JPS55103751A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55103751A
JPS55103751A JP1015879A JP1015879A JPS55103751A JP S55103751 A JPS55103751 A JP S55103751A JP 1015879 A JP1015879 A JP 1015879A JP 1015879 A JP1015879 A JP 1015879A JP S55103751 A JPS55103751 A JP S55103751A
Authority
JP
Japan
Prior art keywords
lead pin
external lead
hole
laminated plate
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1015879A
Other languages
Japanese (ja)
Inventor
Toru Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1015879A priority Critical patent/JPS55103751A/en
Publication of JPS55103751A publication Critical patent/JPS55103751A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To fasten an external lead pin firmly by pressure-inserting a head-fitted external lead pin into a hole provided on a laminated plate and caulking it from the opposite side in a semiconductor device formed by using a copper-lined laminated plate to be used in a printed circuit. CONSTITUTION:Along both edges of glass-based epoxy resin laminated plate 1, a hole in which an external lead pin is to be fitted is provided. Conductor pattern 6 is formed in the neighborhood of the hole. Sn-plated copper ply wire is processed in advance into a lead pin provided with head 7, pressure-inserting part 8 and projected part 9. Next, pressure-inserting part 8 is caulked, and this is fixed to laminated plate 1 via conductor pattern 6 and Au-plated layer 10. Since the external lead pin is fixed so as to cover both openings of the hole, no loosening of the external lead pin or peeling of the conductor pattern occurs.
JP1015879A 1979-01-31 1979-01-31 Semiconductor device Pending JPS55103751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1015879A JPS55103751A (en) 1979-01-31 1979-01-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1015879A JPS55103751A (en) 1979-01-31 1979-01-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55103751A true JPS55103751A (en) 1980-08-08

Family

ID=11742465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1015879A Pending JPS55103751A (en) 1979-01-31 1979-01-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55103751A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059756A (en) * 1983-09-12 1985-04-06 Ibiden Co Ltd Plug-in package and manufacture thereof
JPS6095943A (en) * 1983-10-31 1985-05-29 Ibiden Co Ltd Plug-in package and manufacture thereof
JPS6095944A (en) * 1983-10-31 1985-05-29 Ibiden Co Ltd Plug-in package and manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059756A (en) * 1983-09-12 1985-04-06 Ibiden Co Ltd Plug-in package and manufacture thereof
JPH0558262B2 (en) * 1983-09-12 1993-08-26 Ibiden Co Ltd
JPS6095943A (en) * 1983-10-31 1985-05-29 Ibiden Co Ltd Plug-in package and manufacture thereof
JPS6095944A (en) * 1983-10-31 1985-05-29 Ibiden Co Ltd Plug-in package and manufacture thereof
JPH0582060B2 (en) * 1983-10-31 1993-11-17 Ibiden Co Ltd

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