JPS625674U - - Google Patents
Info
- Publication number
- JPS625674U JPS625674U JP9795485U JP9795485U JPS625674U JP S625674 U JPS625674 U JP S625674U JP 9795485 U JP9795485 U JP 9795485U JP 9795485 U JP9795485 U JP 9795485U JP S625674 U JPS625674 U JP S625674U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- substrate
- circuit pattern
- printed circuit
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図はこの考案の一実施例を示す平面図及び
側断面図、第２図は従来の印刷回路配線板を示す
平面図及び側断面図である。
図において、１は基板、２は回路パターン、４
はカーボン皮膜である。図中同一符号は同一或は
相当部分を示す。
FIG. 1 is a plan view and a sectional side view showing an embodiment of this invention, and FIG. 2 is a plan view and a sectional side view showing a conventional printed circuit wiring board. In the figure, 1 is a board, 2 is a circuit pattern, and 4 is a circuit pattern.
is a carbon film. The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
印刷形成した印刷回路配線板において、上記基板
と回路パターン間にこの回路パターン幅より大き
い幅のカーボン皮膜を形成したことを特徴とする
印刷回路配線板。 (2) 上記基板は紙フエノール積層板である実用
新案登録請求の範囲第１項記載の印刷回路配線板
。[Claims for Utility Model Registration] (1) In a printed circuit wiring board in which a circuit pattern is printed and formed using silver paste on a substrate, a carbon film having a width larger than the width of the circuit pattern is formed between the substrate and the circuit pattern. A printed circuit wiring board featuring: (2) The printed circuit wiring board according to claim 1, wherein the substrate is a paper phenol laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9795485U JPS625674U (en) | 1985-06-27 | 1985-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9795485U JPS625674U (en) | 1985-06-27 | 1985-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625674U true JPS625674U (en) | 1987-01-14 |
Family
ID=30965437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9795485U Pending JPS625674U (en) | 1985-06-27 | 1985-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625674U (en) |
-
1985
- 1985-06-27 JP JP9795485U patent/JPS625674U/ja active Pending