JP2007134419A - Board mounting device, its mounting method, board linking member and printed board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board mounting device where mounting of an electronic component of a double-sided printed board can be made efficient. <P>SOLUTION: A face A of one printed board 2 and a face B of the other printed board 1 are connected by a board linking member 31. Electronic components on the face A and the face B of the printed boards are simultaneously mounted by one line. An engagement material (wedge) to the board is used as the board linking material 31. Linking precision is improved and repetitive use of the engagement member is realized. Thus, printing dislocation can be prevented when cream-like solder is printed on the printed boards. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board mounting apparatus, a mounting method thereof, a board connecting member, and a printed board, and more particularly to a board mounting apparatus for mounting an electronic component on a double-sided printed board, a mounting method thereof, a board connecting member, and a printed board.

  This type of board mounting is called SMT (surface mount technology), (1) a pattern position recognition process for recognizing the position of a pattern on the surface of a printed circuit board, and (2) the position of the recognized pattern. And (3) a component placement step of placing a predetermined electronic component on the wiring terminal printed with the cream-like solder, and (4) ) It includes a component fixing step in which the entire printed circuit board is heated to a high temperature (for example, 260 ° C.) to melt the solder and fix the electronic component. In the case of a double-sided printed circuit board, the same processing is performed on the back surface. ing.

  That is, a predetermined number of printed circuit boards are recognized, printed, placed, and fixed in line 1 and then the printed circuit boards are turned over, and the same processing is performed in line 2. As described above, the mounting of the double-sided printed circuit board requires recognition, printing, placement, and fixing processing for the number of printed circuit boards, and two lines are required for processing the front and back separately. Of course, it is possible to repeat the process twice in one line, but in short, two processes are required.

  On the other hand, in order to improve the efficiency of these processes, two printed circuit boards are connected, the electronic components are mounted as two units, and a plate and a pin for stopping the plate are used as connecting members. It is disclosed. Moreover, using a tape instead of a plate is also disclosed (see Patent Document 1).

Japanese Patent Laid-Open No. 10-022699 (see paragraphs 0010, 0014, 0016, FIG. 1 and FIG. 2)

  According to the invention described in the above-mentioned document 1, it is possible to process two printed circuit boards at a time, thereby reducing the processing time by half.

  On the other hand, the document 1 describes that two printed circuit boards are connected with a tape. However, when connected with a tape, the mounting position of the circuit board is shifted due to the extension of the tape, which is caused by the processing of the circuit board. There is a drawback that the process is disturbed.

  For example, in the past, for the tape fixing of a printed circuit board, first, after positioning two printed circuit boards on a jig, a tape is applied between the printed circuit boards, and then the printed circuit board is lifted to lift the printed circuit board. Removed from the jig. As described above, since the tape application portion of the printed circuit board is lifted, the tape is stretched when it is lifted. For this reason, there is a drawback in that the positional relationship between the two printed boards is out of order, and the initially assumed printed board positioning accuracy cannot be obtained.

  In the conventional pattern position recognition process when processing two printed circuit boards, the pattern position is recognized and measured by the first printed circuit board, and the pattern position of the second printed circuit board is estimated from the result. . For this reason, if the pattern position of the second printed circuit board deviates from the initially assumed position, there is a disadvantage in that the position of the printed circuit board is deteriorated in the subsequent processes of solder printing and component placement. .

  On the other hand, the document 1 describes that a printed board is connected with a plate and a pin. According to this method, it is possible to prevent a tape-like stretch, but as a connecting member, one plate and a pin are connected. Four pieces are required, and a step of attaching pins to the plate and a step of attaching the plate to the printed circuit board are required, which disadvantageously increases the number of parts, the cost, and the number of steps.

  Moreover, since the improvement of the positioning accuracy of the printed circuit board is not mentioned as the object of the invention described in the above-mentioned document 1, it is unclear whether the positioning accuracy of the printed circuit board can be improved by the plate and the pin.

  Further, in the invention described in the above-mentioned document 1, as described above, the processing time can be reduced by half by processing two printed boards, but two lines or two lines are required for mounting a double-sided printed board. The disadvantage that iterative processing is required has not been solved. Further, when the repeated process is performed twice for one line, there is a disadvantage that a process for switching the line setting between the back side and the front side of the substrate is further required.

  Accordingly, an object of the present invention is to provide a board mounting apparatus, a mounting method thereof, and a board connection capable of improving the positioning accuracy of the printed board, increasing the efficiency of the board mounting process, and reducing the number of parts, the cost, and the number of processes. It is to provide a member and a printed circuit board.

  In order to solve the above-described problems, a board mounting apparatus according to the present invention is a board mounting apparatus for mounting electronic components on a printed board, and includes a board end surface of one printed board and the other printed board. It includes a wedge connecting the substrate end surface of the substrate.

  Further, another board mounting apparatus according to the present invention is a board mounting apparatus for mounting electronic components on a double-sided printed circuit board, wherein the printed circuit board end face of one of the two double-sided printed circuit boards and the other printed circuit board. The substrate end surfaces are connected so that different surfaces face each other.

