JPS624174U - - Google Patents
Info
- Publication number
- JPS624174U JPS624174U JP9442685U JP9442685U JPS624174U JP S624174 U JPS624174 U JP S624174U JP 9442685 U JP9442685 U JP 9442685U JP 9442685 U JP9442685 U JP 9442685U JP S624174 U JPS624174 U JP S624174U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic circuit
- printed wiring
- chip component
- wiring portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の回路基板を示す部
分平面図、第２図は従来の回路基板を示す部分平
面図、第３図はそのＡ―Ａ′断面図である。
３：印刷配線回路、３ａ：アースパターン、４
：金属ケース、５：チツプ部品、６：半田レジス
ト、７：回路基板、８：アースパターン３ａ上の
半田レジスト。
FIG. 1 is a partial plan view showing a circuit board according to an embodiment of the present invention, FIG. 2 is a partial plan view showing a conventional circuit board, and FIG. 3 is a sectional view taken along the line AA'. 3: Printed wiring circuit, 3a: Earth pattern, 4
: metal case, 5: chip component, 6: solder resist, 7: circuit board, 8: solder resist on earth pattern 3a.
Claims (1)
線部３ａを有する電子回路基板において、 該印刷配線部３ａのチツプ部品５が半田付けさ
れる部位の周囲に、半田の流出を防止する絶縁膜
８を被着することを特徴とする電子回路基板。[Claims for Utility Model Registration] In an electronic circuit board having a wide printed wiring portion 3a on which a chip component 5 is surface mounted, solder is applied around the portion of the printed wiring portion 3a to which the chip component 5 is soldered. An electronic circuit board characterized by being coated with an insulating film 8 that prevents leakage of the electronic circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442685U JPS624174U (en) | 1985-06-24 | 1985-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9442685U JPS624174U (en) | 1985-06-24 | 1985-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS624174U true JPS624174U (en) | 1987-01-12 |
Family
ID=30652949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9442685U Pending JPS624174U (en) | 1985-06-24 | 1985-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS624174U (en) |
-
1985
- 1985-06-24 JP JP9442685U patent/JPS624174U/ja active Pending
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