JPS6444052A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS6444052A
JPS6444052A JP20109787A JP20109787A JPS6444052A JP S6444052 A JPS6444052 A JP S6444052A JP 20109787 A JP20109787 A JP 20109787A JP 20109787 A JP20109787 A JP 20109787A JP S6444052 A JPS6444052 A JP S6444052A
Authority
JP
Japan
Prior art keywords
layer
resin
wax
impregnated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20109787A
Other languages
Japanese (ja)
Inventor
Takeshi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20109787A priority Critical patent/JPS6444052A/en
Publication of JPS6444052A publication Critical patent/JPS6444052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve moisture resistance and cleaning resistance by providing a first resin layer covering an electronic component and a substrate, a second resin layer impregnated with wax covering the first layer, and a third resin layer covering the second layer. CONSTITUTION:An aluminum substrate 1, a component, such as a semiconductor IC 2 placed on the substrate 1 and a phenol precoat 4 are covered with phenol resin 6, which is covered with a wax layer 7 in which the resin 6 is impregnated with wax. The layer 7 in which the resin 6 is impregnated with wax is further covered with a phenol resin 8. Thus, the wax intermediate layer 7 is provided between the resins 6 and 8 to improve moisture resistance and cleaning resistance.
JP20109787A 1987-08-11 1987-08-11 Hybrid integrated circuit Pending JPS6444052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20109787A JPS6444052A (en) 1987-08-11 1987-08-11 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20109787A JPS6444052A (en) 1987-08-11 1987-08-11 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS6444052A true JPS6444052A (en) 1989-02-16

Family

ID=16435344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20109787A Pending JPS6444052A (en) 1987-08-11 1987-08-11 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS6444052A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417787A2 (en) * 1989-09-13 1991-03-20 Kabushiki Kaisha Toshiba Multimold semiconductor device and the manufacturing method therefor
US6144106A (en) * 1996-10-04 2000-11-07 Dow Corning Corporation Electronic coatings

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417787A2 (en) * 1989-09-13 1991-03-20 Kabushiki Kaisha Toshiba Multimold semiconductor device and the manufacturing method therefor
US5057457A (en) * 1989-09-13 1991-10-15 Kabushiki Kaisha Toshiba Multimold semiconductor device and the manufacturing method therefor
US6144106A (en) * 1996-10-04 2000-11-07 Dow Corning Corporation Electronic coatings

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