  The board mounting method according to the present invention is a board mounting method for mounting an electronic component on a printed board, and includes a board end face of one printed board and a board end face of the other printed board. Are connected with a wedge.

  Further, another board mounting method according to the present invention is a board mounting method for mounting electronic components on a double-sided printed circuit board, wherein the printed circuit board end face of one of the two double-sided printed circuit boards and the other printed circuit board The substrate end surfaces are connected so that different surfaces face each other.

  The board connecting member according to the present invention is a board connecting member used in a board mounting apparatus for mounting an electronic component on a printed board, and the board end face of one of the two printed boards and the other of the printed boards. It is characterized by comprising a wedge connecting the end face of the printed circuit board.

  Another board connecting member according to the present invention is a board connecting member used in a board mounting apparatus for mounting an electronic component on a double-sided printed board, and is a board end face of one of the two double-sided printed boards. And the other end face of the printed circuit board are connected so that different surfaces face each other.

  The printed circuit board according to the present invention is a printed circuit board used in a substrate mounting apparatus for mounting an electronic component on the printed circuit board, and includes a substrate end surface of one printed circuit board and the other printed circuit board. The substrate end face is connected with a wedge.

  Further, another printed circuit board according to the present invention is a printed circuit board used in a substrate mounting apparatus for mounting electronic components on a double-sided printed circuit board, and a substrate end surface of one of the two double-sided printed circuit boards, The other printed circuit board is connected to the substrate end surface so that different surfaces face each other.

  Further, the board connecting member mounting jig according to the present invention is a board connecting member mounting jig used in a board mounting apparatus for mounting electronic components on a printed board, and a board positioning means for positioning two printed boards, Connecting member positioning means for positioning a connecting member for connecting both printed circuit boards, and after positioning the printed circuit board by the substrate positioning means, the connecting member is fitted at a position set by the connecting member positioning means. The printed circuit boards are connected.

  The board connecting member removing jig according to the present invention is a board connecting member removing jig used in a board mounting apparatus for mounting an electronic component on a printed board, and presses the connecting member for connecting two printed boards. It includes a pressing means for removing from the printed circuit board.

  According to the present invention, one substrate end surface of the two printed circuit boards and the other substrate end surface are connected by the wedge. In addition, one of the two double-sided printed boards and the other board end face are connected so that the different surfaces face each other, and processing of both sides of the printed board is simultaneously performed in one line.

  According to the present invention, of the two printed boards, the substrate end surface of one printed circuit board and the substrate end surface of the other printed circuit board are connected by a wedge, so that the printed circuit board is removed from the jig when connected by tape. It is possible to prevent the “elongation” of the tape that occurs at this time, thereby improving the positioning accuracy of the printed circuit board. Further, since the connecting member is not a sticking member such as a tape, it can be used repeatedly.

  Also, of the two double-sided printed boards, the board end face of one printed board and the board end face of the other printed board are connected so that different faces are on top, and both sides of the printed board are combined in one line. Therefore, the efficiency of the substrate mounting process can be increased.

  In addition, the wedge of the present invention has a shape that can be integrally molded, and can be produced in large quantities with high accuracy by continuous punching of sheet metal, etc. Compared to a connecting member composed of four pins, it is possible to reduce the number of parts, the cost, and the number of processes.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a configuration diagram of an example of a printed board used in a board mounting apparatus according to the present invention. Referring to the figure, an example of an integrally formed printed circuit board (commonly referred to as “split circuit board”) that can be separated into a printed circuit board 151 and a printed circuit board 152 with the bent portion 153 as a boundary is displayed.

  As an example, the bent portion 153 is provided with a so-called “perforation” at the boundary between the printed boards 151 and 152, and the printed boards 151 and 152 can be bent and separated with the bent portion 153 as a boundary.

  It is assumed that the printed circuit boards 151 and 152 have the same wiring pattern and electronic components to be mounted. Therefore, according to the present invention, mounting electronic components on the two printed boards 151 and 152 can be completed in one line by mounting electronic parts in a state where the printed boards 151 and 152 are connected. This makes it possible to increase the efficiency of the substrate mounting process.

  Further, for example, based on a position recognition pattern (which will be described later) provided on the conventional printed circuit board 151, the pattern position of the printed circuit board 152 connected to the printed circuit board 151 by tape is estimated by calculation. In the present invention, since the integrally formed printed circuit boards 151 and 152 are used, no relative displacement occurs between the printed circuit boards 151 and 152. Therefore, the positioning accuracy of the printed circuit board 152 with respect to the printed circuit board 151 can be improved as compared with the conventional technique.

  Further, the printed circuit boards 151 and 152 are constituted by double-sided printed circuit boards, the A surfaces thereof are the same pattern, the B surfaces on the back surface thereof are also the same pattern, the electronic components to be mounted are also the same, and the A surface of the printed circuit board 151 And the B surface of the printed circuit board 152 are integrally formed, it is possible to simultaneously process both surfaces of the printed circuit board in one line, thereby further increasing the efficiency of the substrate mounting process. It becomes possible.

