RU98102920A - COPPER FOIL FOR MANUFACTURE OF PRINTED BOARDS AND METHOD FOR PRODUCING IT - Google Patents

COPPER FOIL FOR MANUFACTURE OF PRINTED BOARDS AND METHOD FOR PRODUCING IT

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Publication number
RU98102920A
RU98102920A RU98102920/09A RU98102920A RU98102920A RU 98102920 A RU98102920 A RU 98102920A RU 98102920/09 A RU98102920/09 A RU 98102920/09A RU 98102920 A RU98102920 A RU 98102920A RU 98102920 A RU98102920 A RU 98102920A
Authority
RU
Russia
Prior art keywords
zinc
electrolyte
copper foil
copper
applying
Prior art date
Application number
RU98102920/09A
Other languages
Russian (ru)
Other versions
RU2138932C1 (en
Inventor
Акс Курт
Дюфресн Поль
Матье Мишель
Стрел Мишель
М.Вольски Эдам
Original Assignee
Сиркюи Фуаль С.А.
Filing date
Publication date
Application filed by Сиркюи Фуаль С.А. filed Critical Сиркюи Фуаль С.А.
Priority claimed from CN95197959A external-priority patent/CN1088323C/en
Publication of RU98102920A publication Critical patent/RU98102920A/en
Application granted granted Critical
Publication of RU2138932C1 publication Critical patent/RU2138932C1/en

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Claims (7)

1. Способ для защиты полученной электролитическим осаждением медной фольги, имеющей матовую поверхность (24) и противоположную блестящую поверхность (22), от окисления и образования оксидной пленки, включающий стадии: а) образования электролита, содержащего водный раствор, содержащий анионы, содержащие ионы шестивалентного хрома, и катионы цинка, и имеющий рН от 3 до 4,5; б) погружения указанной медной фольги в указанный электролит; и в) нанесение защитного слоя для устойчивости против окисления и образования оксидной пленки на матовую сторону указанной медной фольги путем превращения указанной медной фольги в катодную, при этом погружая в указанный электролит, тем самым формируя на ней защитный слой для устойчивости против окисления и образования оксидной пленки, состоящей из цинка и одного или нескольких соединений трехвалентного хрома, имеющего толщину менее, чем 10 нм
Figure 00000001
, и имеющего отношение цинка к хрому, по крайней мере, 1:1 по массе.1. A method for protecting obtained by electrolytic deposition of a copper foil having a matte surface (24) and an opposite shiny surface (22) from oxidation and the formation of an oxide film, comprising the steps of: a) forming an electrolyte containing an aqueous solution containing anions containing hexavalent ions chromium, and zinc cations, and having a pH of from 3 to 4.5; b) immersing said copper foil in said electrolyte; and c) applying a protective layer for resistance against oxidation and the formation of an oxide film on the matte side of said copper foil by converting said copper foil to a cathode, thereby immersing in said electrolyte, thereby forming a protective layer thereon for resistance against oxidation and oxide film formation consisting of zinc and one or more trivalent chromium compounds having a thickness of less than 10 nm
Figure 00000001
, and related to zinc to chromium, at least 1: 1 by weight. 2. Способ по п. 1, отличающийся тем, что указанный электролит имеет рН от 3,5 до 4. 2. The method according to p. 1, characterized in that said electrolyte has a pH from 3.5 to 4. 3. Способ по п. 1 или 2, отличающийся тем, что указанный электролит содержит неорганическую кислоту. 3. The method according to p. 1 or 2, characterized in that said electrolyte contains an inorganic acid. 4. Способ по п. 3, отличающийся тем, что указанная неорганическая кислота является фосфорной кислотой. 4. The method according to p. 3, characterized in that said inorganic acid is phosphoric acid. 5. Способ по п. 1, отличающийся тем, что указанный цинк содержится в кислом электролите в форме сульфата цинка, и указанный водный раствор содержит неорганическую кислоту для растворения указанного сульфата цинка. 5. The method according to p. 1, characterized in that said zinc is contained in an acidic electrolyte in the form of zinc sulfate, and said aqueous solution contains an inorganic acid to dissolve said zinc sulfate. 6. Способ по любому из предыдущих пунктов, отличающийся тем, что дополнительно включает стадию нанесения промежуточного слоя цинка на исходную фольгу перед нанесением защитного слоя. 6. The method according to any one of the preceding paragraphs, characterized in that it further includes the step of applying an intermediate layer of zinc on the starting foil before applying the protective layer. 7. Способ по любому из предыдущих пунктов, отличающийся тем, что дополнительно включает стадию нанесения на указанную блестящую сторону (22) обработки для сцепления, включающей полученный электролитическим осаждением дендритный слой меди и полученный электролитическим осаждением медный слой металлизации на указанном дендритном слое меди. 7. The method according to any one of the preceding paragraphs, characterized in that it further includes the step of applying to the shiny side (22) a bonding treatment comprising a dendritic copper layer obtained by electrolytic deposition and a copper metallization layer obtained by electrolytic deposition on said copper dendritic layer.
RU98102920/09A 1995-07-20 1995-07-20 Copper foil for manufacturing of printed circuit boards and method for its production RU2138932C1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN95197959A CN1088323C (en) 1995-07-20 1995-07-20 Copper foil for manufacture of printed circuits and method of producing same
CA002227179A CA2227179A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same
PCT/IB1995/000571 WO1997004627A1 (en) 1995-07-20 1995-07-20 Copper foil for the manufacture of printed circuits and method of producing same

