JPS61199073U - - Google Patents
Info
- Publication number
- JPS61199073U JPS61199073U JP8237985U JP8237985U JPS61199073U JP S61199073 U JPS61199073 U JP S61199073U JP 8237985 U JP8237985 U JP 8237985U JP 8237985 U JP8237985 U JP 8237985U JP S61199073 U JPS61199073 U JP S61199073U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- dummy
- breaking
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図乃至第４図は本考案の一実施例を示す図
で第１図は一部破断平面図、第２図は要部拡大図
、第３図は断面図、第４図は破断分割時の状態を
示す要部拡大部第５図は従来のスルーホールメツ
キ基板を示す平面図である。
図中、１はスルーホールメツキ基板、２は主基
板、３はダミー基板、６はミシン孔、９は導電箔
層、１０はスルーホールメツキである。
Figures 1 to 4 are views showing an embodiment of the present invention. Figure 1 is a partially cutaway plan view, Figure 2 is an enlarged view of the main part, Figure 3 is a sectional view, and Figure 4 is a broken section. FIG. 5 is a plan view showing a conventional through-hole plated board. In the figure, 1 is a through-hole plated board, 2 is a main board, 3 is a dummy board, 6 is a perforation hole, 9 is a conductive foil layer, and 10 is a through-hole plated board.
Claims (1)
主基板と、破断用ミシン孔を介して該主基板と接
続されたダミー基板とからなるスルーホールメツ
キプリント基板であつて、前記ダミー基板の前記
破断用ミシン孔の周縁に導電箔層を備えたことを
特徴とするスルーホールメツキプリント基板。 A through-hole plated printed circuit board consisting of a main board having through holes and a conductive pattern formed thereon, and a dummy board connected to the main board through a perforation hole for breaking, wherein the dummy board is used for breaking the dummy board. A through-hole plating printed circuit board characterized by having a conductive foil layer around the periphery of the perforation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082379U JPH0219978Y2 (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082379U JPH0219978Y2 (en) | 1985-05-30 | 1985-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199073U true JPS61199073U (en) | 1986-12-12 |
| JPH0219978Y2 JPH0219978Y2 (en) | 1990-05-31 |
Family
ID=30630041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082379U Expired JPH0219978Y2 (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0219978Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187221A (en) * | 2012-03-06 | 2013-09-19 | Fdk Corp | Bending reduction structure of printed circuit board and method for manufacturing circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014719A (en) * | 1983-07-07 | 1985-01-25 | アルプス電気株式会社 | Independent 2-circuit pushbutton switch |
| JPS6022393A (en) * | 1983-07-19 | 1985-02-04 | 田中貴金属工業株式会社 | Method of producing split printed board |
| JPS60147191A (en) * | 1984-01-11 | 1985-08-03 | 株式会社大昌電子 | Method of separating printed circuit board |
-
1985
- 1985-05-30 JP JP1985082379U patent/JPH0219978Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6014719A (en) * | 1983-07-07 | 1985-01-25 | アルプス電気株式会社 | Independent 2-circuit pushbutton switch |
| JPS6022393A (en) * | 1983-07-19 | 1985-02-04 | 田中貴金属工業株式会社 | Method of producing split printed board |
| JPS60147191A (en) * | 1984-01-11 | 1985-08-03 | 株式会社大昌電子 | Method of separating printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013187221A (en) * | 2012-03-06 | 2013-09-19 | Fdk Corp | Bending reduction structure of printed circuit board and method for manufacturing circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0219978Y2 (en) | 1990-05-31 |