JPS5687676A - Production of copper foil - Google Patents

Production of copper foil

Info

Publication number
JPS5687676A
JPS5687676A JP16410979A JP16410979A JPS5687676A JP S5687676 A JPS5687676 A JP S5687676A JP 16410979 A JP16410979 A JP 16410979A JP 16410979 A JP16410979 A JP 16410979A JP S5687676 A JPS5687676 A JP S5687676A
Authority
JP
Japan
Prior art keywords
film
zinc
copper foil
forming
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16410979A
Other languages
Japanese (ja)
Other versions
JPS6133907B2 (en
Inventor
Eiji Hino
Masanori Hayashi
Takashi Suzuki
Minoru Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16410979A priority Critical patent/JPS5687676A/en
Publication of JPS5687676A publication Critical patent/JPS5687676A/en
Publication of JPS6133907B2 publication Critical patent/JPS6133907B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/78—Pretreatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain a copper foil which is improved of various characteristics, including rust preventive characteristic, that are required for the copper foil for a printed circuit by forming a zinc film on one of either rough or smooth surface of the copper foil then forming a Cr oxide film on this zinc film. CONSTITUTION:A zinc film is formed by, for example, zinc electrolysis operation on either one of the rough or smooth surface of a copper foil which has been roughened on one side. Thence, this zinc film is subjected to known chromate treatment to coat said zinc film with a chromium oxide layer. At the time of forming a film on the rough surface side in this case, the zinc coating amount is kept at 15- 1,500mug/dm<2> and chromium oxide at 15-30mug/dm<2> in terms of Cr amount. At the time of forming a film on the other smooth glossy surface side, zinc coating amount is kept at 30-250mug/dm<2> and Cr oxide amount at 15-30mug/dm<2> in terms of Cr amount. The resulted copper foil is coated with an adhesive agent on the rough surface side and is compression-bonded under heating to a basic material to make a copper-laminated film for the printed circuit and is used as the printed circuit board after subjecting required working operations.
JP16410979A 1979-12-19 1979-12-19 Production of copper foil Granted JPS5687676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16410979A JPS5687676A (en) 1979-12-19 1979-12-19 Production of copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16410979A JPS5687676A (en) 1979-12-19 1979-12-19 Production of copper foil

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP21235592A Division JPH05275817A (en) 1992-07-17 1992-07-17 Manufacture of copper foil

Publications (2)

Publication Number Publication Date
JPS5687676A true JPS5687676A (en) 1981-07-16
JPS6133907B2 JPS6133907B2 (en) 1986-08-05

Family

ID=15786917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16410979A Granted JPS5687676A (en) 1979-12-19 1979-12-19 Production of copper foil

Country Status (1)

Country Link
JP (1) JPS5687676A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002058442A1 (en) * 2001-01-22 2002-07-25 Sony Chemicals Corp. Flexible printed wiring board
JP2013004236A (en) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd Conductive base material for forming wring pattern of current collection sheet for solar cell
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208893A (en) * 2013-03-28 2014-11-06 古河電気工業株式会社 Surface-treated copper foil, method of treating surface of the copper foil, copper-clad laminate sheet and method of producing the laminate sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002058442A1 (en) * 2001-01-22 2002-07-25 Sony Chemicals Corp. Flexible printed wiring board
US6835442B2 (en) 2001-01-22 2004-12-28 Sony Chemicals Corp. Flexible printed wiring board
JP2013004236A (en) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd Conductive base material for forming wring pattern of current collection sheet for solar cell
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Also Published As

Publication number Publication date
JPS6133907B2 (en) 1986-08-05

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