Publications (2)

Publication Number Publication Date
RU98102920A true RU98102920A (en) 1999-09-20
RU2138932C1 RU2138932C1 (en) 1999-09-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU98102920/09A RU2138932C1 (en) 1995-07-20 1995-07-20 Copper foil for manufacturing of printed circuit boards and method for its production

Country Status (15)

Country Link
EP (1) EP0839440B1 (en)
JP (1) JP3363155B2 (en)
CN (1) CN1088323C (en)
AT (1) ATE186443T1 (en)
AU (1) AU2896995A (en)
BR (1) BR9510620A (en)
CA (1) CA2227179A1 (en)
DE (1) DE69513202T2 (en)
DK (1) DK0839440T3 (en)
ES (1) ES2140690T3 (en)
FI (1) FI980099A (en)
HK (1) HK1016407A1 (en)
PL (1) PL177139B1 (en)
RU (1) RU2138932C1 (en)
WO (1) WO1997004627A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4492434B2 (en) * 2005-05-16 2010-06-30 日立電線株式会社 Copper foil for printed wiring board, method for producing the same, and trivalent chromium chemical conversion treatment solution used for the production
JP4626390B2 (en) * 2005-05-16 2011-02-09 日立電線株式会社 Copper foil for printed wiring boards in consideration of environmental protection
CN102933746B (en) * 2010-06-30 2017-10-13 三井金属矿业株式会社 The manufacture method of copper foil for negative electrode current collector
JP5325175B2 (en) 2010-07-15 2013-10-23 Ｊｘ日鉱日石金属株式会社 Copper foil composite and method for producing molded body
RU2447210C1 (en) * 2010-12-28 2012-04-10 Вадим Эдуардович Карташян Technical polyamide fabric for manufacturing soil-filling constructions
US10178816B2 (en) 2011-05-13 2019-01-08 Jx Nippon Mining & Metals Corporation Copper foil composite, copper foil used for the same, formed product and method of producing the same
JP5822842B2 (en) 2012-01-13 2015-11-24 Jx日鉱日石金属株式会社 Copper foil composite, molded body and method for producing the same
JP5822838B2 (en) 2012-01-13 2015-11-24 Jx日鉱日石金属株式会社 Copper foil composite, molded body and method for producing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength

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