JPS61131873U - - Google Patents

Info

Publication number
JPS61131873U
JPS61131873U JP1542885U JP1542885U JPS61131873U JP S61131873 U JPS61131873 U JP S61131873U JP 1542885 U JP1542885 U JP 1542885U JP 1542885 U JP1542885 U JP 1542885U JP S61131873 U JPS61131873 U JP S61131873U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
solder plating
solder
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1542885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1542885U priority Critical patent/JPS61131873U/ja
Publication of JPS61131873U publication Critical patent/JPS61131873U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のプリント基板の一部を概略的
に示す上面図、第2図は第1図の―線に沿う
拡大断面図、第3図は従来のプリント基板の断面
図である。 1……ランドパターン、2……部品実装穴、3
……半田メツキ、3a……半田メツキ必要箇所、
4……ソルダーレジスト、5……プリント基板、
6……溝部。
FIG. 1 is a top view schematically showing a part of the printed circuit board of the present invention, FIG. 2 is an enlarged sectional view taken along the line --- in FIG. 1, and FIG. 3 is a sectional view of a conventional printed circuit board. 1...Land pattern, 2...Component mounting hole, 3
...Solder plating, 3a...Solder plating is required,
4...Solder resist, 5...Printed circuit board,
6... Groove.

Claims (1)

【実用新案登録請求の範囲】 (1) 導体パターン部における半田メツキ必要箇
所とソルダーレジスト塗布箇所間に溝部が形成さ
れていることを特徴とするプリント基板。 (2) 半田メツキ必要箇所がランドパターンであ
る実用新案登録請求の範囲第1項記載のプリント
基板。
[Scope of Claim for Utility Model Registration] (1) A printed circuit board characterized in that a groove is formed between a part where solder plating is required and a part where solder resist is applied in a conductor pattern part. (2) The printed circuit board according to claim 1, wherein the portion requiring solder plating is a land pattern.
JP1542885U 1985-02-06 1985-02-06 Pending JPS61131873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1542885U JPS61131873U (en) 1985-02-06 1985-02-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1542885U JPS61131873U (en) 1985-02-06 1985-02-06

Publications (1)

Publication Number Publication Date
JPS61131873U true JPS61131873U (en) 1986-08-18

Family

ID=30501265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1542885U Pending JPS61131873U (en) 1985-02-06 1985-02-06

Country Status (1)

Country Link
JP (1) JPS61131873U (en)

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