JPS61106073U - - Google Patents

Info

Publication number
JPS61106073U
JPS61106073U JP19248884U JP19248884U JPS61106073U JP S61106073 U JPS61106073 U JP S61106073U JP 19248884 U JP19248884 U JP 19248884U JP 19248884 U JP19248884 U JP 19248884U JP S61106073 U JPS61106073 U JP S61106073U
Authority
JP
Japan
Prior art keywords
solder resist
circuit board
printed circuit
soldering
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19248884U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19248884U priority Critical patent/JPS61106073U/ja
Publication of JPS61106073U publication Critical patent/JPS61106073U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のプリント基板の一実施例を示
す斜視図、第２図は従来のプリント基板を示す斜
視図である。 １……プリント基板、２……剥離不能なソルダ
ーレジスト、３……接点部、４……後付け部品搭
載部、５……耐熱テープ、６……半田付けランド
部、７……剥離可能なソルダーレジスト。 FIG. 1 is a perspective view showing an embodiment of the printed circuit board of the present invention, and FIG. 2 is a perspective view showing a conventional printed circuit board. 1... Printed circuit board, 2... Non-peelable solder resist, 3... Contact section, 4... Retrofitted component mounting section, 5... Heat-resistant tape, 6... Soldering land section, 7... Peelable solder Resist.

補正 昭６０．５．２１ 図面の簡単な説明を次のように補正する。 明細書第６頁４〜６行目を下記の通り訂正する
。 「第１図は本考案のプリント基板の一実施例を
示す斜視図、第２図は第１図―線に沿う断面
図、第３図は従来のプリント基板を示す斜視図、
第４図は第３図―線に沿う断面図である。」Amendment May 21, 1980 The brief description of the drawing is amended as follows. Lines 4 to 6 on page 6 of the specification are corrected as follows. ``Figure 1 is a perspective view showing an embodiment of the printed circuit board of the present invention, Figure 2 is a sectional view taken along the line of Figure 1, and Figure 3 is a perspective view showing a conventional printed circuit board.''
FIG. 4 is a sectional view taken along the line of FIG. 3. ”

Claims (1)

【実用新案登録請求の範囲】 (1) 導体パターンが形成され、その上へ半田付
けの必要な個所を除いてソルダーレジストが被覆
されたプリント基板において、前記半田付け後ソ
ルダーレジストを除去する必要のある部分のソル
ダーレジストが、スクリーン印刷により形成され
た剥離可能なソルダーレジストからなることを特
徴とするプリント基板。 (2) 前記半田付け後ソルダーレジストを除去す
る必要のある部分が、接点部または後付け部品搭
載部である実用新案登録請求の範囲第１項記載の
プリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board on which a conductor pattern is formed and a solder resist is coated on the conductor pattern except for the areas where soldering is required, there is no need to remove the solder resist after soldering. A printed circuit board characterized in that a certain portion of the solder resist is made of a peelable solder resist formed by screen printing. (2) The printed circuit board according to claim 1, wherein the portion where the solder resist needs to be removed after soldering is a contact portion or a retrofitted component mounting portion.
JP19248884U 1984-12-19 1984-12-19 Pending JPS61106073U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19248884U JPS61106073U (en) 1984-12-19 1984-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19248884U JPS61106073U (en) 1984-12-19 1984-12-19

Publications (1)

Publication Number Publication Date
JPS61106073U true JPS61106073U (en) 1986-07-05

Family

ID=30749903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19248884U Pending JPS61106073U (en) 1984-12-19 1984-12-19

Country Status (1)

Country Link
JP (1) JPS61106073U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240610A (en) * 1994-02-28 1995-09-12 Nec Corp Microstrip line coupler

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498765A (en) * 1972-05-19 1974-01-25
JPS5444663A (en) * 1970-06-13 1979-04-09 Bayer Ag Manufacture of aminophenyllcycloamidine and its salts
JPS581559A (en) * 1981-06-27 1983-01-06 凸版印刷株式会社 Manufacture of uneven floor material
JPS5835957A (en) * 1981-08-28 1983-03-02 Fujitsu Ltd Manufacture of hybrid integrated circuit
JPS617069B2 (en) * 1980-07-28 1986-03-04 Victor Company Of Japan

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444663A (en) * 1970-06-13 1979-04-09 Bayer Ag Manufacture of aminophenyllcycloamidine and its salts
JPS498765A (en) * 1972-05-19 1974-01-25
JPS617069B2 (en) * 1980-07-28 1986-03-04 Victor Company Of Japan
JPS581559A (en) * 1981-06-27 1983-01-06 凸版印刷株式会社 Manufacture of uneven floor material
JPS5835957A (en) * 1981-08-28 1983-03-02 Fujitsu Ltd Manufacture of hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240610A (en) * 1994-02-28 1995-09-12 Nec Corp Microstrip line coupler

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