JPS6157565U - - Google Patents
Info
- Publication number
- JPS6157565U JPS6157565U JP14150584U JP14150584U JPS6157565U JP S6157565 U JPS6157565 U JP S6157565U JP 14150584 U JP14150584 U JP 14150584U JP 14150584 U JP14150584 U JP 14150584U JP S6157565 U JPS6157565 U JP S6157565U
- Authority
- JP
- Japan
- Prior art keywords
- view
- layer
- connection
- holes
- laminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 3
- 239000011229 interlayer Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 description 2
Description
第1図、第2図は本考案の実施例を示し、第1
図A,Bはベタパターンとの接続例におけるスル
ーホール部分の平面説明図と斜視図、第2図A,
Bは同じく信号パターンとの接続例におけるスル
ーホール部分の平面説明図と斜視図、第3図〜第
6図は従来例を示し、第3図A,Bはベタパター
ンとの接続例におけるスルーホール部分の平面説
明図と斜視図、第4図A,Bは同じく信号パター
ンとの接続例におけるスルーホール部分の平面説
明図と斜視図、第5図は多層プリント板の断面図
、第6図は導電層の一部平面図である。
2…電源導体、3…接地導体、4…絶縁層、5
…スルーホール、5a…スルーホールメツキ層、
11…クリアランス部、12…接続導体部、13
…ランド部。
Figures 1 and 2 show embodiments of the present invention;
Figures A and B are a plan view and a perspective view of the through-hole portion in an example of connection with a solid pattern, Figure 2A,
Similarly, B is a plan view and a perspective view of the through-hole portion in an example of connection with a signal pattern, FIGS. 3 to 6 show a conventional example, and FIGS. 3A and B are through-holes in an example of connection with a solid pattern. 4A and 4B are a plan view and a perspective view of the through-hole portion in an example of connection with a signal pattern, FIG. 5 is a cross-sectional view of the multilayer printed board, and FIG. FIG. 3 is a partial plan view of a conductive layer. 2... Power supply conductor, 3... Ground conductor, 4... Insulating layer, 5
...Through hole, 5a...Through hole plating layer,
11... Clearance part, 12... Connection conductor part, 13
...Land Department.
Claims (1)
用のスルーホールを有するプリント基板において
、スルーホールメツキ層に導体部を直接接続させ
るようにしたことを特徴とするプリント基板。 1. A printed circuit board formed by laminating an insulating layer and a conductive layer and having through holes for interlayer connection, characterized in that a conductor portion is directly connected to the through hole plating layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14150584U JPS6157565U (en) | 1984-09-18 | 1984-09-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14150584U JPS6157565U (en) | 1984-09-18 | 1984-09-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6157565U true JPS6157565U (en) | 1986-04-17 |
Family
ID=30699843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14150584U Pending JPS6157565U (en) | 1984-09-18 | 1984-09-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6157565U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63136596A (en) * | 1986-11-27 | 1988-06-08 | イビデン株式会社 | Multilayer printed interconnection board |
JPS64795A (en) * | 1987-01-20 | 1989-01-05 | Ibiden Co Ltd | Multilayer printed-interconnection board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558836A (en) * | 1978-07-03 | 1980-01-22 | Kazuyoshi Tsuji | Filter in filter equipment |
-
1984
- 1984-09-18 JP JP14150584U patent/JPS6157565U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558836A (en) * | 1978-07-03 | 1980-01-22 | Kazuyoshi Tsuji | Filter in filter equipment |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63136596A (en) * | 1986-11-27 | 1988-06-08 | イビデン株式会社 | Multilayer printed interconnection board |
JPS64795A (en) * | 1987-01-20 | 1989-01-05 | Ibiden Co Ltd | Multilayer printed-interconnection board |