JPS6450592A - Super-heat dissipation type composite circuit board - Google Patents

Super-heat dissipation type composite circuit board

Info

Publication number
JPS6450592A
JPS6450592A JP20849887A JP20849887A JPS6450592A JP S6450592 A JPS6450592 A JP S6450592A JP 20849887 A JP20849887 A JP 20849887A JP 20849887 A JP20849887 A JP 20849887A JP S6450592 A JPS6450592 A JP S6450592A
Authority
JP
Japan
Prior art keywords
thermosetting resin
heat dissipation
foil
surface treatment
rough surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20849887A
Other languages
Japanese (ja)
Inventor
Shigemasa Nakano
Riichirou Maya
Yoshiki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Shinko Corp
Shinko Chemical Co Ltd
Original Assignee
Shinko Chemical Co Ltd
Shinko Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Chemical Co Ltd, Shinko Chemical Industries Co Ltd filed Critical Shinko Chemical Co Ltd
Priority to JP20849887A priority Critical patent/JPS6450592A/en
Publication of JPS6450592A publication Critical patent/JPS6450592A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To obtain the title board, which maintains a superior voltage resistance and superior heat dissipation characteristics and has an improved moisture resistance and an improved adherence, by a method wherein an Al-family metallic heat dissipation substrate subjected to a specified rough surface treatment on its adhesive surface side is laminated on one surface of a metallic foil through a heat-dissipative insulating moisture-resistant layer formed of a specified thermosetting resin composition and is formed integrally with the metallic foil. CONSTITUTION:An Al-family metallic heat dissipation substrate 40 is laminated on one surface of a metallic foil 20 through a heat-dissipative insulating moisture-resistant layer 30 and is formed integrally with the foil 20. In such a circuit board 10, the layer 30 is formed of a thermosetting resin composition, which contains a thermosetting resin and the 20-300 parts weight of an inorganic filler obtainable by performing a coating treatment on the 100 weight part of the thermosetting resin with an Si coupling agent and/or a titanate coupling agent add is in a semihardened state. The substrate 40 is subjected to rough surface treatment of 1mum or more on its adhesive surface side. Moreover, the foil 20 is also subjected to rough surface treatment of 1mum or more, for example, on one surface thereof, an epoxy resin is used as the above thermosetting resin and the rough surface treatment to the substrate 40 is performed in 2-15mum.
JP20849887A 1987-08-21 1987-08-21 Super-heat dissipation type composite circuit board Pending JPS6450592A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20849887A JPS6450592A (en) 1987-08-21 1987-08-21 Super-heat dissipation type composite circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20849887A JPS6450592A (en) 1987-08-21 1987-08-21 Super-heat dissipation type composite circuit board

Publications (1)

Publication Number Publication Date
JPS6450592A true JPS6450592A (en) 1989-02-27

Family

ID=16557154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20849887A Pending JPS6450592A (en) 1987-08-21 1987-08-21 Super-heat dissipation type composite circuit board

Country Status (1)

Country Link
JP (1) JPS6450592A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998023137A1 (en) * 1996-11-22 1998-05-28 Jerseyfield Limited A printed circuit board and a method for manufacturing the printed circuit board
US6958535B2 (en) * 2000-09-22 2005-10-25 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and semiconductor module using the same
US7442107B1 (en) 1999-11-02 2008-10-28 Sega Toys Ltd. Electronic toy, control method thereof, and storage medium
WO2013183687A1 (en) * 2012-06-06 2013-12-12 古河電気工業株式会社 Arrayed waveguide diffraction grating optical demultiplexer and arrayed waveguide diffraction grating optical demultiplexer module
JP2014027226A (en) * 2012-07-30 2014-02-06 Nhk Spring Co Ltd Circuit board laminate and metal base circuit board
JP2014154824A (en) * 2013-02-13 2014-08-25 Mitsubishi Electric Corp Semiconductor device
US20180006441A1 (en) * 2015-01-16 2018-01-04 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
WO2022114068A1 (en) * 2020-11-25 2022-06-02 三菱マテリアル株式会社 Heatsink-integrated insulating circuit board and method for manufacturing heatsink-integrated insulating circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815290A (en) * 1981-07-21 1983-01-28 電気化学工業株式会社 Board for hybrid integrated circuit
JPS62149189A (en) * 1985-12-23 1987-07-03 三菱電機株式会社 Wet etching ceramic multilayer printed board
JPH0191488A (en) * 1987-06-16 1989-04-11 Shinko Kagaku Kogyo Kk Substrate for composite circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815290A (en) * 1981-07-21 1983-01-28 電気化学工業株式会社 Board for hybrid integrated circuit
JPS62149189A (en) * 1985-12-23 1987-07-03 三菱電機株式会社 Wet etching ceramic multilayer printed board
JPH0191488A (en) * 1987-06-16 1989-04-11 Shinko Kagaku Kogyo Kk Substrate for composite circuit

