GB1211494A - Copper foil having improved bond strength - Google Patents

Copper foil having improved bond strength

Info

Publication number
GB1211494A
GB1211494A GB6137/69A GB613769A GB1211494A GB 1211494 A GB1211494 A GB 1211494A GB 6137/69 A GB6137/69 A GB 6137/69A GB 613769 A GB613769 A GB 613769A GB 1211494 A GB1211494 A GB 1211494A
Authority
GB
United Kingdom
Prior art keywords
bond strength
foil
matte surface
electrodeposited
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6137/69A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil USA Inc
Original Assignee
Circuit Foil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Corp filed Critical Circuit Foil Corp
Publication of GB1211494A publication Critical patent/GB1211494A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1,211,494. Laminates. CIRCUIT FOIL CORP. 5 Feb., 1969 [6 Feb., 1968], No. 6137/69. Heading B5N. [Also in Division C7] For forming laminates, e.g. printed electronic circuits, of improved bond strength, copper foil (e.g. as elongated electrodeposited or rolled web) having at least one matte surface comprised of a microcrystalline powdery (e.g. dendritic or modularized) copper electrodeposit is completely coated on its matte surface with a metal chemically inert to the substrate at elevated temperature to which the foil is to be bonded, e.g. using an epoxy resin or a fluorinated ethylene propylene resin as adhesive, and having a thickness such that the coating causes no decrease in initial bond strength. The metal coating may be Ni, Co, Cr or stainless steel, electrodeposited or vapour deposited on to the surface e.g. in amount of 0À2-1À0 g./sq. m. of matte surface area. The substrate may be of polyimide or of fibreglass impregnated with PTFE, a polymer of C 2 ClF 3 , or epoxy resin.
GB6137/69A 1968-02-06 1969-02-05 Copper foil having improved bond strength Expired GB1211494A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70325368A 1968-02-06 1968-02-06

Publications (1)

Publication Number Publication Date
GB1211494A true GB1211494A (en) 1970-11-04

Family

ID=24824652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6137/69A Expired GB1211494A (en) 1968-02-06 1969-02-05 Copper foil having improved bond strength

Country Status (7)

Country Link
JP (1) JPS5343555B1 (en)
BE (1) BE727909A (en)
DE (1) DE1905958A1 (en)
FR (1) FR2001410A1 (en)
GB (1) GB1211494A (en)
LU (1) LU57916A1 (en)
NL (2) NL6901906A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3112216A1 (en) * 1980-04-03 1982-02-04 Furukawa Circuit Foil Co., Ltd., Tokyo COPPER FILM FOR A PRINTED CIRCUIT AND METHOD FOR THEIR PRODUCTION
DE3307748A1 (en) * 1982-03-05 1983-09-15 Olin Corp., 62024 East Alton, Ill. METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US4619871A (en) * 1984-06-28 1986-10-28 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit board
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS546701B1 (en) * 1972-03-21 1979-03-30
DE2616865C2 (en) * 1976-04-15 1985-02-28 Fritz Schäfer GmbH, 5908 Neunkirchen Large-capacity rubbish bin with a floating, movable lid
JPS5932206U (en) * 1982-08-25 1984-02-28 松下精工株式会社 Holding device for quartz tube heater
DE3321317A1 (en) * 1983-06-13 1984-12-13 Fritz Schäfer GmbH, 5908 Neunkirchen Large capacity refuse container with a trough- or bucket-like receptacle

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3112216A1 (en) * 1980-04-03 1982-02-04 Furukawa Circuit Foil Co., Ltd., Tokyo COPPER FILM FOR A PRINTED CIRCUIT AND METHOD FOR THEIR PRODUCTION
DE3307748A1 (en) * 1982-03-05 1983-09-15 Olin Corp., 62024 East Alton, Ill. METHOD FOR TREATING A METAL FILM IN ORDER TO IMPROVE YOUR ADHESION
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4490218A (en) * 1983-11-07 1984-12-25 Olin Corporation Process and apparatus for producing surface treated metal foil
US4619871A (en) * 1984-06-28 1986-10-28 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit board
US4551210A (en) * 1984-11-13 1985-11-05 Olin Corporation Dendritic treatment of metallic surfaces for improving adhesive bonding
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil

Also Published As

Publication number Publication date
LU57916A1 (en) 1969-05-21
FR2001410A1 (en) 1969-09-26
BE727909A (en) 1969-07-16
JPS5343555B1 (en) 1978-11-21
DE1905958A1 (en) 1969-08-21
NL144810C (en)
NL6901906A (en) 1969-08-08

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
433D Application made for revocation (sect. 33/1949)
433G Case decided by the comptroller ** application refused (sect. 33/1949)
PE20 Patent expired after termination of 20 years