JPS6489591A - Manufacture of wiring board and that of multilayer wiring board - Google Patents

Manufacture of wiring board and that of multilayer wiring board

Info

Publication number
JPS6489591A
JPS6489591A JP24709387A JP24709387A JPS6489591A JP S6489591 A JPS6489591 A JP S6489591A JP 24709387 A JP24709387 A JP 24709387A JP 24709387 A JP24709387 A JP 24709387A JP S6489591 A JPS6489591 A JP S6489591A
Authority
JP
Japan
Prior art keywords
hole
wiring board
copper
copper foil
flexible substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24709387A
Other languages
Japanese (ja)
Other versions
JP2508538B2 (en
Inventor
Kenji Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP24709387A priority Critical patent/JP2508538B2/en
Publication of JPS6489591A publication Critical patent/JPS6489591A/en
Application granted granted Critical
Publication of JP2508538B2 publication Critical patent/JP2508538B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To improve reliability and to enable high-density mounting, by forming a via-hole in a both-copper-clad flexible substrate with a copper foil bonded on the surface at a specified position, through-hole plating only a via-hole by electrolytic plating, then etching the copper foil, and laminating a plurality of formed wiring boards via adhesives for their electric connection. CONSTITUTION:A both-copper-clad flexible substrate, rich in flexibility, is formed by bonding a copper foil 12 on the surface of a substrate 11 and coated with a photoresist 13. Then, a via-hole 14 is formed by boring the both-copper- clad flexible substrate at a specified position. Next, the via-hole 14 is treated with through-hole plating 15 by electrolytic plating to form a through-hole 16. A developed photoresist 13 is used as a mask 18 to etch the copper foil 12. A plurality of wiring boards thus formed are laminated via adhesives 21, and through-holes 16 are electrically connected, thereby forming a multilayer wiring board.
JP24709387A 1987-09-30 1987-09-30 Wiring board manufacturing method and multilayer wiring board manufacturing method Expired - Fee Related JP2508538B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24709387A JP2508538B2 (en) 1987-09-30 1987-09-30 Wiring board manufacturing method and multilayer wiring board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24709387A JP2508538B2 (en) 1987-09-30 1987-09-30 Wiring board manufacturing method and multilayer wiring board manufacturing method

Publications (2)

Publication Number Publication Date
JPS6489591A true JPS6489591A (en) 1989-04-04
JP2508538B2 JP2508538B2 (en) 1996-06-19

Family

ID=17158326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24709387A Expired - Fee Related JP2508538B2 (en) 1987-09-30 1987-09-30 Wiring board manufacturing method and multilayer wiring board manufacturing method

Country Status (1)

Country Link
JP (1) JP2508538B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03104189A (en) * 1989-09-18 1991-05-01 Matsushita Electric Works Ltd Manufacture of printed wiring board
US5052103A (en) * 1988-11-04 1991-10-01 Sharp Kabushiki Kaisha Method of manufacturing printed wiring board having no copper migration
JP2006140216A (en) * 2004-11-10 2006-06-01 Sharp Corp Double-sided circuit board and its manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108275A (en) * 2004-10-04 2006-04-20 Maruwa Seisakusho:Kk Method of manufacturing flexible printed board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052103A (en) * 1988-11-04 1991-10-01 Sharp Kabushiki Kaisha Method of manufacturing printed wiring board having no copper migration
JPH03104189A (en) * 1989-09-18 1991-05-01 Matsushita Electric Works Ltd Manufacture of printed wiring board
JP2006140216A (en) * 2004-11-10 2006-06-01 Sharp Corp Double-sided circuit board and its manufacturing method

Also Published As

Publication number Publication date
JP2508538B2 (en) 1996-06-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees