JP2014212269A - Printed wiring board and manufacturing method of print wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of easily and unfailingly preventing port opening from an overlapping state.SOLUTION: A printed wiring board includes: a body part having a conductive pattern layer; an overlapping part overlapped on the body part and having a conductive pattern layer; and a hinge part which continues into an area between an end edge of the body part and an end edge of the overlapping part in a bent state. The printed wiring board further includes: a through hole formed in a laminated body composed of the body part and the overlapping part; a swage component inserted into the through hole; and a joint material filling a gap between the swage component and the through hole. It is preferable that the swage component is made of a metal and the joint material is made of solder. Further, it is preferable that the conductive pattern layer located on an outer surface of the laminated body and around the through hole is covered by the solder. Furthermore, it is preferable that an adhesive layer is laminated on a space between the body part and the overlapping part in the laminated body.

Description

  The present invention relates to a printed wiring board and a method for manufacturing a printed wiring board.

  As a printed wiring board, a flexible printed wiring board including a flexible base film and a conductive pattern layer laminated on the base film is known. Such a flexible printed wiring board is widely used in the field of electronic devices and the like, and there are cases where it is folded and used in a superimposed state (Japanese Patent Laid-Open No. 2012-230954). See the official gazette). In this way, the superimposed printed wiring board is maintained in the superimposed state by providing the adhesive layer in the superimposed portion.

JP 2012-230954 A

  However, although the flexible printed wiring board has flexibility, a force for restoring from the folded state acts. For this reason, there is a possibility that the printed wiring board in the overlapped state will be opened by springback from the overlapped state, and there is a possibility that the opening cannot be sufficiently prevented only by the adhesive layer.

  The present invention has been made in view of the above inconveniences, and provides a printed wiring board capable of easily and surely preventing opening from a superimposed state, and a method for manufacturing the printed wiring board. Objective.

The printed wiring board according to the present invention made to solve the above problems is
Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A board,
A through hole formed in the laminate of the main body and the overlapping portion;
Caulking parts to be inserted into the through holes;
And a caulking component and a bonding material filled in a gap between the through holes.

In addition, another method for manufacturing a printed wiring board according to the present invention made to solve the above-described problems is as follows.
Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A method of manufacturing a board,
The process of obtaining the laminated body of the main-body part which has a through-hole, and a superimposition part by superimposing a main-body part and a superimposition part by bending the said hinge part using one board | substrate which has the said main-body part, a superimposition part, and a hinge part. When,
Filling the gap between the caulking component and the through hole with the caulking component inserted into the through hole.

  The said printed wiring board and its manufacturing method can prevent the opening from a superposition state easily and reliably.

FIG. 1 is a schematic plan view showing a printed wiring board according to an embodiment of the present invention. FIG. 2 is an enlarged schematic cross-sectional view of a main part of the printed wiring board of FIG. FIG. 3 is a schematic plan view of a flexible printed wiring board used in the printed wiring board of FIG. FIG. 4 is a schematic plan view in which a main part of the flexible printed wiring board of FIG. 3 is enlarged. FIG. 5 is an enlarged schematic cross-sectional view of a main part of the flexible printed wiring board of FIG. FIG. 6 is a schematic enlarged cross-sectional view of a main part of a laminate obtained by superimposing the flexible printed wiring board of FIG. FIG. 7 is a schematic enlarged cross-sectional view of a main part in a state where solder is supplied to the laminated body of FIG.

[Description of Embodiment of the Present Invention]
The printed wiring board according to the present invention,
Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A board,
A through hole formed in the laminate of the main body and the overlapping portion;
Caulking parts to be inserted into the through holes;
And a caulking component and a bonding material filled in a gap between the through holes.

  In the printed wiring board, the caulking component is inserted into the through hole, and the bonding material is filled in the gap between the caulking component and the through hole, so that the overlapping state of the main body portion and the overlapping portion is preferably maintained. That is, even if a force for opening the main body portion and the overlapping portion is generated by the spring back of the hinge portion, the overlapping state can be reliably maintained by the caulking parts and the bonding material. In addition, since the above-mentioned bonding material is used, the bonding material of the same type as the bonding material for other mounting components mounted on the printed wiring board is filled in the gap between the caulking component and the through hole as described above. Therefore, it is possible to easily obtain a structure for maintaining a superposed state.

