JPH0173965U - - Google Patents

Info

Publication number
JPH0173965U
JPH0173965U JP1987168368U JP16836887U JPH0173965U JP H0173965 U JPH0173965 U JP H0173965U JP 1987168368 U JP1987168368 U JP 1987168368U JP 16836887 U JP16836887 U JP 16836887U JP H0173965 U JPH0173965 U JP H0173965U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
attachment
printed
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987168368U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987168368U priority Critical patent/JPH0173965U/ja
Publication of JPH0173965U publication Critical patent/JPH0173965U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例による連結される
プリント基板が置かれた状態を示す平面図、第2
図〜第4図はこの考案の一実施例によるアタツチ
メントを示し、第2図はその平面図、第3図は正
面図、第4図は側面図、第5図〜第9図はこの考
案の一実施例によるアタツチメントによりプリン
ト基板が連結された状態を示し、第5図は連結さ
れた表面の状態を示す平面図、第6図は連結され
た裏面の状態を示す平面図、第7図〜第9図はプ
リント基板の穴部にアタツチメントの突起部が嵌
合された状態を示す平面図、第8図、第9図は同
じくプリント基板の穴部にアタツチメントの突起
部が嵌合された状態を示す断面図である。 図において1は第1のプリント基板、2は第2
のプリント基板、4は穴部、5は基台、6,7は
突起部、8はプリント基板である。なお、図中同
一符号は同一、または相当部分を示す。
FIG. 1 is a plan view showing a state in which printed circuit boards to be connected according to an embodiment of the invention are placed;
4 to 4 show an attachment according to an embodiment of this invention, FIG. 2 is a plan view thereof, FIG. 3 is a front view, FIG. 4 is a side view, and FIGS. 5 to 9 are an attachment of this invention. The printed circuit boards are shown connected by an attachment according to one embodiment, FIG. 5 is a plan view showing the connected front surface, FIG. 6 is a plan view showing the connected back surface, and FIGS. Figure 9 is a plan view showing the state in which the protrusion of the attachment is fitted into the hole of the printed circuit board, and Figures 8 and 9 are the state in which the protrusion of the attachment is fitted into the hole of the printed circuit board. FIG. In the figure, 1 is the first printed circuit board, 2 is the second
4 is a hole, 5 is a base, 6 and 7 are protrusions, and 8 is a printed circuit board. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】 (1) 平板面にプリント配線された第1のプリン
ト基板と、同じく平板面にプリント配線された第
2のプリント基板と、上記第1のプリント基板と
第2のプリント基板とを連結するアタツチメント
とを備え、上記アタツチメントによつて上記第1
のプリント基板と第2のプリント基板とを平面上
に連結してなることを特徴とするプリント基板。 (2) 第1、第2のプリント基板の端部近傍部に
は複数個の穴部を有し、上記アタツチメントには
上記穴部に嵌合する突起部とを有したことを特徴
とする実用新案登録請求の範囲第1項記載のプリ
ント基板。 (3) アタツチメントには上記第1、第2のプリ
ント基板相互の位置ずれ防止用の突起部を有した
ことを特徴とする実用新案登録請求の範囲第1項
または第2項記載のプリント基板。 (4) アタツチメントは熱可塑性樹脂材より形成
されていることを特徴とする実用新案登録請求の
範囲第1項ないし第3項のいずれかに記載のプリ
ント基板。
[Claims for Utility Model Registration] (1) A first printed circuit board printed on a flat surface, a second printed circuit board also printed on a flat surface, and the first printed circuit board and the second printed circuit board. an attachment that connects the printed circuit board, and the attachment connects the first
1. A printed circuit board comprising a printed circuit board and a second printed circuit board connected on a plane. (2) Practical use characterized in that the first and second printed circuit boards have a plurality of holes near their ends, and the attachment has a protrusion that fits into the holes. A printed circuit board according to claim 1 of patent registration. (3) The printed circuit board according to claim 1 or 2, wherein the attachment has a protrusion for preventing displacement of the first and second printed circuit boards. (4) The printed circuit board according to any one of claims 1 to 3, wherein the attachment is made of a thermoplastic resin material.
JP1987168368U 1987-11-02 1987-11-02 Pending JPH0173965U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987168368U JPH0173965U (en) 1987-11-02 1987-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987168368U JPH0173965U (en) 1987-11-02 1987-11-02

Publications (1)

Publication Number Publication Date
JPH0173965U true JPH0173965U (en) 1989-05-18

Family

ID=31457488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987168368U Pending JPH0173965U (en) 1987-11-02 1987-11-02

Country Status (1)

Country Link
JP (1) JPH0173965U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134419A (en) * 2005-11-09 2007-05-31 Nec Access Technica Ltd Board mounting device, its mounting method, board linking member and printed board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134419A (en) * 2005-11-09 2007-05-31 Nec Access Technica Ltd Board mounting device, its mounting method, board linking member and printed board
JP4642637B2 (en) * 2005-11-09 2011-03-02 Necアクセステクニカ株式会社 Board mounting apparatus, mounting method therefor, board connecting member, and printed board

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