JPS6437084A - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPS6437084A JPS6437084A JP30839287A JP30839287A JPS6437084A JP S6437084 A JPS6437084 A JP S6437084A JP 30839287 A JP30839287 A JP 30839287A JP 30839287 A JP30839287 A JP 30839287A JP S6437084 A JPS6437084 A JP S6437084A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- hole
- layer substrate
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To facilitate electrical connection between a conductor pattern formed on the surface of an outer layer substrate and a conductor pattern formed on an inner layer substrate by a method wherein a part of the conductor pattern on the outer layer substrate, the inside of a via-hole and the surface of the conductor pattern on the inner layer substrate facing the via-hole are solidly and electrically connected with copper plating to form a blind via-hole. CONSTITUTION:A part of a conductor pattern 11 formed on the surface of an outer layer substrate 5, the inside of a via-hole 6 and the surface of a conductor pattern 12 on an inner layer substrate 7 facing the via-hole 6 are solidly and electrically connected with copper plating 10 to form a blind via-hole 14. With this constitution, the conductor pattern of the outermost layer is connected electrically to the conductor pattern of the inner layer substrate side with the blind via-hole 14 and a multilayer printed wiring board 20 with highly reliable electrical connection can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62308392A JPH0767012B2 (en) | 1987-12-04 | 1987-12-04 | Multilayer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62308392A JPH0767012B2 (en) | 1987-12-04 | 1987-12-04 | Multilayer printed wiring board |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18836796A Division JPH08330737A (en) | 1996-06-27 | 1996-06-27 | Multilayered printed-wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6437084A true JPS6437084A (en) | 1989-02-07 |
JPH0767012B2 JPH0767012B2 (en) | 1995-07-19 |
Family
ID=17980510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62308392A Expired - Lifetime JPH0767012B2 (en) | 1987-12-04 | 1987-12-04 | Multilayer printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0767012B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330737A (en) * | 1996-06-27 | 1996-12-13 | Ibiden Co Ltd | Multilayered printed-wiring board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041290A (en) * | 1984-07-09 | 1985-03-04 | ソニー株式会社 | Method of producing multilayer wiring board |
JPS6084898A (en) * | 1983-10-14 | 1985-05-14 | セイコーインスツルメンツ株式会社 | Method of wiring multilayer |
JPS6196578U (en) * | 1984-11-30 | 1986-06-21 |
-
1987
- 1987-12-04 JP JP62308392A patent/JPH0767012B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6084898A (en) * | 1983-10-14 | 1985-05-14 | セイコーインスツルメンツ株式会社 | Method of wiring multilayer |
JPS6041290A (en) * | 1984-07-09 | 1985-03-04 | ソニー株式会社 | Method of producing multilayer wiring board |
JPS6196578U (en) * | 1984-11-30 | 1986-06-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08330737A (en) * | 1996-06-27 | 1996-12-13 | Ibiden Co Ltd | Multilayered printed-wiring board |
Also Published As
Publication number | Publication date |
---|---|
JPH0767012B2 (en) | 1995-07-19 |
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Legal Events
Date | Code | Title | Description |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080719 Year of fee payment: 13 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080719 Year of fee payment: 13 |