JPH03116064U - - Google Patents
Info
- Publication number
- JPH03116064U JPH03116064U JP2566490U JP2566490U JPH03116064U JP H03116064 U JPH03116064 U JP H03116064U JP 2566490 U JP2566490 U JP 2566490U JP 2566490 U JP2566490 U JP 2566490U JP H03116064 U JPH03116064 U JP H03116064U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- copper foil
- semi
- same adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント基板装置を示す一部
省略一部断面平面図、第２図は同第１図のＡ−Ａ
線矢視断面図、第３図は従来例を示す一部省略断
面図である。
１……プリント基板、２……接着剤、３……保
護シート、１１……銅箔回路。
Fig. 1 is a partially omitted partially sectional plan view showing a printed circuit board device of the present invention, and Fig. 2 is an A-A in Fig. 1.
A sectional view taken along the line, and FIG. 3 is a partially omitted sectional view showing a conventional example. 1... Printed circuit board, 2... Adhesive, 3... Protective sheet, 11... Copper foil circuit.
Claims (1)
プリント基板と、前記それぞれの銅箔回路の間に
介在する複数の半硬化状態の接着剤と、前記半硬
化状態を維持するために同接着剤の上部を覆う保
護シートとから成り、同接着剤を印刷により塗布
形成して成るプリント基板装置。 A printed circuit board having a plurality of copper foil circuits on at least one surface, a plurality of semi-cured adhesives interposed between the respective copper foil circuits, and the same adhesive for maintaining the semi-cured state. A printed circuit board device consisting of a protective sheet covering the top of the board, and formed by applying the same adhesive by printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2566490U JPH03116064U (en) | 1990-03-14 | 1990-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2566490U JPH03116064U (en) | 1990-03-14 | 1990-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116064U true JPH03116064U (en) | 1991-12-02 |
Family
ID=31528586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2566490U Pending JPH03116064U (en) | 1990-03-14 | 1990-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116064U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100986314B1 (en) * | 2008-06-25 | 2010-10-08 | 주식회사 골든구스 | Mattress using hemp fiber |
-
1990
- 1990-03-14 JP JP2566490U patent/JPH03116064U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100986314B1 (en) * | 2008-06-25 | 2010-10-08 | 주식회사 골든구스 | Mattress using hemp fiber |
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