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998023137A1 (en) * 1996-11-22 1998-05-28 Jerseyfield Limited A printed circuit board and a method for manufacturing the printed circuit board
US7442107B1 (en) 1999-11-02 2008-10-28 Sega Toys Ltd. Electronic toy, control method thereof, and storage medium
US6958535B2 (en) * 2000-09-22 2005-10-25 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and semiconductor module using the same
WO2013183687A1 (en) * 2012-06-06 2013-12-12 古河電気工業株式会社 Arrayed waveguide diffraction grating optical demultiplexer and arrayed waveguide diffraction grating optical demultiplexer module
JP2014027226A (en) * 2012-07-30 2014-02-06 Nhk Spring Co Ltd Circuit board laminate and metal base circuit board
JP2014154824A (en) * 2013-02-13 2014-08-25 Mitsubishi Electric Corp Semiconductor device
US20180006441A1 (en) * 2015-01-16 2018-01-04 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
US10038315B2 (en) * 2015-01-16 2018-07-31 Sumitomo Wiring Systems, Ltd. Circuit assembly and electrical junction box
DE112015004024B4 (en) * 2015-01-16 2021-02-11 Autonetworks Technologies, Ltd. Circuit assembly and electrical distributor
WO2022114068A1 (en) * 2020-11-25 2022-06-02 三菱マテリアル株式会社 Heatsink-integrated insulating circuit board and method for manufacturing heatsink-integrated insulating circuit board

Similar Documents

Publication Publication Date Title
ATE63656T1 (en) COMPOSITE CIRCUIT BOARD WITH METAL PATTERN LAYERS AND METHOD OF MAKING.
ES8407525A1 (en) Compositions convertible to reinforced conductive components and articles incorporating same.
KR910014016A (en) Multilayer printed circuit board and its formation method
MY116680A (en) Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
EP0844272A3 (en) Prepreg for laminate and process for producing printed wiring-board using the same
FR2493662B1 (en)
JPS6450592A (en) Super-heat dissipation type composite circuit board
US4985294A (en) Printed wiring board
MX9803358A (en) Multilayer printed circuit board and process for producing the same.
KR890007625A (en) Manufacturing method of multilayer printed circuit board
EP1146101A4 (en) Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same
IE850184L (en) Circuit boards made of laminates
EP0377332A3 (en) Laminate film having a thermosetting resin layer and use thereof for forming electrically insulating layer over conducting surface
JPH04131228A (en) Composite laminated sheet
JPS54125284A (en) Production of flexible printed circuit
JPS6430291A (en) Material of flexible printed circuit board
JPS5782485A (en) Formation of electrode
JPH0553628B2 (en)
JPS6444052A (en) Hybrid integrated circuit
JPS6489547A (en) Board for mounting semiconductor element
Wu Laminated Synthetic Mica Articles
JPS6480524A (en) Multi-layer printed wiring board
JPS645835A (en) Metal foil clad laminated sheet
JPS55103751A (en) Semiconductor device
JPS5542839A (en) Manufacture of lamination layer for chemical plating