JPS63201370U - - Google Patents
Info
- Publication number
- JPS63201370U JPS63201370U JP9277687U JP9277687U JPS63201370U JP S63201370 U JPS63201370 U JP S63201370U JP 9277687 U JP9277687 U JP 9277687U JP 9277687 U JP9277687 U JP 9277687U JP S63201370 U JPS63201370 U JP S63201370U
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- land
- width
- conductive foil
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案に係るフレキシブルプリント回
路基板の一実施例を示す要部の一部破断平面図、
第２図は第１図−線断面図、第３図は接続構
造の断面図、第４図は従来の接続構造の平面図、
第５図は第４図−線断面図である。
１，２……フレキシブルプリント回路基板、３
……半田、４，８……ベースフイルム、５，９…
…導電箔、５ａ，９ａ……ランド部、６，１０…
…オーバーレイフイルム、７，１１……切欠部。
FIG. 1 is a partially cutaway plan view of essential parts showing an embodiment of the flexible printed circuit board according to the present invention;
Fig. 2 is a sectional view taken along the line shown in Fig. 1, Fig. 3 is a sectional view of the connection structure, and Fig. 4 is a plan view of the conventional connection structure.
FIG. 5 is a sectional view taken along the line of FIG. 4. 1, 2...Flexible printed circuit board, 3
...Solder, 4,8...Base film, 5,9...
...Conductive foil, 5a, 9a... Land portion, 6, 10...
...Overlay film, 7, 11...Notch.
Claims (1)
の上にオーバーレイフイルムを被覆し、このオー
バーレイフイルムに設けた切欠部より前記導電箔
の一部を外部に露呈させてランド部とした複数の
フレキシブルプリント回路基板を備え、前記切欠
部の幅は前記ランド部の幅より小さく設定され、
両回路基板のランド部を半田により接続するよう
にしたことを特徴とするフレキシブルプリント回
路基板の接続構造。 A plurality of flexible printed circuits in which a conductive foil is formed on a base film, an overlay film is further coated on the base film, and a part of the conductive foil is exposed to the outside through a notch provided in the overlay film to serve as a land portion. a substrate, the width of the notch is set smaller than the width of the land,
A flexible printed circuit board connection structure characterized in that the land portions of both circuit boards are connected by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9277687U JPS63201370U (en) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9277687U JPS63201370U (en) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201370U true JPS63201370U (en) | 1988-12-26 |
Family
ID=30954786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9277687U Pending JPS63201370U (en) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201370U (en) |
-
1987
- 1987-06-18 JP JP9277687U patent/JPS63201370U/ja active Pending