JPS6367280U - - Google Patents
Info
- Publication number
- JPS6367280U JPS6367280U JP16016386U JP16016386U JPS6367280U JP S6367280 U JPS6367280 U JP S6367280U JP 16016386 U JP16016386 U JP 16016386U JP 16016386 U JP16016386 U JP 16016386U JP S6367280 U JPS6367280 U JP S6367280U
- Authority
- JP
- Japan
- Prior art keywords
- double
- sided
- substrates
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Description
第１図はこの考案に係る多層プリント基板の実
施例を示した断面図であり、第２図は従来の多層
プリント基板を示した断面図である。
１，３，５，７：銅箔ランド、２，４，６：絶
縁基板、８：搭載部品、Ａ：第１の両面基板、Ｂ
：第２の両面基板、９：ジヤンパーリード、１０
，１０ａ，１０ｂ：スルーホール、１１：半田加
工、１２：基板穴。
FIG. 1 is a sectional view showing an embodiment of a multilayer printed circuit board according to this invention, and FIG. 2 is a sectional view showing a conventional multilayer printed circuit board. 1, 3, 5, 7: Copper foil land, 2, 4, 6: Insulating board, 8: Mounted components, A: First double-sided board, B
: second double-sided substrate, 9: jumper lead, 10
, 10a, 10b: Through hole, 11: Soldering, 12: Board hole.
Claims (1)
および第２の両面基板と、この第１および第２の
両面基板間に全面的または、部分的に形成された
絶縁部材を挾着により多層化構成することを特徴
とした多層プリント基板。 (2) 第１および第２の両面基板に設けられた銅
箔パターン間をジヤンパーリードで電気的接続す
るように構成したことを特徴とする実用新案登録
請求の範囲第１項記載の多層プリント基板。 (3) 第１および第２の両面基板は可撓性両面基
または、硬質両面基板であることを特徴とする実
用新案登録請求の範囲第１項記載の多層プリント
基板。[Scope of claim for utility model registration] (1) First part consisting of a copper foil pattern and a through hole
A multilayer printed circuit board comprising a second double-sided substrate and an insulating member formed entirely or partially between the first and second double-sided substrates by clamping. (2) The multilayer print according to claim 1 of the utility model registration claim, characterized in that the copper foil patterns provided on the first and second double-sided boards are electrically connected by jumper leads. substrate. (3) The multilayer printed circuit board according to claim 1, wherein the first and second double-sided substrates are flexible double-sided substrates or rigid double-sided substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16016386U JPS6367280U (en) | 1986-10-21 | 1986-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16016386U JPS6367280U (en) | 1986-10-21 | 1986-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367280U true JPS6367280U (en) | 1988-05-06 |
Family
ID=31085287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16016386U Pending JPS6367280U (en) | 1986-10-21 | 1986-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367280U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129361A (en) * | 1978-03-06 | 1979-10-06 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS60245195A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Multilayer circuit board |
-
1986
- 1986-10-21 JP JP16016386U patent/JPS6367280U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129361A (en) * | 1978-03-06 | 1979-10-06 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS60245195A (en) * | 1984-05-18 | 1985-12-04 | 松下電器産業株式会社 | Multilayer circuit board |
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