JPS6157557U - - Google Patents
Info
- Publication number
- JPS6157557U JPS6157557U JP14228384U JP14228384U JPS6157557U JP S6157557 U JPS6157557 U JP S6157557U JP 14228384 U JP14228384 U JP 14228384U JP 14228384 U JP14228384 U JP 14228384U JP S6157557 U JPS6157557 U JP S6157557U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- double
- wiring board
- sided printed
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
Description
第１図乃至第５図は本考案に係る両面プリント
配線基板相互の接続構造の実施例を示し、第１図
は分解斜視図、第２図は組み付けた状態を示す斜
視図、第３図は平面図、第４図は底面図、第５図
は断面図、第６図乃至第８図は従来の両面プリン
ト配線基板相互の接続構造を示し、第６図は平面
図、第７図は底面側斜視図、第８図は他の例を示
す斜視図である。
１：第１の両面プリント配線基板、２，５：プ
リントパターン、３，６：接地側導体層、４：第
２の両面プリント配線基板、７：ピン、９：スル
ーホール。
1 to 5 show an embodiment of the connection structure between double-sided printed wiring boards according to the present invention, FIG. 1 is an exploded perspective view, FIG. 2 is a perspective view showing an assembled state, and FIG. 3 is an exploded perspective view. 4 is a bottom view, FIG. 5 is a cross-sectional view, FIGS. 6 to 8 show the connection structure between conventional double-sided printed wiring boards, FIG. 6 is a top view, and FIG. 7 is a bottom view. A side perspective view and FIG. 8 are perspective views showing another example. 1: first double-sided printed wiring board, 2, 5: printed pattern, 3, 6: ground side conductor layer, 4: second double-sided printed wiring board, 7: pin, 9: through hole.
Claims (1)
リント配線基板を配置すると共に両プリント配線
基板相互を接続するための接続構造であつて、 上記第１の両面プリント配線基板には配線兼用
のピンが立設されていると共に、第２の両面プリ
ント配線基板側には上記ピンに対応するピン孔が
穿孔されており、上記第１の両面プリント配線基
板にはハンダデイツプした際に噴流ハンダで両プ
リント配線基板の接地側導体層間を接続できるよ
うにしたスルーホールが設けられていることを特
徴とする両面プリント配線基板相互の接続構造。[Claims for Utility Model Registration] A connection structure for arranging a second double-sided printed wiring board on a first double-sided printed wiring board and for connecting both printed wiring boards to each other, the first double-sided printed wiring board The wiring board has pins that also serve as wiring, pin holes corresponding to the pins are drilled on the second double-sided printed wiring board, and solder dips are formed on the first double-sided printed wiring board. A connection structure between double-sided printed wiring boards, characterized in that a through hole is provided so that the ground side conductor layers of both printed wiring boards can be connected with jet solder when soldering is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14228384U JPH0351988Y2 (en) | 1984-09-21 | 1984-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14228384U JPH0351988Y2 (en) | 1984-09-21 | 1984-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6157557U true JPS6157557U (en) | 1986-04-17 |
| JPH0351988Y2 JPH0351988Y2 (en) | 1991-11-08 |
Family
ID=30700608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14228384U Expired JPH0351988Y2 (en) | 1984-09-21 | 1984-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351988Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212269A (en) * | 2013-04-19 | 2014-11-13 | 住友電工プリントサーキット株式会社 | Printed wiring board and manufacturing method of print wiring board |
| JPWO2015151292A1 (en) * | 2014-04-04 | 2017-04-13 | 三菱電機株式会社 | Printed wiring board unit |
-
1984
- 1984-09-21 JP JP14228384U patent/JPH0351988Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212269A (en) * | 2013-04-19 | 2014-11-13 | 住友電工プリントサーキット株式会社 | Printed wiring board and manufacturing method of print wiring board |
| JPWO2015151292A1 (en) * | 2014-04-04 | 2017-04-13 | 三菱電機株式会社 | Printed wiring board unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351988Y2 (en) | 1991-11-08 |