JPS6296876U - - Google Patents
Info
- Publication number
- JPS6296876U JPS6296876U JP1985188577U JP18857785U JPS6296876U JP S6296876 U JPS6296876 U JP S6296876U JP 1985188577 U JP1985188577 U JP 1985188577U JP 18857785 U JP18857785 U JP 18857785U JP S6296876 U JPS6296876 U JP S6296876U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- circuit board
- printed circuit
- land
- pattern connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例を示す要部切断側面
図、第２図は本考案の一実施例に用いるプリント
基板を示す平面図、第３図は第２図のＡ―Ａ′線
断面図、第４図は従来の信号入出力ポストの実装
構造を示す要部切断側面図である。
１１…信号入出力ポスト、１２…挿入部、１３
…鍔、１４…信号ピン、２１…プリント基板、２
１ａ…表面層、２１ｂ…裏面層、２２…部品実装
用スルーホール、２２ａ…部品実装用ランド、２
３…パターン接続用スルーホール、２３ａ…パタ
ーン接続用ランド、２４…第１次電気銅メツキ、
２５…第２次電気銅メツキ。
Fig. 1 is a cutaway side view of essential parts showing an embodiment of the present invention, Fig. 2 is a plan view showing a printed circuit board used in an embodiment of the invention, and Fig. 3 is taken along the line A-A' in Fig. 2. The sectional view and FIG. 4 are main part cutaway side views showing the mounting structure of a conventional signal input/output post. 11... Signal input/output post, 12... Insertion part, 13
...Tsuba, 14...Signal pin, 21...Printed circuit board, 2
1a...Surface layer, 21b...Back layer, 22...Through hole for component mounting, 22a...Land for component mounting, 2
3... Through hole for pattern connection, 23a... Land for pattern connection, 24... Primary electrolytic copper plating,
25...Second electrolytic copper plating.
Claims (1)
個配置した部品実装用ランド及びパターン接続用
ランド、並びに表面層及び裏面層の間を貫通し、
対応する位置の前記部品実装用ランド同士及び前
記パターン接続用ランド同士を夫々接続する部品
実装用スルーホール及びパターン接続用スルーホ
ールを有するプリント基板と、該プリント基板の
前記部品実装用スルーホールに挿入される挿入部
、該挿入部の上部に連設した直方体形状の鍔及び
該鍔の上部に連設した信号ピンより形成される信
号入出力ポストとを備え、前記プリント基板の表
面層に設けた部品実装用スルーホールに前記信号
入出力ポストの挿入部を挿入し、前記信号入出力
ポストの鍔を前記プリント基板の部品実装用ラン
ドに当接させて前記入出力ポストを前記プリント
基板の表面層に実装するようにした信号入出力ポ
ストの実装構造において、前記プリント基板に、
部品実装用ランド、部品実装用スルーホール、パ
ターン接続用ランド及びパターン接続用スルーホ
ールを形成する第１の電気銅メツキと、該第１の
電気銅メツキの上に重ねて部品実装用ランド及び
部品実装用スルーホールを形成する第２の電気銅
メツキとを施し、前記プリント基板の表面層及び
裏面層の各表面に設けた部品実装用ランドの厚み
を、パターン接続用ランドの厚みよりも厚く形成
するようにした信号入出力ポストの実装構造。 A plurality of lands for component mounting and lands for pattern connection arranged at positions corresponding to each of the surface layer and the back layer, and penetrating between the surface layer and the back layer,
A printed circuit board having component mounting through holes and pattern connection through holes that connect the component mounting lands and the pattern connection lands at corresponding positions, respectively, and inserting into the component mounting through holes of the printed circuit board. a rectangular parallelepiped-shaped flange connected to the upper part of the insertion part, and a signal input/output post formed by a signal pin connected to the upper part of the flange, and provided on the surface layer of the printed circuit board. Insert the insertion part of the signal input/output post into the through hole for component mounting, bring the collar of the signal input/output post into contact with the component mounting land of the printed circuit board, and insert the input/output post into the surface layer of the printed circuit board. In the mounting structure of the signal input/output post mounted on the printed circuit board,
A first electrolytic copper plating forming a component mounting land, a through hole for component mounting, a land for pattern connection, and a through hole for pattern connection, and a land for component mounting and the component overlaid on the first electrolytic copper plating. A second electrolytic copper plating is applied to form a through hole for mounting, and the thickness of the land for component mounting provided on each surface of the front layer and the back layer of the printed circuit board is formed to be thicker than the thickness of the land for pattern connection. The mounting structure of the signal input/output post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985188577U JPS6296876U (en) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985188577U JPS6296876U (en) | 1985-12-06 | 1985-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296876U true JPS6296876U (en) | 1987-06-20 |
Family
ID=31140068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985188577U Pending JPS6296876U (en) | 1985-12-06 | 1985-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014208534A (en) * | 2008-08-29 | 2014-11-06 | ミシュラン ルシェルシュ エ テクニーク ソシエテ アノニム | 1-D tire patch device and method |
-
1985
- 1985-12-06 JP JP1985188577U patent/JPS6296876U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014208534A (en) * | 2008-08-29 | 2014-11-06 | ミシュラン ルシェルシュ エ テクニーク ソシエテ アノニム | 1-D tire patch device and method |