  The caulking part may be made of metal, and the bonding material may be solder. By using solder as the bonding material, the same kind of solder as that used for mounting other mounting components can be used for the structure for maintaining the superimposed state. In addition, since the caulking part is made of metal, the solder flows reliably on the gap between the through hole and the caulking part because the solder flows on the surface of the metal caulking part.

  It is preferable that the solder covers the conductive pattern layer around the outer surface of the laminate and the through hole. That is, in the printed wiring board, the conductive pattern layer is not provided on the outer surface of the laminate and around the through hole, and the resin is exposed on the outer surface around the through hole. Although it is possible to supply the solder in a fluidized state, in this case, it is difficult for the solder in the fluidized state to accurately supply the periphery of the through hole, and it is difficult to accurately fill the through hole with the solder. There is a risk. For this reason, it is preferable to employ a configuration in which a conductive pattern layer exists around the through-hole as described above, and the conductive pattern layer is covered with solder, thereby accurately penetrating the solder in a fluid state. It can be supplied to the periphery of the hole, and solder can be easily and reliably filled into the through hole.

  In the laminated body, an adhesive layer may be laminated between the main body portion and the overlapping portion. Thereby, the superimposed state can be reliably maintained not only by the caulking parts and the bonding material but also by the adhesive layer.

Another method for producing a printed wiring board according to the present invention,
Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A method of manufacturing a board,
The process of obtaining the laminated body of the main-body part which has a through-hole, and a superimposition part by superimposing a main-body part and a superimposition part by bending the said hinge part using one board | substrate which has the said main-body part, a superimposition part, and a hinge part. When,
Filling the gap between the caulking component and the through hole with the caulking component inserted into the through hole.

  Since the printed wiring board manufactured by the manufacturing method includes a caulking part to be inserted into the through hole and a bonding material filled in the gap between the caulking part and the through hole, the overlapping state of the main body part and the overlapping part Is preferably maintained. In the manufacturing method, since the joining material is used as described above, the same kind of joining material as that for other mounting parts to be mounted on the printed wiring board is used as the caulking part and the through hole. Therefore, a structure for maintaining the overlapping state can be easily obtained.

  Hereinafter, embodiments of a flexible printed wiring board according to the present invention will be described in detail with reference to the drawings.

[Printed wiring board]
The printed wiring board 1 in FIG. 1 is superposed by bending one flexible printed wiring board 2. That is, the printed wiring board 1 includes, as shown in FIG. 2, a main body portion 3 having a conductive pattern layer 12, an overlapping portion 4 that is superimposed on the main body portion 3 and has a conductive pattern layer 12, A hinge portion 5 that is continuous in a bent state is provided between the edge and the edge of the overlapping portion 4. Further, in the laminated body composed of the overlapped main body portion 3 and the overlapping portion 4, an adhesive layer 6 is stacked between the main body portion 3 and the overlapping portion 4.

  The flexible printed wiring board 2 includes the main body portion 3, the hinge portion 5, and the overlapping portion 4. As shown in FIG. 3, the main body portion 3 and the overlapping portion 4 have substantially the same dimensions and a line symmetrical shape. Further, the hinge portion 5 is provided smaller than the main body portion 3 and the overlapping portion 4. The hinge portion 5, the main body portion 3, and the overlapping portion 4 are continuous at the approximate center of the edge of the main body portion 3 and the overlapping portion 4.

  Further, the main body portion 3 and the overlapping portion 4 of the flexible printed wiring board 2 are formed with a pair of perforations 10 at positions that coincide in the overlapping state. In the present embodiment, two pairs of the perforations 10 are formed in the main body portion 3 and the overlapping portion 4. The printed wiring board 1 has a through hole made of the perforations 10 in the stacked body body 3 and superimposed portion 4. The printed wiring board 1 includes a caulking component 20 to be inserted into the through hole, and a bonding material 17 made of solder filled in a gap between the caulking component and the through hole.

