JPS5687677A - Method of producing copper foil for printed circuit - Google Patents
Method of producing copper foil for printed circuitInfo
- Publication number
- JPS5687677A JPS5687677A JP16411079A JP16411079A JPS5687677A JP S5687677 A JPS5687677 A JP S5687677A JP 16411079 A JP16411079 A JP 16411079A JP 16411079 A JP16411079 A JP 16411079A JP S5687677 A JPS5687677 A JP S5687677A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- film
- oxide
- surface side
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrochemical Coating By Surface Reaction (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
PURPOSE:To produce a copper foil provided with various characteristics including rust preventive characteristic that are required for the copper foil for a printed circuit by forming a zinc film and a Cr oxide film in double on the smooth glossy surface side of the copper foil, and forming only the Cr oxide film on the rough surface side. CONSTITUTION:After a zinc film is formed by, for example, zonc electrolysis operation, only on the smooth glossy surface side of a copper foil which has been roughened on one side, a film of Cr oxide is formed on this zinc film. It is convenient to make combination use of a known immersion chromate treatment method and an electrolytic chromate treatment method in forming this Cr oxide film. The zinc coating amount of this case is kept at 30-250mug/dm<2> and Cr oxide coating amount is 15-30mug/dm<2> in terms of Cr amount. Additionally, a Cr oxide film of 60-90mug/dm<2> Cr oxide amount in terms of Cr amount is directly formed on the rough surface side of the copper foil, whereby the intended copper foil for printed circuits is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411079A JPS5687677A (en) | 1979-12-19 | 1979-12-19 | Method of producing copper foil for printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411079A JPS5687677A (en) | 1979-12-19 | 1979-12-19 | Method of producing copper foil for printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5687677A true JPS5687677A (en) | 1981-07-16 |
JPS6133908B2 JPS6133908B2 (en) | 1986-08-05 |
Family
ID=15786935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16411079A Granted JPS5687677A (en) | 1979-12-19 | 1979-12-19 | Method of producing copper foil for printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687677A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0441696A (en) * | 1990-06-05 | 1992-02-12 | Fukuda Metal Foil & Powder Co Ltd | Surface treatment of copper foil for printed circuit |
EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
EP0618755A1 (en) * | 1993-03-29 | 1994-10-05 | Japan Energy Corporation | Copper foil for printed circuits and process for producing the same |
US5389446A (en) * | 1992-02-19 | 1995-02-14 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits |
WO2000036188A3 (en) * | 1998-12-11 | 2000-11-23 | Bolta Werke Gmbh | Method for producing a self-supporting metal film |
JP2011129858A (en) * | 2009-11-18 | 2011-06-30 | Dainippon Printing Co Ltd | Wiring sheet, solar cell modules, and manufacturing methods thereof |
JP2013004236A (en) * | 2011-06-14 | 2013-01-07 | Dainippon Printing Co Ltd | Conductive base material for forming wring pattern of current collection sheet for solar cell |
US9666746B2 (en) | 2011-06-14 | 2017-05-30 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014208893A (en) * | 2013-03-28 | 2014-11-06 | 古河電気工業株式会社 | Surface-treated copper foil, method of treating surface of the copper foil, copper-clad laminate sheet and method of producing the laminate sheet |
-
1979
- 1979-12-19 JP JP16411079A patent/JPS5687677A/en active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0441696A (en) * | 1990-06-05 | 1992-02-12 | Fukuda Metal Foil & Powder Co Ltd | Surface treatment of copper foil for printed circuit |
EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
EP0541997A3 (en) * | 1991-11-15 | 1994-11-02 | Nikko Gould Foil Kk | Surface treatment method of a copper foil for printed circuits |
US5389446A (en) * | 1992-02-19 | 1995-02-14 | Nikko Gould Foil Co., Ltd. | Copper foil for printed circuits |
EP0618755A1 (en) * | 1993-03-29 | 1994-10-05 | Japan Energy Corporation | Copper foil for printed circuits and process for producing the same |
US5552234A (en) * | 1993-03-29 | 1996-09-03 | Japan Energy Corporation | Copper foil for printed circuits |
WO2000036188A3 (en) * | 1998-12-11 | 2000-11-23 | Bolta Werke Gmbh | Method for producing a self-supporting metal film |
US6632341B1 (en) | 1998-12-11 | 2003-10-14 | Bolta-Werke Gmbh | Method for producing a self-supporting metal film |
JP2011129858A (en) * | 2009-11-18 | 2011-06-30 | Dainippon Printing Co Ltd | Wiring sheet, solar cell modules, and manufacturing methods thereof |
JP2013004236A (en) * | 2011-06-14 | 2013-01-07 | Dainippon Printing Co Ltd | Conductive base material for forming wring pattern of current collection sheet for solar cell |
US9666746B2 (en) | 2011-06-14 | 2017-05-30 | Dai Nippon Printing Co., Ltd. | Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells |
Also Published As
Publication number | Publication date |
---|---|
JPS6133908B2 (en) | 1986-08-05 |
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