  FIG. 2 is a configuration diagram of an example of a double-sided mounting printed board used in the board mounting apparatus according to the present invention. Referring to the figure, printed circuit boards 1 and 2 are displayed. The printed boards 1 and 2 are printed boards having the same shape and the same pattern, and are arranged with the substrate end faces 11 and 21 of the printed boards 1 and 2 facing each other.

  Opposed keyhole-shaped notches 12 and 22 and notches 13 and 23 are formed on the substrate end faces 11 and 21 of the printed boards 1 and 2, respectively.

  Note that it is possible to arbitrarily set which side of the printed circuit boards 1 and 2 is the A side or the B side.

  FIG. 3 is a configuration diagram of another example of the double-sided mounting printed board used in the board mounting apparatus according to the present invention. Referring to the figure, the printed boards 1 and 2 are different from the printed boards 1 and 2 shown in FIG. 2 in that the printed board 1 is set in advance so that the B side is up and the printed board 2 is up in the A side. The other points are the same as in FIG. Therefore, the same components as those in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted.

  Referring to the figure, the B surface is the back surface of the A surface. A virtual rotating shaft 20 is provided between the substrate end faces 11 and 21 of the printed boards 1 and 2. That is, the printed circuit board 1 (surface B) is obtained by rotating the printed circuit board 2 (surface A) 180 degrees to the left about the virtual rotation axis 20.

  FIG. 4 is a plan view showing details of an example of the notch. 2 and 3 is shown as an example in the figure, but the notch 23 is also the same, and the notches 12 and 13 are virtually the notches 22 and 23. The rotation axis 20 is rotated 180 degrees to the left, and the shape and dimensions are the same as those of the notches 22 and 23.

  Referring to FIG. 4, the cutout portion 22 includes a circular cutout portion 22 a and a straight cutout portion 22 b and has a keyhole shape. The circular notch 22a has a diameter of φJ, and the opening length of the straight notch 22b is K.

  FIG. 5 is a plan view of an example of the board connecting member according to the present invention. Referring to the figure, the board connecting member is constituted by a wedge 31 as an example. The wedge 31 has an eyeglass shape and has through holes 32 and 33 at both ends. Further, the outer periphery 34 on the through hole 32 side is formed in an octagon as an example, and has protrusions 34a to 34g. Similarly, the outer periphery 35 on the through-hole 33 side is also formed in an octagon and has protrusions 35a to 35g. These both end portions are integrally formed through a central portion 36. In addition, another protrusion (not shown) 34h on the outer periphery 34 on the through hole 32 side is absorbed by the central portion 36. Similarly, another protrusion (35h not shown) on the outer periphery 35 on the through-hole 33 side is also absorbed by the central portion 36.

  On the other hand, the diameter of the through hole 32 is φC, the length of the diagonal line of the outer periphery 34 is D, the diameter of the through hole 33 is φE, and the length of the diagonal line of the outer periphery 35 is the same as that of the outer periphery 34. The width is F, and the distance between the through holes 32 and 33 is G.

  The length relationship is characterized in that J <D and C> E. More specifically, the diameter J of the circular cutout portion 22a of the cutout portion 22 of the printed circuit board 2 is slightly shorter than the length D of the diagonal lines of the outer circumferences 34 and 35 of the wedge 31.

  That is, J and D are set to such a length that when the right end portion of the wedge 31 is fitted into the circular cutout portion 22a, the tips of the protrusions 35a to 35g of the wedge 31 bite into the circular cutout portion 22a. . The same applies to the left end portion of the wedge 31.

  As an example, the diameter φC of the through hole 32 is 1.5 mm, the diagonal length D of the outer periphery 34 is 3.7 mm, the diameter φE of the through hole 33 is 1.2 mm, and the diagonal length D of the outer periphery 35 is 3.7 mm. The width F of the central portion 36 of the wedge 31 is 2.30 mm, the distance G between the through holes 32 and 33 is G = 5.6 mm, the diameter φJ of the circular cutout portion 22 a is 3.6 mm, and the opening length of the straight cutout portion 22 b K = 2.4 mm.

  It is also a feature of the present invention that the positions of the protrusions 34a to 34g of the wedge 31 and the positions of the protrusions 35a to 35g are not formed symmetrically. This is synchronized with the fact that the diameter of the through hole 32 of the wedge 31 and the diameter of the through hole 33 are not formed identically.

  As will be described later, the printed circuit board 1 is positioned on the left side and the printed circuit board 2 is positioned on the right side, and both are temporarily connected by a wedge 31 to mount electronic components, and then the printed circuit boards 1 and 2 are separated. 1 is turned over and the right side, the new printed circuit board is positioned on the left side, and the wedge 31 is connected again. That is, the printed circuit board 1 is first positioned on the left side and then on the right side.

