JPS61196573U - - Google Patents
Info
- Publication number
- JPS61196573U JPS61196573U JP8008885U JP8008885U JPS61196573U JP S61196573 U JPS61196573 U JP S61196573U JP 8008885 U JP8008885 U JP 8008885U JP 8008885 U JP8008885 U JP 8008885U JP S61196573 U JPS61196573 U JP S61196573U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- adhesive
- release paper
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の構成を示す図、第
２図は実施例の作用を説明する図、第３図は本考
案の他の実施例の構成を示す図である。
１…副印刷配線板、２…ジヤンバー配線、３…
ランド、４…粘着剤、５，６…剥離紙。
FIG. 1 is a diagram showing the configuration of one embodiment of the present invention, FIG. 2 is a diagram illustrating the operation of the embodiment, and FIG. 3 is a diagram showing the configuration of another embodiment of the present invention. 1... Sub-printed wiring board, 2... Jambar wiring, 3...
Land, 4... Adhesive, 5, 6... Release paper.
Claims (1)
パターンの所要箇所を電気的に接続する第２の配
線パターンが形成された第２の印刷配線板におい
て、前記第２の印刷配線板を前記第１の印刷配線
板に接着するために前記第２の印刷配線板の表面
に貼付された粘着剤と、前記第２の印刷配線板よ
り外形形状が大きく、前記粘着剤を保護するため
にこの粘着剤の上に設けられた剥離紙とを具備し
たことを特徴とする印刷配線板。 (2) １枚の剥離紙の上に、前記粘着剤が貼付さ
れた前記第２の印刷配線板を複数枚設けたことを
特徴とする実用新案登録請求の範囲第１項記載の
印刷配線板。[Claims for Utility Model Registration] (1) A second printed wiring board on which a second wiring pattern is formed that electrically connects required parts of the first wiring pattern formed on the first printed wiring board. , an adhesive applied to the surface of the second printed wiring board for adhering the second printed wiring board to the first printed wiring board, and an outer shape that is smaller than the second printed wiring board. 1. A printed wiring board characterized in that the printed wiring board further comprises a release paper provided on the adhesive to protect the adhesive. (2) The printed wiring board according to claim 1 of the utility model registration claim, characterized in that a plurality of the second printed wiring boards to which the adhesive is attached are provided on one sheet of release paper. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8008885U JPS61196573U (en) | 1985-05-30 | 1985-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8008885U JPS61196573U (en) | 1985-05-30 | 1985-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196573U true JPS61196573U (en) | 1986-12-08 |
Family
ID=30625609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8008885U Pending JPS61196573U (en) | 1985-05-30 | 1985-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196573U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159658A (en) * | 2006-12-21 | 2008-07-10 | Sumitomo Bakelite Co Ltd | Circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5789659A (en) * | 1980-09-22 | 1982-06-04 | Roi Emu Mofuitsuto Co Za | Leather washing machine |
| JPS57125797A (en) * | 1981-01-30 | 1982-08-05 | Keiichirou Namiuchi | Method of washing thick bedquilt |
-
1985
- 1985-05-30 JP JP8008885U patent/JPS61196573U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5789659A (en) * | 1980-09-22 | 1982-06-04 | Roi Emu Mofuitsuto Co Za | Leather washing machine |
| JPS57125797A (en) * | 1981-01-30 | 1982-08-05 | Keiichirou Namiuchi | Method of washing thick bedquilt |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159658A (en) * | 2006-12-21 | 2008-07-10 | Sumitomo Bakelite Co Ltd | Circuit board |