GB1137960A - Metal composite and electrolytic method of making same - Google Patents
Metal composite and electrolytic method of making sameInfo
- Publication number
- GB1137960A GB1137960A GB58370/66A GB5837066A GB1137960A GB 1137960 A GB1137960 A GB 1137960A GB 58370/66 A GB58370/66 A GB 58370/66A GB 5837066 A GB5837066 A GB 5837066A GB 1137960 A GB1137960 A GB 1137960A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- foil
- coating
- composite material
- produced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
1,137,960. Printed circuits. CLEVITE CORP. 30 Dec., 1966 [6 June, 1966], No. 58370/66. Heading H1R. [Also in Division C7] Printed circuits may be produced from a composite material which comprises a foil of nickel, nickel alloy, copper or copper alloy having one surface adhered to a resinous substrate, e.g. a glass fibre reinforced epoxy resin, by means of an adhesive layer; said surface of the foil having, prior to formation of the composite material, been electrolytically coated with a nickel coating of suede-like appearance, i.e. a nickel coating which is not sound or smooth plate and which may contain nickel oxide or hydroxide. Prior to electrolytic coating the foil may be cleaned electrolytically or with finely divided magnesium oxide and may be etched, and after coating may receive a chromate dip. The foil may be produced by rolling or by electroforming. Details of the method of electrodeposition of the nickel coating appear in Divisions C6-C7.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55525066A | 1966-06-06 | 1966-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1137960A true GB1137960A (en) | 1968-12-27 |
Family
ID=24216569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB58370/66A Expired GB1137960A (en) | 1966-06-06 | 1966-12-30 | Metal composite and electrolytic method of making same |
Country Status (3)
Country | Link |
---|---|
FR (1) | FR1508435A (en) |
GB (1) | GB1137960A (en) |
NL (1) | NL166731C (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003100138A1 (en) * | 2002-05-23 | 2003-12-04 | Antonio Rodriguez Siurana | Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
WO2005042049A2 (en) * | 2003-11-03 | 2005-05-12 | Medlogics Device Corporation | Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0974685B1 (en) * | 1998-07-24 | 2003-12-03 | GA-TEK, Inc. (doing business as Gould Electronics Inc.) | Method for making a metal foil with improved bonding to substrates |
FR2825617B1 (en) | 2001-06-12 | 2004-05-28 | Maco Pharma Sa | POCKET PROVIDED WITH MEANS OF TEMPORARY ASSOCIATION OF A FILTER |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2331751A (en) * | 1939-08-16 | 1943-10-12 | Int Nickel Co | Process of electrodepositing hard nickel plating |
US2456370A (en) * | 1945-02-19 | 1948-12-14 | Int Nickel Co | Process for producing electrodeposited nickel strip containing boron |
FR1325188A (en) * | 1962-04-26 | 1963-04-26 | Budd Co | Laminated copper coated products and their manufacturing process |
-
1966
- 1966-12-30 GB GB58370/66A patent/GB1137960A/en not_active Expired
-
1967
- 1967-01-06 FR FR90171A patent/FR1508435A/en not_active Expired
- 1967-01-13 NL NL6700564.A patent/NL166731C/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003100138A1 (en) * | 2002-05-23 | 2003-12-04 | Antonio Rodriguez Siurana | Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
ES2203324A1 (en) * | 2002-05-23 | 2004-04-01 | Antonio Rodríguez Siurana | Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
EP1507900A1 (en) | 2002-05-23 | 2005-02-23 | Antonio Rodriguez Siurana | Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
WO2005042049A2 (en) * | 2003-11-03 | 2005-05-12 | Medlogics Device Corporation | Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices |
WO2005042049A3 (en) * | 2003-11-03 | 2005-07-07 | Medlogics Device Corp | Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices |
US7208172B2 (en) | 2003-11-03 | 2007-04-24 | Medlogics Device Corporation | Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices |
Also Published As
Publication number | Publication date |
---|---|
FR1508435A (en) | 1968-01-05 |
NL6700564A (en) | 1967-12-07 |
NL166731B (en) | 1981-04-15 |
NL166731C (en) | 1981-09-15 |
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