  That is, when the circular notch 22a of the printed circuit board 1 is observed, when the printed circuit board 1 is positioned on the left side, it comes into contact with the protrusions 34a to 34g on the left side of the wedge 31, but when the printed circuit board 1 is positioned on the right side, The right projections 35a to 35g are brought into contact with each other. Accordingly, if the positions of the protrusions 34a to 34g and the protrusions 35a to 35g of the wedge 31 are symmetrically formed, the protrusion 34a of the wedge 31 is formed on the wall surface of the circular notch 22a of the printed board 1 when the printed board 1 is turned over. ˜34 g and the protrusions 35 a to 35 g are brought into point contact at the same position twice, which may contribute to the so-called “rattle” of the wedge 31. In order to prevent this, the positions of the protrusions 34a to 34g and the protrusions 35a to 35g of the wedge 31 are formed asymmetrical.

  FIG. 6 is a plan view of an example of a state in which a wedge is fitted into a printed circuit board. This figure shows a state in which wedges 31 are fitted into printed boards 1 and 2 and both are connected.

  The left and right outer peripheries 34 and 35 of the wedge 31 are formed in a polygonal shape, and the length D of the diagonal is set slightly longer than the diameter J of the circular notch 22a of the notch 22, so that the wedge 31 is notched. It can be fixed by being fitted into the portion 22.

  On the other hand, since the positions of the protrusions 34a to 34g on the through hole 32 side are different from the positions of the protrusions 35a to 34g on the through hole 33 side, the notches of the printed circuit boards 1 and 2 are formed by fitting the wedge 31 twice. It is possible to prevent the same position on the wall surface of the circular cutout portion 22a of the portion 22 from being damaged.

  Next, the reason why the through holes 32 and the through holes 33 are formed to have different diameters will be described. The wedge 31 is positioned between the printed boards 1 and 2 by passing pins provided in advance on the jig through the through holes 32 and 33 in a state where the printed boards 1 and 2 are positioned on the jig. It is inserted.

  When this is observed with respect to the printed circuit board 1, the printed circuit board 1 is first positioned on the left side, and the left protrusions 34 a to 34 g of the wedge 31 are fitted into the circular notch 22 of the printed circuit board 1. Next, the printed circuit board 1 is rotated 180 degrees and then positioned on the right side, and the right projections 35 a to 35 g of the wedge 31 are fitted into the circular notch 22 of the printed circuit board 1. Here, if the printed circuit board 1 is rotated 180 degrees and then the wedge 31 is mistakenly inserted into the circular notch 22 of the printed circuit board 1 in the opposite direction, the circular notch 22 of the printed circuit board 1 The protrusions 34a to 34g on the left side of the wedge 31 are fitted twice in succession.

  Therefore, in order to prevent the wedge 31 from being fitted in the opposite direction, the diameter of the through hole 32 of the wedge 31 and the diameter of the through hole 33 are different. Of course, the diameters of the pins passing through the through holes 32 and 33 are also made different from each other in accordance with the diameters of the through holes 32 and 33.

  The thickness of the board connecting member (wedge 31) is preferably thinner than the thickness of the printed boards 1 and 2. The reason is to make the solder mask at the time of solder printing easy to adhere to the printed boards 1 and 2.

  The material of the board connecting member (wedge 31) can be made of the same material as the printed board (for example, glass epoxy material), but can be made of other resin or metal. . Moreover, since the board | substrate connection member (wedge 31) of 2nd Example is a shape which can be integrally molded, it is possible to produce in high precision and in large quantities by continuous punching of a sheet metal. Further, the substrate connecting member can be used repeatedly.

  In the second embodiment, as an example of the cutout portions 12, 13, 22, and 23 of the printed board, the contact portion with the protrusion of the board connecting member (wedge 31) is a circular inner wall. However, the contact portion may be a planar inner wall, that is, the cutout portion may be a polygon.

  In the second embodiment, an example in which two printed circuit boards are connected has been described. However, the present invention is not limited to this, and three or more printed boards can be connected. That is, referring to FIG. 2 and FIG. 3, notches 12, 13, 22, and 23 are provided on only one side of the printed circuit boards 1 and 2, but three pieces are provided by providing these on both sides. The above connection is possible.

  In addition, when tape is used for connecting the boards, the board connecting accuracy cannot be improved, but it is possible to improve the efficiency of mounting electronic components on the double-sided printed board.

  In addition, in the case of tape application described in Patent Document 1, as described above, the pattern position is recognized and measured by the first printed board, and the pattern position of the second printed board is estimated from the result. Yes.

  On the other hand, in this invention, the positioning accuracy between two printed circuit boards can be improved by using a board | substrate connection member compared with the case of the conventional tape sticking.

  The reason is that when the tape application part of the two printed circuit boards connected by tape application is lifted and the two printed circuit boards are removed from the jig, the tape is stretched. This is because such elongation does not occur when two printed circuit boards are connected by a connecting member. Moreover, since both ends of the board connecting member are configured to bite into the cutout portions of the printed board, “rattle” does not occur.

