JPS62147377U - - Google Patents
Info
- Publication number
- JPS62147377U JPS62147377U JP3495486U JP3495486U JPS62147377U JP S62147377 U JPS62147377 U JP S62147377U JP 3495486 U JP3495486 U JP 3495486U JP 3495486 U JP3495486 U JP 3495486U JP S62147377 U JPS62147377 U JP S62147377U
- Authority
- JP
- Japan
- Prior art keywords
- double
- circuit board
- printed circuit
- hole
- sided printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案実施例としての両面プリント基
板の平面図。第２図は第１図のＡ―Ａ線断面図。
第３図は従来の両面プリント基板の平面図。第４
図は第３図Ａ―Ａ線断面図。
１……絶縁ベース板、２，２′……導体パター
ン、２ａ……ランド部、３，３′……絶縁被覆、
４……スルーホール、６……電気回路素子、１３
……プローピングピン、２０……スルーホール部
の非被覆領域、３０……スルーホールに充填され
ると共にスルーホール部の領域を被覆する半田。
FIG. 1 is a plan view of a double-sided printed circuit board as an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1.
FIG. 3 is a plan view of a conventional double-sided printed circuit board. Fourth
The figure is a sectional view taken along line A--A in Figure 3. 1... Insulating base plate, 2, 2'... Conductor pattern, 2a... Land portion, 3, 3'... Insulating coating,
4... Through hole, 6... Electric circuit element, 13
. . . Proping pin, 20 . . . Uncovered area of the through hole portion, 30 . . . Solder that fills the through hole and covers the area of the through hole portion.
Claims (1)
し、更に該導体パターン上に絶縁被覆を為した両
面プリント基板において、前記両面の導体パター
ン同士を導通させるためのスルーホールを形成し
、このスルーホール内に半田等の導電物質を充填
し、更には、少なくとも該スルーホール部分には
前記絶縁被覆を無くして、該スルーホール部を電
気回路のチエツク用パツドとしたことを特徴とす
る両面プリント基板。 (2) 実用新案登録請求の範囲第１項記載におい
て、上記スルーホール部分には両面とも上記絶縁
被覆を無くした両面プリント基板。[Claims for Utility Model Registration] (1) In a double-sided printed circuit board in which conductive patterns are formed on both sides of an insulating base plate and an insulating coating is applied on the conductive patterns, a method for making the conductive patterns on both sides conductive with each other. A through hole is formed, a conductive material such as solder is filled in the through hole, and the insulating coating is removed from at least the through hole portion, so that the through hole portion is used as a pad for checking an electric circuit. A double-sided printed circuit board characterized by: (2) A double-sided printed circuit board as described in claim 1 of the utility model registration claim, in which the through-hole portion does not have the insulating coating on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3495486U JPS62147377U (en) | 1986-03-11 | 1986-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3495486U JPS62147377U (en) | 1986-03-11 | 1986-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62147377U true JPS62147377U (en) | 1987-09-17 |
Family
ID=30843993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3495486U Pending JPS62147377U (en) | 1986-03-11 | 1986-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62147377U (en) |
-
1986
- 1986-03-11 JP JP3495486U patent/JPS62147377U/ja active Pending