JPS6196578U - - Google Patents
Info
- Publication number
- JPS6196578U JPS6196578U JP18176184U JP18176184U JPS6196578U JP S6196578 U JPS6196578 U JP S6196578U JP 18176184 U JP18176184 U JP 18176184U JP 18176184 U JP18176184 U JP 18176184U JP S6196578 U JPS6196578 U JP S6196578U
- Authority
- JP
- Japan
- Prior art keywords
- layer pattern
- layer
- pattern
- printed board
- electrolytic plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
第1図イ,ロ,ハは本考案の一実施例を説明す
る断面図、第2図イ,ロは本考案の別の実施例を
説明する断面図、第3図イ,ロは本考案のプリン
ト板のパターン走行を示し、イは断面図、ロは各
層パターン走行を示す斜視図、第4図、第5図、
第6図は従来の多層プリント板の層間接続を説明
する断面図、第7図は従来のスルーホール穴を避
けた配線パターンを説明する図である。
図において、1は銅箔、2は絶縁層、5,8は
メツキ、7,9は穴を示す。
Figure 1 A, B and C are sectional views explaining one embodiment of the present invention, Figure 2 A and B are sectional views explaining another embodiment of the present invention, and Figure 3 A and B are sectional views explaining the present invention. 4 shows the pattern running of the printed board, A is a cross-sectional view, B is a perspective view showing the pattern running of each layer, FIGS. 4 and 5,
FIG. 6 is a sectional view illustrating interlayer connections of a conventional multilayer printed board, and FIG. 7 is a diagram illustrating a wiring pattern that avoids conventional through-holes. In the figure, 1 is a copper foil, 2 is an insulating layer, 5 and 8 are platings, and 7 and 9 are holes.
Claims (1)
第2層パターンの間の絶縁層、或いは裏面層パタ
ーンと裏面層パターンの1つ手前の層パターンの
間の絶縁層に穴を明け、該穴の無電解メツキ及び
電解メツキを行い前記表面層パターンと第2層パ
ターン、或いは裏面層パターンと裏面層の1つ手
前の層パターンの接続を行うことを特徴とするウ
エル型スルーホールプリント板。 For each layer printed board, a hole is made in the insulating layer between the surface layer pattern and the second layer pattern, or between the back layer pattern and the layer pattern one layer before the back layer pattern, and the holes are removed. A well-type through-hole printed board characterized in that electrolytic plating and electrolytic plating are performed to connect the surface layer pattern and the second layer pattern, or the back layer pattern and the layer pattern one layer before the back layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18176184U JPS6196578U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18176184U JPS6196578U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6196578U true JPS6196578U (en) | 1986-06-21 |
Family
ID=30739302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18176184U Pending JPS6196578U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6196578U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6437084A (en) * | 1987-12-04 | 1989-02-07 | Ibiden Co Ltd | Multilayer printed wiring board |
JPS6437083A (en) * | 1987-07-31 | 1989-02-07 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
-
1984
- 1984-11-30 JP JP18176184U patent/JPS6196578U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6437083A (en) * | 1987-07-31 | 1989-02-07 | Ibiden Co Ltd | Manufacture of multilayer printed wiring board |
JPS6437084A (en) * | 1987-12-04 | 1989-02-07 | Ibiden Co Ltd | Multilayer printed wiring board |