  The size of the through hole is not particularly limited, but the lower limit of the inner diameter of the through hole (perforation 10) is preferably 100 μm, and more preferably 200 μm. If the inner diameter of the through hole is less than the lower limit, it may be difficult to insert a caulking part 20 described later. On the other hand, the upper limit of the inner diameter of the through hole is preferably 5 mm, and more preferably 2 mm. If the inner diameter of the through hole exceeds the above upper limit, the structure for preventing the opening will be too large, and this through hole may restrict the pattern design of the conductive pattern layer 12.

  The flexible printed wiring board 2 constituting the printed wiring board 1 includes a flexible base film 11 and the conductive pattern layer 12 laminated on one surface of the base film 11. The flexible printed wiring board 2 includes a protective film 13 that covers the conductive pattern layer 12.

  The base film 11 is composed of a sheet-like member having electrical insulation. Specifically, a resin film can be adopted as the base film 11. As a material for this resin film, for example, polyimide, polyethylene terephthalate or the like is preferably used.

  As a minimum of average thickness of base film 11, 5 micrometers is preferred and 10 micrometers is more preferred. When the average thickness of the base film 11 is less than the above lower limit, the strength of the base film 11 may be insufficient. On the other hand, the upper limit of the average thickness of the base film 11 is preferably 200 μm, and more preferably 100 μm. When the average thickness of the base film 11 exceeds the above upper limit, the restoring force (spring back) of the hinge part 5 may be too large.

  The conductive pattern layer 12 has a desired planar shape (pattern), and is laminated on one surface of the base film 11 (a surface that is an outer surface in a superimposed state), and the main body portion 3, the hinge portion 5, and the overlapping portion 4. Are provided continuously. The conductive pattern layer 12 has a solder placement portion 12a located around the perforation 10 (through hole). The solder mounting portion 12a is covered with solder as a bonding material as will be described later.

  The conductive pattern layer 12 is laminated on the outer surface of the pattern portion 16 in the solder placement portion 12a and the pattern portion 16 formed in a desired planar shape by etching the metal layer laminated on the base film 11. And a caulking part land 17. The metal layer forming the pattern portion 16 can be formed of a conductive material. However, the pattern portion 16 having a desired shape in plan view can be easily and reliably formed by using a copper foil. The etching for forming the planar shape of the pattern portion 16 can be dry etching, but is preferably wet etching. Thereby, the pattern part 16 can be formed in a desired planar shape easily and reliably. This etching is performed by masking the metal layer for the portion to be the pattern portion 16 and removing a desired portion (unmasked portion) of the metal layer using an etching solution. For example, sulfuric acid / hydrogen peroxide (mixed solution of sulfuric acid and hydrogen peroxide solution), sodium sulfate sulfate, and the like can be used.

  In addition, it does not specifically limit as a method of laminating | stacking the said metal layer on the base film 11, For example, the resin composition which is the material of the base film 11 is apply | coated on the metal foil, the adhesion method which bonds metal foil with an adhesive agent, for example. A sputtering / plating method in which a metal layer is formed by electrolytic plating on a thin conductive layer (seed layer) having a thickness of several nanometers formed on the base film 11 by casting, sputtering or vapor deposition, and a metal foil is attached by hot pressing A laminating method can be used.

  Although the thickness of the said pattern part 16 is not specifically limited, As a minimum of the average thickness of the pattern part 16, 2 micrometers is preferable and 5 micrometers is more preferable. When the average thickness of the pattern portion 16 is less than the above lower limit, the conductivity of the pattern portion 16 may be insufficient. On the other hand, the upper limit of the average thickness of the pattern portion 16 is preferably 60 μm, and more preferably 40 μm. When the average thickness of the pattern part 16 exceeds the said upper limit, there exists a possibility that the restoring force of the hinge part 5 may become strong too much.

  The caulking part land 17 is laminated on the outer surface of the pattern 16 by, for example, plating. As the metal constituting the caulking part land portion 17, a metal usually used for plating such as gold, copper, and nickel can be used, and it is preferable to use gold having excellent conductivity.

