JPH03102764U - - Google Patents
Info
- Publication number
- JPH03102764U JPH03102764U JP1070890U JP1070890U JPH03102764U JP H03102764 U JPH03102764 U JP H03102764U JP 1070890 U JP1070890 U JP 1070890U JP 1070890 U JP1070890 U JP 1070890U JP H03102764 U JPH03102764 U JP H03102764U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- conductive thin
- land
- printed circuit
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図はこの考案の一実施例による印刷回路配
線板の部分正面図、第２図Ａは従来の印刷回路配
線板の部分正面図、第２図Ｂは従来の印刷回路配
線板の部分側面図である。
図中、１……表面接続用電気部品、３……銅箔
パターン、３Ａ……絶縁性基板、４……銅箔ラン
ド（第２の導電性薄膜ランド）、７……銅箔ラン
ド（第１の導電性薄膜ランド）。なお、図中、同
一符号は同一、又は相当部分を示す。
Fig. 1 is a partial front view of a printed circuit wiring board according to an embodiment of the invention, Fig. 2A is a partial front view of a conventional printed circuit wiring board, and Fig. 2B is a partial side view of a conventional printed circuit wiring board. It is a diagram. In the figure, 1... Electrical component for surface connection, 3... Copper foil pattern, 3A... Insulating substrate, 4... Copper foil land (second conductive thin film land), 7... Copper foil land (second conductive thin film land). 1 conductive thin film land). In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
るために、通常前記電気部品の下側に位置する半
田付け可能な第１の導電性薄膜ランドと、半田付
け接続用の第２の導電性薄膜ランドとを備えた印
刷回路配線板において、前記第１の導電性薄膜ラ
ンドは前記第２の導電性薄膜ランドより幅広で前
記第２の導電性薄膜ランドに連接又は近接して設
けられることを特徴とする印刷回路配線板。 In order to solder and wire the electrical component for surface connection, a first solderable conductive thin film land, usually located on the underside of said electrical component, and a second conductive thin film for soldering connection. In the printed circuit wiring board having a land, the first conductive thin film land is wider than the second conductive thin film land and is provided in connection with or adjacent to the second conductive thin film land. Printed circuit wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1070890U JPH03102764U (en) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1070890U JPH03102764U (en) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102764U true JPH03102764U (en) | 1991-10-25 |
Family
ID=31514266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1070890U Pending JPH03102764U (en) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102764U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016063396A1 (en) * | 2014-10-23 | 2017-04-27 | 三菱電機株式会社 | Wiring board, electric motor, electrical equipment and air conditioner |
-
1990
- 1990-02-06 JP JP1070890U patent/JPH03102764U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016063396A1 (en) * | 2014-10-23 | 2017-04-27 | 三菱電機株式会社 | Wiring board, electric motor, electrical equipment and air conditioner |
| US10601285B2 (en) | 2014-10-23 | 2020-03-24 | Mitsubishi Electric Corporation | Wiring board, electric motor, electric apparatus, and air conditioner |