NL166731C - METHOD FOR COATING A NICKEL AND / OR COPPER SURFACE WITH A NICKEL-CONTAINING COAT, WHICH CAN BE FIRMLY ATTACHED TO A SUBSTRATE OF RESINY MATERIAL. - Google Patents

METHOD FOR COATING A NICKEL AND / OR COPPER SURFACE WITH A NICKEL-CONTAINING COAT, WHICH CAN BE FIRMLY ATTACHED TO A SUBSTRATE OF RESINY MATERIAL.

Info

Publication number
NL166731C
NL166731C NL6700564.A NL6700564A NL166731C NL 166731 C NL166731 C NL 166731C NL 6700564 A NL6700564 A NL 6700564A NL 166731 C NL166731 C NL 166731C
Authority
NL
Netherlands
Prior art keywords
nickel
resiny
coating
substrate
firmly attached
Prior art date
Application number
NL6700564.A
Other languages
Dutch (nl)
Other versions
NL6700564A (en
NL166731B (en
Original Assignee
Clevite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clevite Corp filed Critical Clevite Corp
Publication of NL6700564A publication Critical patent/NL6700564A/xx
Publication of NL166731B publication Critical patent/NL166731B/en
Application granted granted Critical
Publication of NL166731C publication Critical patent/NL166731C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
NL6700564.A 1966-06-06 1967-01-13 METHOD FOR COATING A NICKEL AND / OR COPPER SURFACE WITH A NICKEL-CONTAINING COAT, WHICH CAN BE FIRMLY ATTACHED TO A SUBSTRATE OF RESINY MATERIAL. NL166731C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US55525066A 1966-06-06 1966-06-06

Publications (3)

Publication Number Publication Date
NL6700564A NL6700564A (en) 1967-12-07
NL166731B NL166731B (en) 1981-04-15
NL166731C true NL166731C (en) 1981-09-15

Family

ID=24216569

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6700564.A NL166731C (en) 1966-06-06 1967-01-13 METHOD FOR COATING A NICKEL AND / OR COPPER SURFACE WITH A NICKEL-CONTAINING COAT, WHICH CAN BE FIRMLY ATTACHED TO A SUBSTRATE OF RESINY MATERIAL.

Country Status (3)

Country Link
FR (1) FR1508435A (en)
GB (1) GB1137960A (en)
NL (1) NL166731C (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0974685B1 (en) * 1998-07-24 2003-12-03 GA-TEK, Inc. (doing business as Gould Electronics Inc.) Method for making a metal foil with improved bonding to substrates
FR2825617B1 (en) 2001-06-12 2004-05-28 Maco Pharma Sa POCKET PROVIDED WITH MEANS OF TEMPORARY ASSOCIATION OF A FILTER
ES2203324B1 (en) * 2002-05-23 2005-02-16 Antonio Rodriguez Siurana COPPER SHEET, COMPOUND LAMINAR MATERIAL THAT INCLUDES SUCH COPPER SHEET AND PROCEDURE FOR OBTAINING IT.
US7208172B2 (en) 2003-11-03 2007-04-24 Medlogics Device Corporation Metallic composite coating for delivery of therapeutic agents from the surface of implantable devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2331751A (en) * 1939-08-16 1943-10-12 Int Nickel Co Process of electrodepositing hard nickel plating
US2456370A (en) * 1945-02-19 1948-12-14 Int Nickel Co Process for producing electrodeposited nickel strip containing boron
FR1325188A (en) * 1962-04-26 1963-04-26 Budd Co Laminated copper coated products and their manufacturing process

Also Published As

Publication number Publication date
FR1508435A (en) 1968-01-05
NL6700564A (en) 1967-12-07
NL166731B (en) 1981-04-15
GB1137960A (en) 1968-12-27

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Legal Events

Date Code Title Description
V4 Discontinued because of reaching the maximum lifetime of a patent