JPS6430291A - Material of flexible printed circuit board - Google Patents
Material of flexible printed circuit boardInfo
- Publication number
- JPS6430291A JPS6430291A JP18701887A JP18701887A JPS6430291A JP S6430291 A JPS6430291 A JP S6430291A JP 18701887 A JP18701887 A JP 18701887A JP 18701887 A JP18701887 A JP 18701887A JP S6430291 A JPS6430291 A JP S6430291A
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- resistant adhesive
- polyethersulfone
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To obtain relatively low cost flexible printed circuit board material with excellent heat-resistant property, flame-retardant property and dimensional stability and free from voids and interlayer delamination by a method wherein a polyethersulfone film is subjected to a corona discharge treatment or a plasma treatment to obtain a surface wetting tension not less than a specific value and a metal foil is bonded to the film with heat-resistant adhesive. CONSTITUTION:A polyethersulfone film is subjected to a corona discharge treatment or plasma treatment to obtain a surface wetting tension not less than 42dyne/cm and a metal foil, typically a copper foil, is bonded to the film with heat-resistant adhesive. Needless to say, the metal foils may be applied to not only one side of the film but also both sides of the film. The polyethersulfone film with a thickness of 4-300mum is employed. If the film is too thin, the physical strength is not sufficient and, if the film is too thick, the flexibility is not sufficient. The preferable thickness range is 15-50mum. As the heat-resistant adhesive, thermosetting type epoxy resin system or acrylic resin system is recommended.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18701887A JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18701887A JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430291A true JPS6430291A (en) | 1989-02-01 |
Family
ID=16198757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18701887A Pending JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430291A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1422055A1 (en) * | 2001-07-30 | 2004-05-26 | Mitsui Mining & Smelting Co., Ltd. | Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| US8221846B2 (en) | 2002-05-02 | 2012-07-17 | Hussmann Corporation | Merchandisers having anti-fog coatings and methods for making the same |
| JPWO2012169550A1 (en) * | 2011-06-06 | 2015-02-23 | 凸版印刷株式会社 | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| US20180126716A1 (en) * | 2015-05-26 | 2018-05-10 | Thyssenkrupp Steel Europe Ag | Production of composite material by means of plasma coating |
-
1987
- 1987-07-27 JP JP18701887A patent/JPS6430291A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1422055A1 (en) * | 2001-07-30 | 2004-05-26 | Mitsui Mining & Smelting Co., Ltd. | Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| EP1422055A4 (en) * | 2001-07-30 | 2006-12-20 | Mitsui Mining & Smelting Co | Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| US8221846B2 (en) | 2002-05-02 | 2012-07-17 | Hussmann Corporation | Merchandisers having anti-fog coatings and methods for making the same |
| JPWO2012169550A1 (en) * | 2011-06-06 | 2015-02-23 | 凸版印刷株式会社 | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| JP2017199918A (en) * | 2011-06-06 | 2017-11-02 | ディーエスエム アイピー アセッツ ビー．ブイ． | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| US20180126716A1 (en) * | 2015-05-26 | 2018-05-10 | Thyssenkrupp Steel Europe Ag | Production of composite material by means of plasma coating |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4806432A (en) | Copper-foiled laminated sheet for flexible printed circuit board | |
| EP0124847A3 (en) | A flexible base plate for printed circuit board and a method for the preparation thereof | |
| ATE188749T1 (en) | DELAMINATION RESISTANT METAL FILM LAMINATE | |
| ES8407525A1 (en) | Compositions convertible to reinforced conductive components and articles incorporating same. | |
| EP0294232A3 (en) | An epoxy resin multi-layer laminate | |
| DE3884114D1 (en) | Composite foil material. | |
| CA2338670A1 (en) | Resin/copper/metal laminate and method of producing same | |
| EP0331429A3 (en) | A laminated printed circuit board and process for its manufacture | |
| KR900004225A (en) | Printed wiring boards, methods of making such plates and insulating films for use in such plates | |
| EP0360295A3 (en) | Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made | |
| EP0389951A3 (en) | Heat resistant adhesive composition and bonding method using the same | |
| GB1211494A (en) | Copper foil having improved bond strength | |
| JPS6430291A (en) | Material of flexible printed circuit board | |
| MX9803358A (en) | Multilayer printed circuit board and process for producing the same. | |
| TW200520640A (en) | Sheet for flexible printed circuit board and method for manufacture thereof | |
| JPS6450592A (en) | Super-heat dissipation type composite circuit board | |
| SG52528A1 (en) | Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture | |
| GB1411799A (en) | Laminates of electrically conducting and insulating material | |
| ES483975A1 (en) | Multilayer printed circuit | |
| JPS51119780A (en) | A composite sheet | |
| IE850184L (en) | Circuit boards made of laminates | |
| JPS6489591A (en) | Manufacture of wiring board and that of multilayer wiring board | |
| ATE155312T1 (en) | PRODUCTION PROCESS OF A MULTI-LAYER CIRCUIT BOARD | |
| Swisher | Metal--Film Laminate Resistant to Delamination | |
| Suzuki et al. | Manufacturing a Laminating Printed Circuit Board |