JPS5643746A - Lead-less hybrid integrated circuit parts - Google Patents

Lead-less hybrid integrated circuit parts

Info

Publication number
JPS5643746A
JPS5643746A JP11875679A JP11875679A JPS5643746A JP S5643746 A JPS5643746 A JP S5643746A JP 11875679 A JP11875679 A JP 11875679A JP 11875679 A JP11875679 A JP 11875679A JP S5643746 A JPS5643746 A JP S5643746A
Authority
JP
Japan
Prior art keywords
external terminals
substrate
electronic device
shaped
main printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11875679A
Other languages
Japanese (ja)
Inventor
Minoru Takatani
Tetsuo Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP11875679A priority Critical patent/JPS5643746A/en
Publication of JPS5643746A publication Critical patent/JPS5643746A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Abstract

PURPOSE:To form the titled parts which can flatly be mounted onto a main printed substrate of an electronic device and enable the thinning of the electronic device by a method wherein a conductive wiring is led out to a surrounding part of the substrate, and thin film-shaped external terminals are made up to the surrounding part. CONSTITUTION:Printed wirings are led out to the surrounding part of the insulating substrate 1 for connection to an external circuit, and metallic thin film-shaped external terminals having an excellent soldering property are formed to the part. The external terminals 8' are made up to ensure that they extend on the back through an end surface from an upper surface of a fringe part of the insulating substrate 1. Or the external terminals 8'' are formed only at the upper surface side of the fringe part of the insulator, and U-shaped or ringed metal fittings, whose one part is notched, are fitted to the external terminals 8'' by utilizing their elasticity when fixing the terminals to a main printed board. Thus, the external terminals are flatly mounted onto the main printed substrate, and the electronic device can be thinned as a whole.
JP11875679A 1979-09-18 1979-09-18 Lead-less hybrid integrated circuit parts Pending JPS5643746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11875679A JPS5643746A (en) 1979-09-18 1979-09-18 Lead-less hybrid integrated circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11875679A JPS5643746A (en) 1979-09-18 1979-09-18 Lead-less hybrid integrated circuit parts

Publications (1)

Publication Number Publication Date
JPS5643746A true JPS5643746A (en) 1981-04-22

Family

ID=14744271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11875679A Pending JPS5643746A (en) 1979-09-18 1979-09-18 Lead-less hybrid integrated circuit parts

Country Status (1)

Country Link
JP (1) JPS5643746A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124546U (en) * 1983-02-14 1984-08-22 日本精工株式会社 Retractor tension lock mechanism
JPS61164073U (en) * 1986-03-20 1986-10-11
JPS6464347A (en) * 1987-09-04 1989-03-10 Nec Corp Semiconductor integrated circuit
JPH0577967U (en) * 1992-03-25 1993-10-22 ティーディーケイ株式会社 Wiring board
EP1160869A3 (en) * 2000-05-30 2006-01-25 Alps Electric Co., Ltd. SMD with passive components formed by thin film technology

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124546U (en) * 1983-02-14 1984-08-22 日本精工株式会社 Retractor tension lock mechanism
JPS61164073U (en) * 1986-03-20 1986-10-11
JPS6464347A (en) * 1987-09-04 1989-03-10 Nec Corp Semiconductor integrated circuit
JPH0577967U (en) * 1992-03-25 1993-10-22 ティーディーケイ株式会社 Wiring board
EP1160869A3 (en) * 2000-05-30 2006-01-25 Alps Electric Co., Ltd. SMD with passive components formed by thin film technology

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