  The thickness of the caulking part land 17 is not particularly limited, but the lower limit of the average thickness of the caulking part land 17 is preferably 3 μm and more preferably 5 μm. If the average thickness of the caulking part land portion 17 is less than the lower limit, the effect of providing the caulking part land portion 17 may not be sufficiently achieved. On the other hand, the upper limit of the average thickness of the caulking part land portion 17 is preferably 30 μm, and more preferably 25 μm. If the average thickness of the caulking part land portion 17 exceeds the above upper limit, there is a risk that the cost for forming the caulking part land portion 17 may be excessive, and the printed wiring board 1 may become too thick.

  The plating process for forming the caulking part land 17 may be electroless plating or electrolytic plating, but electroless plating is preferable. The plating conditions (time, solution concentration, etc.) are preferably adjusted so that the caulking part land 17 has a desired thickness.

  Furthermore, the conductive pattern layer 12 has a land portion (not shown) on which another mounting component is mounted. The land portions for mounting components may be provided on either the superposed surface side or the back surface side, and may be provided on both the front surface side and the back surface side. The land portion can adopt the same configuration as the caulking part land portion 17. The blind wiring board may further include a mounting component mounted on the land portion.

  The protective film 13 has a hole having a diameter larger than that of the perforation 10, and the solder placement portion 12a of the conductive pattern layer 12 is exposed from the hole portion (see FIG. 4).

  As this protective film 13, for example, a coverlay can be used. This coverlay has an insulating layer and an adhesive layer. The material of the insulating layer is not particularly limited, but the same material as the resin film constituting the base film 11 can be used.

  The lower limit of the average thickness of the insulating layer of the cover lay is preferably 5 μm and more preferably 10 μm. When the average thickness of the insulating layer of the coverlay is less than the above lower limit, the insulating property may be insufficient. On the other hand, the upper limit of the average thickness of the insulating layer of the coverlay is preferably 25 μm and more preferably 12.5 μm. When the average thickness of the insulating layer of the coverlay exceeds the above upper limit, the restoring force of the hinge part 5 may be too strong.

  In addition, the adhesive constituting the adhesive layer of the coverlay is not particularly limited, but is preferably excellent in flexibility and heat resistance. Examples of such an adhesive include nylon and epoxy resin. And various resin adhesives such as butyral resin and acrylic resin. The average thickness of the adhesive layer of the coverlay is not particularly limited, but is preferably 20 μm or more and 30 μm or less. If the average thickness of the adhesive layer of the coverlay is less than the above lower limit, the adhesiveness may be insufficient, and if it exceeds the upper limit, the restoring force of the hinge part 5 may be too strong.

  As the bonding material 15, a conductive material can be preferably used, but solder is preferably used. As this solder, the same one used for mounting other mounting components can be used, and as the material of this solder, an alloy containing tin is preferably used, and SnAgCu alloy, SnZnBi alloy, SnCu A lead-free solder such as an alloy or a SnAgInBi alloy is more preferably used.

  The caulking component 20 has a shaft portion 20a inserted into the through hole, and a head portion 20b having a diameter larger than that of the shaft portion 20a and located on the outer surface side of the through hole. The solder is filled between the shaft portion 20a and the inner surface of the through hole. The solder is also filled between the head portion 20b and the caulking part land portion 17.

  The outer diameter of the shaft portion 20a is not particularly limited, but is preferably larger than the inner diameter of the through hole by 10 μm or more. The lower limit of the difference between the outer diameter of the shaft portion 20a and the inner diameter of the through hole is more preferably 100 μm. If the difference is less than the lower limit, it may be difficult to insert the caulking component 20 into the through hole. On the other hand, the upper limit of the difference is preferably 1 mm, and more preferably 0.5 mm. If the difference exceeds the upper limit, it may be difficult to accurately fill the bonding material between the through hole and the shaft portion 20a. The outer diameter of the head 20b is not particularly limited, but is preferably larger than the inner diameter of the through hole.