  Next, a printed circuit board position recognition pattern will be described. 7 is a plan view of an example of two printed circuit boards provided with an example of a position recognition pattern. FIG. 8 is a plan view of an example of two printed circuit boards provided with another example of a position recognition pattern. is there.

  Referring to FIG. 7, position recognition patterns 141 and 142, which are displayed as black circles as an example, are provided on the left and right of the upper end of the printed circuit board 1, and are displayed as black circles as an example to the right of the lower end of the printed circuit board 1. A position recognition pattern 143 is provided. The position recognition patterns 141 to 143 can be configured by other shapes or colors instead of black circles as long as they can be recognized by the position recognition device. Further, the number of position recognition patterns is not limited to three, and the number is arbitrary.

  When mounting electronic components on the printed circuit boards 1 and 2 on the line, the position of the position recognition patterns 141 to 143 is recognized on the line by using a position recognition device such as a CCD (Charge Coupled Device) to recognize the position. The X axis is created by a line connecting the pattern 141 for position and the pattern 142 for position recognition, and the Y axis is created by a line connecting the pattern for position recognition 142 and the position recognition pattern 143, and the printed circuit board is based on these axes. The solder printing position and electronic component mounting position inside 1 and 2 are obtained, and solder printing, electronic component mounting, etc. are performed in accordance with the position.

  In the present invention, since the printed circuit boards 1 and 2 are connected by the wedge 31 as an example, only the position recognition of the position recognition patterns 141 to 143 on the printed circuit board 1 is performed, and the solder printing position and the electronic The component mounting position can also be detected with higher accuracy than in the past, thereby improving solder printing accuracy and electronic component mounting position accuracy.

  Referring to FIG. 8, a position recognition pattern 144 displayed as a black circle as an example is provided on the left of the upper end of the printed circuit board 1. On the other hand, a position recognition pattern 145 displayed as a black circle is provided on the right of the upper end of the printed circuit board 2 as an example, and a position recognition pattern 146 displayed as a black circle is provided on the right of the lower end.

  This is an example in the case where the position recognition patterns 144 to 146 are provided on both the printed circuit boards 1 and 2. The present invention can improve the position recognition accuracy of the printed circuit board 2 with respect to the printed circuit board 1 as compared with the prior art. As in this embodiment, the position recognition pattern is dispersed on the printed circuit boards 1 and 2 and the distance between the left and right positions of the position recognition pattern (the distance between the position recognition patterns 144 and 145) is further increased, so that the inclination of the X axis is increased. Since the accuracy is improved, it is possible to obtain position recognition with higher accuracy than the position recognition using the position recognition patterns 141 to 143 shown in FIG.

  Further, according to the second embodiment of the present invention, the A surface of one printed circuit board and the B surface of the other printed circuit board are connected by the substrate connecting member, and the A surface and the B surface of the printed circuit board are connected by one line. By simultaneously performing these processes, it is possible to improve the efficiency of mounting electronic components on the double-sided printed circuit board.

  In addition, by using a fitting member as the board connecting member, there is no tape-like elongation, and both ends of the board connecting member are made into a polygonal shape so that the board can be connected to the printed board. Therefore, it is possible to improve the connection accuracy of the printed circuit boards, thereby improving the positioning accuracy between the A-side printed circuit board and the B-side printed circuit board. Further, since the board connecting member is a fitting member, it can be used repeatedly.

  Although the example which provides the notch part 22 in a part of printed circuit board in FIG. 2 was shown, it is not limited to this. FIG. 9 is a partial plan view showing another example of the printed circuit board. Referring to the figure, the cutout portion 22 of the printed circuit board 3 is formed on a second substrate (hereinafter, referred to as “discarded substrate”) 42. The discarded substrate 42 is integrated with the printed circuit board 3 via the support portion 41. The discarded substrate 42 can be bent and separated by the support portion 41, or the discarded substrate 42 can be separated by cutting the support portion 41 of the discarded substrate 42.

  According to the printed board of the third embodiment, it is possible to prevent the discarded board 42 from remaining on the printed board after the board mounting is completed and the board connecting member is removed, thereby reducing the board space. It becomes possible.

  FIG. 10 is a plan view showing another example of the printed circuit board. Referring to the figure, printed boards 4 and 5 are displayed, but both have the same shape. The printed board 4 is placed with the B side and the printed board 5 is placed with the A side up. .

  As an example, the printed circuit board 4 will be described. A pair of board connecting portions 43 are provided integrally with the printed circuit board 4 at both upper ends of the printed circuit board 4, and a pair of notches 22 having a shape that can be fitted to the board connecting portions 43 are provided at both lower ends. Yes. For the sake of convenience, a virtual rotation axis 20 is displayed between the printed circuit boards 4 and 5 and a virtual center point 25 is displayed at the center of the printed circuit board 5 in FIG.

