JPS6294674U - - Google Patents

Info

Publication number
JPS6294674U
JPS6294674U JP18738085U JP18738085U JPS6294674U JP S6294674 U JPS6294674 U JP S6294674U JP 18738085 U JP18738085 U JP 18738085U JP 18738085 U JP18738085 U JP 18738085U JP S6294674 U JPS6294674 U JP S6294674U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
component mounting
conductor pattern
mounting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18738085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18738085U priority Critical patent/JPS6294674U/ja
Publication of JPS6294674U publication Critical patent/JPS6294674U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例におけるプリント基
板の導体パターンを示す平面図、第2図及び第3
図は従来のプリント基板の導体パターンを示す平
面図である。 4:導体パターン、4a:部品取付孔、5:電
子部品、6:ソルダーレジスト。
Figure 1 is a plan view showing the conductor pattern of a printed circuit board in one embodiment of the present invention, Figures 2 and 3 are
The figure is a plan view showing a conductor pattern of a conventional printed circuit board. 4: conductor pattern, 4a: component mounting hole, 5: electronic component, 6: solder resist.

Claims (1)

【実用新案登録請求の範囲】 1 所定の位置に部品取付孔が穿設され、且つ大
電流が印加される導体パターン全域に半田を付着
してなるプリント基板において、前記導体パター
ン上に複数条のソルダーレジストを部分的に付着
したことを特徴とするプリント基板。 2 前記部品取付孔に近傍するソルダーレジスト
が該部品取付孔を包含するように形成されている
ことを特徴とする実用新案登録請求の範囲第1項
記載のプリント基板。
[Claims for Utility Model Registration] 1. A printed circuit board in which component mounting holes are drilled at predetermined positions and solder is applied over the entire conductor pattern to which a large current is applied, in which a plurality of strips are formed on the conductor pattern. A printed circuit board characterized by having solder resist partially attached. 2. The printed circuit board according to claim 1, wherein the solder resist near the component mounting hole is formed to encompass the component mounting hole.
JP18738085U 1985-12-04 1985-12-04 Pending JPS6294674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18738085U JPS6294674U (en) 1985-12-04 1985-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18738085U JPS6294674U (en) 1985-12-04 1985-12-04

Publications (1)

Publication Number Publication Date
JPS6294674U true JPS6294674U (en) 1987-06-17

Family

ID=31137803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18738085U Pending JPS6294674U (en) 1985-12-04 1985-12-04

Country Status (1)

Country Link
JP (1) JPS6294674U (en)

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