JPH038462U - - Google Patents

Info

Publication number
JPH038462U
JPH038462U JP6736789U JP6736789U JPH038462U JP H038462 U JPH038462 U JP H038462U JP 6736789 U JP6736789 U JP 6736789U JP 6736789 U JP6736789 U JP 6736789U JP H038462 U JPH038462 U JP H038462U
Authority
JP
Japan
Prior art keywords
lands
adhesive
electronic components
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6736789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6736789U priority Critical patent/JPH038462U/ja
Publication of JPH038462U publication Critical patent/JPH038462U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のプリント配線板の一実施例を
示す平面図、第2図は第1図の前面図、第3図は
本考案のプリント配線板の他の実施例の要部を示
す図、第4図は本考案のプリント配線板の作用を
示す平面図である。 1……プリント配線板、2A,2B……記号、
3A,3B,3C,3D……ランド、6……接着
剤。
FIG. 1 is a plan view showing one embodiment of the printed wiring board of the present invention, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a main part of another embodiment of the printed wiring board of the present invention. 4 are plan views showing the function of the printed wiring board of the present invention. 1...Printed wiring board, 2A, 2B...Symbol,
3A, 3B, 3C, 3D...land, 6...adhesive.

Claims (1)

【実用新案登録請求の範囲】 電子部品がはんだ付される複数のランドとこの
ランドに接続されたパターンが印刷され、前記複
数のランドの間に前記電子部品を仮止めする接着
剤が塗布されたプリント配線板において、 前記基板の前記接着剤塗布面に輪郭部とその中
心を示す記号を設けたことを特徴とするプリント
配線板。
[Claims for Utility Model Registration] A plurality of lands to which electronic components are soldered and patterns connected to these lands are printed, and an adhesive for temporarily fixing the electronic components is applied between the plurality of lands. 1. A printed wiring board, characterized in that a symbol indicating an outline and a center thereof is provided on the adhesive-coated surface of the board.
JP6736789U 1989-06-12 1989-06-12 Pending JPH038462U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6736789U JPH038462U (en) 1989-06-12 1989-06-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6736789U JPH038462U (en) 1989-06-12 1989-06-12

Publications (1)

Publication Number Publication Date
JPH038462U true JPH038462U (en) 1991-01-28

Family

ID=31600878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6736789U Pending JPH038462U (en) 1989-06-12 1989-06-12

Country Status (1)

Country Link
JP (1) JPH038462U (en)

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