  The material of the caulking component 20 is not particularly limited, but is preferably a metal or a metal whose surface is plated. It is preferable that at least the surface of the caulking part 20, particularly a part of the surface in contact with the solder, is a metal having high reactivity with the solder, for example, tin, gold, silver, copper, brass, lead, nickel or the like. Furthermore, it is preferable that the arithmetic average roughness (Ra) of at least a part of the surface of the caulking component 20 that contacts the solder is 0.05 μm or less. In addition, this arithmetic mean roughness (Ra) is a value calculated | required based on JIS-B0601 (2001), and can be measured on condition of evaluation length 3mm, cutoff value (lambda) s2.5micrometer, and (lambda) c0.8mm. it can.

  Although it does not specifically limit as an adhesive agent which comprises the said adhesive bond layer 6, For example, various resin adhesives, such as a nylon type, an epoxy resin type, a butyral resin type, an acrylic resin type, are mentioned. . Although it does not specifically limit as average thickness of the adhesive bond layer 6, 20 micrometers or more and 30 micrometers or less are preferable.

[Manufacturing method of the printed wiring board]
The method of manufacturing the printed wiring board 1 is as follows:
The main body part 3 having the conductive pattern layer 12, the superposed part 4 superimposed on the main body part 3 and having the conductive pattern layer 12, and the edge of the main body part 3 and the edge of the superposed part 4 are continuous in a bent state. It is a manufacturing method of the printed wiring board 1 provided with the hinge part 5,
A single substrate having the main body part 3, the superimposing part 4 and the hinge part 5 is used, and the main body part 3 and the superimposing part 4 are superposed by bending the hinge part 5, and the main body part 3 having a through hole and the superimposing part. Obtaining a laminate of part 4;
Filling the gap between the caulking part 20 and the through hole with the caulking part 20 inserted into the through hole.

  The step of obtaining the laminated body includes a step of forming a pair or a plurality of pairs of perforations 10 at corresponding positions of the main body portion 3 and the overlapping portion 4 (positions that coincide with each other in the overlapping state), and bending the hinge portion 5 to form the perforations. 10 to superimpose the main body part 3 and the superimposing part 4 in a state where 10 matches (see FIG. 6). The perforation 10 is formed by, for example, an NC lathe. In addition, in the superimposing step, the adhesive layer 6 is formed in advance on the surface facing the main body portion 3 or the overlapping portion 4 when overlapping, and the main body portion 3 and both are bonded together by the adhesive layer 6 in the overlapping step. . In the step of obtaining the laminated body, the main body portion 3 and the overlapping portion 4 can be overlapped first, and then a through hole can be formed in the stacked body of the main body portion 3 and the overlapping portion 4.

  The bonding material filling step includes a step of supplying solder to the through hole made of the perforations 10 having the same position, and a step of inserting the caulking component 20 into the through hole. This bonding material filling step is performed in the same step as the mounting step of other mounting components mounted on the printed wiring board 1. In the solder supply step, fluidized solder is supplied to the through hole of the laminate and the periphery thereof. In the caulking part inserting step, the caulking part 20 is inserted into the through hole to which the flowing state solder is supplied as described above, thereby flowing the flowing solder between the through hole and the caulking part 20. . The bonding material filling step further includes a step of solidifying the fluidized solder poured between the through hole and the caulking component 20.

  Specifically, in the solder supply step, as shown in FIG. 7, the solder in a fluid state is printed (applied) on the laminate using a printing machine. Here, as the printing machine, a cream solder printing machine for printing cream solder can be used. In the solder filling step, the shaft portion 20a of the caulking component 20 is inserted into the through hole by a chip mounter or the like. In the solder solidification step, the fluidized solder can be solidified by preheating the laminated body on which the caulking component 20 is mounted, for example, in a reflow furnace and then performing main heating.