  As shown in the figure, the printed circuit board 4 is placed on the left side so that the B-side is up, the printed circuit board 4 is rotated 180 degrees about the virtual rotation axis (vertical axis) 20, and the virtual center point 25 is further set. If the printed circuit board 4 is rotated by 180 degrees as a center, the printed circuit board 4 is placed on the position of the printed circuit board 5 in FIG. In this way, the board connecting portion 43 of the printed circuit board 4 is fitted with the cutout portion 22 of the printed circuit board 5, and the board connecting portion 43 of the printed circuit board 5 is fitted with the cutout portion 22 of the printed circuit board 4.

  According to the printed board of the fourth embodiment, since the board connecting portion 43 is integrated with the printed board, it is not necessary to separately provide the board connecting portion, and therefore, the board connecting member is fitted into the printed board and is separated from the printed board. The removal process can be deleted.

  As the substrate connecting member, those having both sides octagonal are shown in FIG. 5, but the present invention is not limited to this. Both ends can be composed of polygons of triangles or more.

  Further, although generally referred to as “Ruleau polygons”, it is also possible to adopt these polygons at both ends of the board connecting member. The “Ruleau polygon” means a rice ball type having a rounded side, for example, a polygon having the shape of a rotor of a rotary engine.

  Further, both ends of the substrate connecting member can be configured as a circle or an ellipse, and can also be configured symmetrically (including the shape of the through hole).

  According to the fifth embodiment, a wide range of polygons, circles, or ellipses can be used as the substrate connecting member.

  The sixth embodiment relates to another example of the board connecting member and the printed board. FIG. 11 is a plan view of another example of the board connecting member and the printed board. Referring to the figure, printed circuit boards 6 and 7 are displayed, but both have the same shape. The printed circuit board 6 is placed with the B surface and the printed circuit board 7 is placed with the A surface on top. .

  On the other hand, a triangular wedge 51 is used as a board connecting member for connecting the printed boards 6 and 7. The triangular wedge 51 is formed by integrating one corner of two triangular members so that one corner is absorbed by the other triangle.

  Further, triangular cutout portions 61 to 64 for fitting the triangular wedges 51 are formed on the printed circuit boards 6 and 7. The triangular notches 61 to 64 are configured to have dimensions that hardly cause “rattle” when the triangular wedge 51 is fitted.

  According to the sixth embodiment, the triangular wedge 51 and the triangular cutout portions 61 to 64 are obliquely cut out as compared with the wedge 31 (see FIG. 5) and the cutout portion 22 (see FIG. 4) of the second embodiment. The connection is strong.

  The seventh embodiment relates to another example of the board connecting member and the printed board. 12-15 is explanatory drawing which shows an example of the procedure which inserts a board | substrate connection member in a printed circuit board.

  FIG. 12 shows a wedge 52 as another example of the board connecting member. The polygonal shape of the wedge 52 and the shape of the through hole are the same as those of the second embodiment (see FIG. 5), but a notch (V cut) 53 for bending and cutting the wedge 52 at its center is formed. And the point that the surface of the wedge 52 can be soldered is different from the second embodiment.

  On the other hand, the printed circuit board, for example, the right-side A-side printed circuit board 8 is provided with a notch 22 similar to that in the second embodiment (see FIG. 4). The printed circuit board 8 surrounds the notch 22. The point from which the collar part 81 is provided differs from 2nd Example. Further, the surface of the flange 81 is also formed so as to be solderable in the same manner as the wedge 52. Although not shown, the left side B-side printed circuit board is also formed with a notch 22 and a flange 81 similar to those on the A-side.

  FIG. 13 shows a state in which the wedge 52 is fitted into the notches 22 and 12 of the A-side printed board 8 and the B-side printed board 9.

  FIG. 14 shows a state in which the wedge 52 is fitted into the notches 22 and 12 of the A-side printed board 8 and the B-side printed board 9, and then the flange 81 of the printed board 8 and the right half 52a of the wedge 52 are soldered 82. Is shown.

  FIG. 15 shows a state in which after the soldering 82, the wedge 52 is bent and cut at the notch 53, and the left half 52 b of the wedge 52 is removed from the printed circuit board 9.

  The wedge 52 is made of a solderable metal.

  According to the seventh embodiment, there is an effect that it is not necessary to remove the wedge 52a from the printed circuit board 8 when the printed circuit board 8 and the printed circuit board 9 are separated. Further, since the cutout portion 22 of the printed board 8 is closed by the wedge 52a, it can be handled in the same manner as a printed board without the cutout portion 22. On the other hand, the wedge 52b of the printed circuit board 9 is extracted. This is to prepare for the next mounting of the electronic component on the A side.

  The eighth embodiment relates to a printed circuit board mounting method. First, an outline of an example of a printed circuit board mounting method according to the present invention will be described. FIG. 16 is a diagram showing an outline of an example of a printed circuit board mounting method according to the present invention.

  Referring to the figure, first, a predetermined number (for example, 50) of printed circuit boards 2 on which electronic components have been mounted only on the B surface are prepared (step S21).

