GB1137960A - Metal composite and electrolytic method of making same - Google Patents

Metal composite and electrolytic method of making same

Info

Publication number
GB1137960A
GB1137960A GB58370/66A GB5837066A GB1137960A GB 1137960 A GB1137960 A GB 1137960A GB 58370/66 A GB58370/66 A GB 58370/66A GB 5837066 A GB5837066 A GB 5837066A GB 1137960 A GB1137960 A GB 1137960A
Authority
GB
United Kingdom
Prior art keywords
nickel
foil
coating
composite material
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB58370/66A
Inventor
Betty Maud Luce
Betty Lee Berdan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Clevite Corp
Original Assignee
Clevite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clevite Corp filed Critical Clevite Corp
Publication of GB1137960A publication Critical patent/GB1137960A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

1,137,960. Printed circuits. CLEVITE CORP. 30 Dec., 1966 [6 June, 1966], No. 58370/66. Heading H1R. [Also in Division C7] Printed circuits may be produced from a composite material which comprises a foil of nickel, nickel alloy, copper or copper alloy having one surface adhered to a resinous substrate, e.g. a glass fibre reinforced epoxy resin, by means of an adhesive layer; said surface of the foil having, prior to formation of the composite material, been electrolytically coated with a nickel coating of suede-like appearance, i.e. a nickel coating which is not sound or smooth plate and which may contain nickel oxide or hydroxide. Prior to electrolytic coating the foil may be cleaned electrolytically or with finely divided magnesium oxide and may be etched, and after coating may receive a chromate dip. The foil may be produced by rolling or by electroforming. Details of the method of electrodeposition of the nickel coating appear in Divisions C6-C7.
GB58370/66A 1966-06-06 1966-12-30 Metal composite and electrolytic method of making same Expired GB1137960A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55525066A 1966-06-06 1966-06-06

Publications (1)

Publication Number Publication Date
GB1137960A true GB1137960A (en) 1968-12-27

Family

ID=24216569

Family Applications (1)

Application Number Title Priority Date Filing Date
GB58370/66A Expired GB1137960A (en) 1966-06-06 1966-12-30 Metal composite and electrolytic method of making same

Country Status (3)

Country Link
FR (1) FR1508435A (en)
GB (1) GB1137960A (en)
NL (1) NL166731C (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100138A1 (en) * 2002-05-23 2003-12-04 Antonio Rodriguez Siurana Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it
WO2005042049A2 (en) * 2003-11-03 2005-05-12 Medlogics Device Corporation Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69820245T2 (en) * 1998-07-24 2004-11-25 Nikko Materials Usa Inc., Chandler Process for producing a metal foil with improved adhesive properties on substrates
FR2825617B1 (en) 2001-06-12 2004-05-28 Maco Pharma Sa POCKET PROVIDED WITH MEANS OF TEMPORARY ASSOCIATION OF A FILTER

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2331751A (en) * 1939-08-16 1943-10-12 Int Nickel Co Process of electrodepositing hard nickel plating
US2456370A (en) * 1945-02-19 1948-12-14 Int Nickel Co Process for producing electrodeposited nickel strip containing boron
FR1325188A (en) * 1962-04-26 1963-04-26 Budd Co Laminated copper coated products and their manufacturing process

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003100138A1 (en) * 2002-05-23 2003-12-04 Antonio Rodriguez Siurana Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it
ES2203324A1 (en) * 2002-05-23 2004-04-01 Antonio Rodríguez Siurana Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it
EP1507900A1 (en) 2002-05-23 2005-02-23 Antonio Rodriguez Siurana Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it
WO2005042049A2 (en) * 2003-11-03 2005-05-12 Medlogics Device Corporation Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices
WO2005042049A3 (en) * 2003-11-03 2005-07-07 Medlogics Device Corp Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices
US7208172B2 (en) 2003-11-03 2007-04-24 Medlogics Device Corporation Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices

Also Published As

Publication number Publication date
FR1508435A (en) 1968-01-05
NL166731C (en) 1981-09-15
NL6700564A (en) 1967-12-07
NL166731B (en) 1981-04-15

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