[advantage]
In the printed wiring board 1, the caulking component 20 is inserted into the through hole, and the gap between the caulking component 20 and the through hole is filled with solder, so that the main body portion 3 and the overlapping portion 4 are separated by the spring back of the hinge portion 5. Even if a force for opening the mouth is generated, the superimposed state can be reliably maintained by the caulking component 20 and the solder. In addition, since the adhesive layer 6 is laminated between the main body 3 and the overlapping portion 4, the overlapping state can be reliably maintained not only by the caulking component 20 and the solder but also by the adhesive layer 6.

  Further, as described above, the step of filling the gap between the caulking component 20 and the through hole with solder can be performed in the same step as the mounting of other mounting components to be mounted on the printed wiring board 1, so that a new step is added. A structure for maintaining the superposition state can be easily obtained without providing it.

  Further, since the caulking part 20 is made of metal, solder does not easily flow into the resin portion on the inner surface of the through hole as in the base film 11, but the solder easily flows on the surface of the metal caulking part 20. And the caulking component 20 can be reliably filled with solder.

  Also, since the solder covers the caulking part land portion 17 of the conductive pattern layer 12, the printed wiring board 1 can be electrically connected to the front and back at the through hole portion. Since the front and back conduction is obtained in this way, various designs such as a grounding effect can be made using this through-hole portion, and the degree of freedom in design is increased. Since the solder covers the caulking part land 17 in this way, that is, the conductive pattern layer 12 (caulking part land 17) is disposed around the through hole without the resin being exposed to the outer surface. The solder in a fluid state can be easily and reliably supplied around the through hole.

[Other Embodiments]
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is not limited to the configuration of the embodiment described above, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims. The

  For example, in the above-described embodiment, in the bonding material filling step, the solder in the fluid state is supplied first, and then the caulking part is inserted into the through hole, but the present invention is not limited to this, It is also possible to insert caulking parts into the through holes first and then supply solder in a fluid state to the through holes.

  Moreover, although what has a protective film was demonstrated in the said embodiment, a protective film is not an essential structural requirement of this invention. Further, even when a protective film is provided, the protective film is not limited to the one using a coverlay, and for example, a solder resist can be used as the protective film, and the protective film can be a coverlay and a solder resist. The use of both of these is also a matter that can be appropriately changed in design.

  Further, in the above-described embodiment, the case where one overlapping portion is superimposed on the main body portion has been described. Within the intended scope of the invention.

  Moreover, in the said embodiment, although what has a hinge part smaller than a main-body part and a superimposition part was demonstrated, this invention is not limited to this, A hinge part is the same width as a main-body part and a superimposition part, That is, it may be a printed wiring board obtained by bending a rectangular flexible printed wiring board to obtain a superimposed state.

  The present invention can be suitably used as a printed wiring board used in a state where a flexible printed wiring board is superimposed.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Flexible printed wiring board 3 Main-body part 4 Superimposition part 5 Hinge part 6 Adhesive layer 10 Perforation 11 Base film 12 Conductive pattern 12a Solder mounting part 13 Protective film 15 Joining material 16 Pattern part 17 Crimp part land part Caulking part 20a Shaft 20b Head

Claims (5)

Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A board,
A through hole formed in the laminate of the main body and the overlapping portion;
Caulking parts to be inserted into the through holes;
A printed wiring board comprising: a crimping part and a bonding material filled in a gap between the through holes.   The printed wiring board according to claim 1, wherein the caulking part is made of metal, and the bonding material is solder.   The printed wiring board according to claim 2, wherein the solder covers the conductive pattern layer around the outer surface of the laminate and the through hole.   The printed wiring board according to claim 1, wherein an adhesive layer is laminated between the main body portion and the overlapping portion of the laminate. Printed wiring comprising a main body portion having a conductive pattern layer, an overlapping portion overlapping the main body portion and having a conductive pattern layer, and a hinge portion continuous in a bent state between the edge of the main body portion and the end edge of the overlapping portion. A method of manufacturing a board,
The process of obtaining the laminated body of the main-body part which has a through-hole, and a superimposition part by superimposing a main-body part and a superimposition part by bending the said hinge part using one board | substrate which has the said main-body part, a superimposition part, and a hinge part. When,
And filling the gap between the caulking component and the through hole with the caulking component inserted into the through hole.

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