JPS6296880U - - Google Patents
Info
- Publication number
- JPS6296880U JPS6296880U JP18726385U JP18726385U JPS6296880U JP S6296880 U JPS6296880 U JP S6296880U JP 18726385 U JP18726385 U JP 18726385U JP 18726385 U JP18726385 U JP 18726385U JP S6296880 U JPS6296880 U JP S6296880U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- mounting surface
- wiring board
- printed wiring
- foil pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図はこの考案の印刷配線板のレジスト塗布
構造を示す断面図、第２図は従来例を示す断面図
、第３図は従来例を示す平面図、第４図は従来例
の作用を示す作用説明図である。
１１…基材、１２…部品実装面、１３…非部品
実装面、１４…部品実装スルーホール、１５…中
継スルーホール、１６…銅箔、１７…ハンダメツ
キ、１８…銅箔パターン、１９…レジスト、２０
…開口部。
Fig. 1 is a sectional view showing the resist coating structure of the printed wiring board of this invention, Fig. 2 is a sectional view showing the conventional example, Fig. 3 is a plan view showing the conventional example, and Fig. 4 shows the operation of the conventional example. FIG. 11... Base material, 12... Component mounting surface, 13... Non-component mounting surface, 14... Component mounting through hole, 15... Relay through hole, 16... Copper foil, 17... Solder plating, 18... Copper foil pattern, 19... Resist, 20
…Aperture.
Claims (1)
両側にレジストを塗布する印刷配線板のレジスト
塗布構造において、 部品実装面の銅箔パターンと非部品実装面の銅
箔パターンを接続する中継スルーホールに対して
、部品実装面側にはレジスト塗布をせず、非部品
実装面側にのみレジスト塗布をしたことを特徴と
する印刷配線板のレジスト塗布構造。[Claim for Utility Model Registration] In a resist coating structure of a printed wiring board in which resist is applied to both the component mounting surface and non-component mounting surface of the printed wiring board, the copper foil pattern on the component mounting surface and the copper foil pattern on the non-component mounting surface A resist coating structure for a printed wiring board characterized in that resist coating is not applied to the component mounting side of the relay through hole connecting the foil pattern, but only to the non-component mounting side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18726385U JPS6296880U (en) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18726385U JPS6296880U (en) | 1985-12-06 | 1985-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296880U true JPS6296880U (en) | 1987-06-20 |
Family
ID=31137583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18726385U Pending JPS6296880U (en) | 1985-12-06 | 1985-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296880U (en) |
-
1985
- 1985-12-06 JP JP18726385U patent/JPS6296880U/ja active Pending