  Next, a new printed circuit board 1 on which both sides are not mounted with electronic components is placed with the B surface facing upward, and the printed circuit board 2 on which the mounting of the electronic components is completed only on the aforementioned B surface on the right side. One sheet is placed with the A side up, and the printed boards 1 and 2 are connected by the wedge 31 (step S22).

  The set of two printed circuit boards 1 and 2 is sequentially put into a conveyance line, and electronic components only on one side are mounted.

  When the mounting of the electronic components is completed, the mounting of the electronic components on both sides of the printed circuit board 2 is completed. Therefore, the printed circuit board 2 is lowered from the conveying line, the wedge 31 is removed, and the printed circuit board 1 is separated (step S23).

  After the printed circuit board 1 and the printed circuit board 2 are separated from each other, the inspection of the mounting of the electronic components on the printed circuit board 2 where the mounting of the electronic components is completed on both sides is performed. The inspection can be performed while the following process of step S24 is being performed.

  Next, one printed circuit board 1 on which mounting of electronic components on the B surface is completed is turned over and placed with the A surface facing up, and on the left side of the printed circuit board 15 on which both electronic components are not mounted. The sheets are placed with the B-side facing up, the substrates 1 and 15 are connected by the wedge 31, and are reintroduced into the transport line (step S24). Thereafter, steps S22, S23, and S24 are repeated a predetermined number of times (49 more in this embodiment).

  In this way, by mounting the electronic components by connecting the A and B surfaces of the printed boards 1 and 2, it becomes possible to mount the electronic components on the A and B surfaces with a single line conveyance. This makes it possible to increase the efficiency of the substrate mounting process.

  In this embodiment, the case where the electronic components are mounted on the printed board in units of 50 sets is described. However, the inspection of the printed board is waited until the mounting of the electronic parts on the 20 sets of printed boards is completed as an example. When 20 sets are completed, the 20 sets of printed circuit boards can be inspected collectively. As a result, the 20 sets of printed circuit boards can be inspected while the electronic components of the remaining 30 sets of printed circuit boards are mounted, and it is not necessary to separately secure the inspection time. As a whole, it is possible to reduce the time required for mounting the electronic component on the printed circuit board.

  Next, a specific example of a printed board mounting method will be described. 17 to 24 are schematic views showing an example of a printed circuit board mounting method according to the present invention, and FIGS. 25 to 26 are flowcharts showing an example of the mounting method. As an example, the case where 50 sets of electronic components are mounted will be described. However, the number of sets as a unit is not limited to this, and an arbitrary number of sets can be set.

  First, a predetermined number (50 as an example) of printed boards on which electronic components have been mounted on only the B surface is prepared (step S1 in FIG. 25).

  Turn each printed circuit board upside down and place it on the right side of the tray 91 with the A side up (this is called the printed circuit board 2), and place a new printed circuit board on the left side of the tray 91 with the B side up (print this) The substrate connecting member (wedge 31) is fitted between the printed circuit boards (step S2 in FIG. 25 and FIG. 17). A predetermined number of sets (50 sets in this embodiment) are created.

  In FIG. 17, the tray 91 has a size slightly larger than that of the printed circuit boards 1 and 2 arranged. However, the size is not limited to this, and the size is arbitrary. In the following processes, as an example, the size of the tray 91 is slightly smaller than that in which the printed boards 1 and 2 are arranged.

  Next, 50 sets of printed boards 1 and 2 are stored in the tray magazine 92 in a state of being placed on the tray 91 (step S3 in FIG. 25 and FIG. 18).

  Here, the structure of the tray magazine 92 will be briefly described. FIG. 18 is a longitudinal sectional view of an example of the tray magazine 92. As shown in the figure, the tray magazine 92 is configured such that printed boards 1 and 2 connected by a wedge 31 are stacked while being placed on the tray 91. Specifically, the tray magazine 92 is provided with rail step grooves 95 at both inner ends, and the connected printed boards 1 and 2 are inserted into the rail step grooves 95 together with the tray 91.

  The rail corrugated groove 95 is formed on a so-called “caterpillar” -shaped conveyor, and when the “caterpillar” rotates, the connected printed circuit boards 1 and 2 inserted into the rail corrugated groove 95 are sequentially moved from top to bottom. It is conveyed to.

  In the tray magazine 92, the lowermost connected printed boards 1 and 2 are separated from the tray 91 and are sequentially placed on the transport line 93 (step S4 in FIG. 25 and FIG. 19). The tray 91 separated from the printed boards 1 and 2 is also removed from the tray magazine 92.

  Next, the position of the position recognition patterns 141 to 146 on the printed circuit boards 1 and 2 is recognized using a position recognition device such as a CCD (Charge Coupled Device) in the transport line 93, and the printed circuit board solder is printed based on the positions. The positions of the printed part and the electronic component mounting part are calculated (step S5 in FIG. 25).

  In the present invention, as described above, since the connecting position accuracy of the printed boards 1 and 2 is improved, the solder printed portion of the printed board and It is possible to calculate the position of the electronic component mounting portion or the like.

