JPS5687695A - Copper foil for printed circuit and its manufacture - Google Patents
Copper foil for printed circuit and its manufactureInfo
- Publication number
- JPS5687695A JPS5687695A JP16411279A JP16411279A JPS5687695A JP S5687695 A JPS5687695 A JP S5687695A JP 16411279 A JP16411279 A JP 16411279A JP 16411279 A JP16411279 A JP 16411279A JP S5687695 A JPS5687695 A JP S5687695A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- zinc
- printed circuit
- manufacture
- zinc oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Abstract
PURPOSE: To manufacture copper foil for printed circuit having simultaneously various desired properties including rust preventive property at a low cost, by forming mixed coating of zinc or zinc oxide etc. by electroplating at least on one surface of the copper foil with plating soln. contg. zinc salt etc.
CONSTITUTION: Electroplating is performed by using plating soln. contg. zinc salt or zinc oxide and chromate at least on one surface of copper foil to form a mixed coating composed of zinc or zinc oxide and chromium oxide. Hereby copper foil for printed circuit excellent in rust preventive power, resistance to thermochromism, and peeling strength is manufactured simply and at a low cost by a continuous process.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411279A JPS587077B2 (en) | 1979-12-19 | 1979-12-19 | Copper foil for printed circuits and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411279A JPS587077B2 (en) | 1979-12-19 | 1979-12-19 | Copper foil for printed circuits and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5687695A true JPS5687695A (en) | 1981-07-16 |
JPS587077B2 JPS587077B2 (en) | 1983-02-08 |
Family
ID=15786974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16411279A Expired JPS587077B2 (en) | 1979-12-19 | 1979-12-19 | Copper foil for printed circuits and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS587077B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6484690A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | Printed wiring board and the production thereof |
EP0458916A1 (en) * | 1989-10-13 | 1991-12-04 | Olin Corp | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil. |
EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
US5449951A (en) * | 1992-01-17 | 1995-09-12 | Olin Corporation | Lead frames with improved adhesion to a polymer |
US6168703B1 (en) | 1997-09-04 | 2001-01-02 | Ga-Tek Inc. | Copper foil and laminate containing a hydrogen inhibitor |
KR101327565B1 (en) * | 2009-06-05 | 2013-11-12 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Copper foil for semiconductor package substrtate and subsrate for semiconductor package |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7749611B2 (en) * | 2002-12-05 | 2010-07-06 | Gbc Metals, L.L.C. | Peel strength enhancement of copper laminates |
JP4683646B2 (en) * | 2006-03-31 | 2011-05-18 | Jx日鉱日石金属株式会社 | Copper or copper alloy foil for printed circuit boards |
JP5672764B2 (en) * | 2010-05-13 | 2015-02-18 | 大日本印刷株式会社 | Wiring circuit laminate, suspension substrate using the same, and manufacturing method thereof |
-
1979
- 1979-12-19 JP JP16411279A patent/JPS587077B2/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6484690A (en) * | 1987-09-26 | 1989-03-29 | Matsushita Electric Works Ltd | Printed wiring board and the production thereof |
EP0458916A1 (en) * | 1989-10-13 | 1991-12-04 | Olin Corp | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil. |
EP0458916A4 (en) * | 1989-10-13 | 1994-02-09 | Olin Corporation | |
EP0541997A2 (en) * | 1991-11-15 | 1993-05-19 | Nikko Gould Foil Co., Ltd. | Surface treatment method of a copper foil for printed circuits |
EP0541997A3 (en) * | 1991-11-15 | 1994-11-02 | Nikko Gould Foil Kk | Surface treatment method of a copper foil for printed circuits |
US5449951A (en) * | 1992-01-17 | 1995-09-12 | Olin Corporation | Lead frames with improved adhesion to a polymer |
US6168703B1 (en) | 1997-09-04 | 2001-01-02 | Ga-Tek Inc. | Copper foil and laminate containing a hydrogen inhibitor |
KR101327565B1 (en) * | 2009-06-05 | 2013-11-12 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | Copper foil for semiconductor package substrtate and subsrate for semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
JPS587077B2 (en) | 1983-02-08 |
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