while the element is mounted, thereby improving manufacturing efficiency, and does not require plating. The purpose is to do.

[0007]

In order to achieve the above-mentioned object, the present invention provides a ceramic substrate on which a conductive pattern is formed, wherein at least one of a thick-film functional element and a mounting element formed integrally with the substrate. One element is provided and the side of the board is heated at a temperature lower than the soldering temperature.
In this case , an electrode made of a conductive resin formed by curing is fixed. In addition, the present invention provides a method for mounting an element mounted on a ceramic substrate on which a conductor pattern is formed at a temperature lower than the soldering temperature of the conductor pattern.
Is fixed by a conductive resin cured by heating at a temperature lower than the soldering temperature on the side surface of the substrate .
An electrode made of a conductive resin formed by being cured by the fixing is fixed (claim 2). Also, a multilayer substrate is used as the substrate other than the ceramic substrate (claim 3).

[0008]

According to the first aspect, the side electrode is soldered.
Cured by heating at a temperature below the casting temperature to form
Since the conductive resin material used is used, the side electrodes can be formed on the wiring board at a low temperature at which the characteristics of the element mounted on the wiring board or the integrally formed element do not change. Therefore,
The side electrodes can be formed with these elements provided on the wiring board. The side electrode is used as a connection between conductors on a substrate or as a soldering electrode to a mother substrate. According to the second aspect, since the element can be fixed at a temperature lower than that of the solder, an element having a lower heat-resistant temperature can be mounted. According to the third aspect, a high-density substrate is realized by using a multilayer substrate as the substrate.

[0009]

1A is a perspective view showing one embodiment of a wiring board according to the present invention, FIG. 1B is a cross-sectional view showing a side electrode portion of the wiring board, and FIGS. It is sectional drawing which shows the electrode fixing structure example of a mounting element. Reference numeral 1 denotes a wiring board in which a conductor pattern as wiring is formed on the front and back surfaces of ceramic such as alumina, 4 denotes a mounting element formed of a chip component, and 10 denotes a resistor formed of a thick film and having a resistance value adjusted. At least some of them change their characteristics at the firing temperature or at a temperature higher than the low-temperature solder. 5 is a side electrode provided by the present invention, the side electrode is formed using a conductive resin material that can be cured at a soldering temperature or less,
The soldering is enabled by mixing silver powder or copper powder covered with a silver layer into the resin. The side electrode 5 is mounted on the wiring board 1 in a flowing state after the element 4 is mounted.
And cured by heating at a temperature lower than the soldering temperature.

[0010] As shown in FIG.
Is a function of electrically connecting the conductors 6 and 7 formed on the front and back surfaces of the wiring board 1 and / or a function of connecting the conductors 9 on the mother board 8 on which the wiring board 1 is mounted by solder 11. It is provided to fulfill.

FIG. 2A shows an example in which a multilayer substrate 1A in which a conductor pattern 14 having a laminated structure is formed is used as a wiring substrate, and the element 4 has its terminals 12 connected to the conductors 6 on the surface of the multilayer substrate 1A. It is fixed by the solder 11.

As described above, by using a solderable conductive resin material for the side electrode 5, the side electrode 5 can be formed while the element 4 is mounted. Therefore, as shown in FIG. 3 (B), after a conductor pattern is formed on a substrate material 2 including a large number of substrates 1, the substrate 1 is not automatically divided into individual substrates 1 but is mounted on the substrate 1 by an automatic mounting machine. It is possible to adopt a manufacturing process in which the element 4 is mounted and then divided for each wiring board 1 to form the side electrode 5. By adopting such a manufacturing process, the mounting of the elements 4 can be efficiently performed collectively for many materials 2.
Further, the thick film element 10 that cannot be formed at the conventional forming temperature of the side electrode can be formed in advance. Also, there is no need to plate as in the case of conventional silver-palladium side electrodes.

FIG. 2B shows an example in which the element 4 is fixed to the conductor 6 on the substrate 1 by the conductive resin material 15. According to this example, the element 4 can be fixed at a lower temperature than solder.
An element having a lower heat-resistant temperature can be mounted. When the conductive resin material 15 has the same curing temperature as the material constituting the side electrode 5, the fixing of the element 4 and the formation of the side electrode 5 can be performed simultaneously.

[0014]

According to the first aspect of the present invention, a half- side electrode is provided.
Cured by heating at a temperature below the dipping temperature
Since the formed conductive resin material is used, it is possible to form or mount the element on the substrate in the state of the substrate material including many substrates, and it is possible to efficiently form or mount the element, thereby reducing the price. Can contribute to In addition, since plating on the side electrodes is not required, there is no possibility that corrosion of the side electrodes themselves or corrosion of other conductors or the like due to the plating solution will occur.
According to claim 2, in addition to the effects of claim 1, it is possible to fix the mounting element at a lower soldering temperature enables more mounting of low heat temperature device, the application range is expanded
The above effect can be obtained. If a conductive resin material having the same curing temperature as the material constituting the side electrode is used, the mounting element can be fixed and the side electrode can be formed at the same time, and the efficiency can be improved. According to claim 3, claim 1 or 2
In addition to the effects described above, the effect that a high-density substrate can be realized is obtained by using a multilayer substrate as the substrate.

[Brief description of the drawings]

1A is a perspective view showing an embodiment of a wiring board according to the present invention, and FIG. 1B is a cross-sectional view showing a side electrode portion thereof.

FIGS. 2A and 2B are cross-sectional views each showing an example of an element mounting structure of the present invention.

FIG. 3A is a manufacturing process diagram of a conventional wiring board, and FIG.
6 is a manufacturing process diagram of the wiring board of the present embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 1A Multilayer board 2 Substrate material 4 Element 5 Side electrode 6, 7, 9 Conductor 8 Mother board 10 Thick film element 11 Solder 12 Terminal 14 Conductor pattern 15 Conductive resin material

Claims (3)

(57) [Scope of request for utility model registration] 1. A ceramic substrate on which a conductive pattern is formed, at least one of a thick film functional element and a mounting element formed integrally with the substrate are provided and soldered to a side surface of the substrate. Heat below the temperature
A wiring substrate, wherein an electrode made of a conductive resin formed by being cured by the fixing is fixed. 2. An element mounted on a ceramic substrate having a conductor pattern formed thereon is soldered to the conductor pattern at a temperature lower than a soldering temperature.
It is fixed with a conductive resin that is cured by heating at a temperature, and is applied to the side surface of the substrate at a temperature lower than the soldering temperature.
A wiring substrate, wherein an electrode made of a conductive resin formed by being cured by heating is fixed. 3. The wiring board according to claim 1, wherein said board is a multilayer board.