  Next, cream-like solder 101 is sequentially printed on the solder print portions of the connected printed boards 1 and 2 on the transport line 93 (step S6 in FIG. 25 and FIG. 20).

  Next, the pins 102a, 102b, 103a, 103b, 104a, and 104b of the electronic components (for example, the electronic components 102 to 104) are sequentially placed on the cream-like solder 101 of the solder printed portions of the connected printed boards 1 and 2. (Step S7 in FIG. 26 and FIG. 21).

  Next, the connected printed boards 1 and 2 are heated to a high temperature (for example, 260 ° C.) to melt the solder (this process is referred to as “reflow”), and the electronic components 102 to 104 are placed on the printed boards 1 and 2. (Step S8 in FIG. 26 and FIG. 22).

  Next, while removing the set of printed circuit boards to which the electronic components 102 to 104 are fixed from the line, it is monitored whether or not the mounting process of the printed circuit boards 1 and 2 has been completed (for example, 20 sets) (FIG. 26). Step S9), if the predetermined set (20 sets as an example) has not ended, the monitoring is continued as it is (in the case of “N” in step S9 in FIG. 26), and the predetermined set (20 sets as an example) ends. Advances to the next step (in the case of “Y” in step S9 in FIG. 26).

  Next, the board connecting members (wedges 31) are removed from the predetermined set (20 sets as an example) of the connected printed boards 1 and 2, and the printed boards 1 and 2 are separated (step S10 in FIG. 26 and FIG. 23).

  Subsequently, the mounting process of the electronic components of the remaining 30 sets of printed boards 1 and 2 is performed in the same manner as the 20 sets of printed boards 1 and 2 described above. During this time, the printed circuit board 2 that has been mounted on both sides of the 20 printed circuit boards 1 and 2 is inspected (step S11 in FIG. 26).

  Next, the printed board 1 that has been placed on the left side is turned upside down and placed on the right side of the tray 91 with the A side up, and the new printed board 10 is placed on the left side with the B side up. The board connecting member (wedge 31) is fitted between the printed boards (step S12 in FIG. 26 and FIG. 24). A predetermined number (20 sets in the present embodiment) is created.

  Next, 20 new sets of printed circuit boards 10 and 1 are placed on the tray 91 and stored in the tray magazine 92 (step S13 in FIG. 25 and FIG. 18).

  Thereafter, the processes of steps S4 to S12 and S13 are repeated for each set of printed circuit boards.

  Through the above procedure, mounting of electronic components on the printed circuit board is continuously performed.

  In the present embodiment, 50 sets of printed circuit boards are first created, put into a tray magazine, and when mounting of 20 sets of 50 electronic components is completed, the printed circuit board is separated, and only one side of the electronic components is mounted. 20 printed boards that have not been mounted are connected to 20 printed boards that are not mounted with electronic components on both sides, 20 sets of connected boards are created, and these are stored in a tray magazine. .

  It is to be noted that the introduction of 50 sets of printed circuit boards at the beginning and the separation of the printed circuit boards after the completion of the mounting of 20 sets of electronic components are examples, and the present invention is limited to the number of these sets. It is not something. In the present invention, the number of sets can be arbitrarily set.

  The tray magazine 92 is always rotating, and it is ideal that one set of 50 printed boards is put into the tray magazine 92 every time one set is put into the transport line 93. It is. In this way, a set of printed circuit boards is continuously arranged at equal intervals on the transport line 93, and electronic components can be efficiently mounted on the printed circuit board.

  In the eighth embodiment, after the reflow of one side of the connected printed boards 1 and 2 is completed, the printed boards 1 and 2 are once separated (see step S10 in FIG. 26), and the opposite side is processed separately ( After the reflow of one side is completed, the printed circuit boards 1 and 2 are not cut off, but are turned over as they are and the same processing (from step S13 in FIG. 25 to step S12 in FIG. 26) is performed again. It is also possible to do this.

  However, in the latter case, the printed boards 1 and 2 are continuously reflowed twice, and the electronic components mounted on the printed boards 1 and 2 are exposed to a high temperature twice, which is not preferable.

  On the other hand, in the present invention, after the reflow of one side of a set of printed circuit boards is completed, the printed circuit board is cut off and the reflow of the opposite surface is performed individually. It is possible to prevent exposure.

  According to the eighth embodiment, since the electronic parts are mounted by connecting the A surface and the B surface of the printed circuit board, the electronic components on the A surface and the B surface of the printed circuit board can be mounted simultaneously. It becomes possible. Therefore, the mounting of the electronic components on the printed circuit board can be completed by a one-line process, whereby the efficiency of mounting the electronic components on the double-sided printed circuit board can be increased.

  Moreover, since it is the structure which connects the printed circuit boards 1 and 2 with the board | substrate connection member (wedge 31), elongation like a tape does not arise, Therefore, between the printed circuit boards 1 and 2 like the case of tape sticking There is no positional deviation in solder printing and component placement due to relative deviation. Thereby, it is possible to reduce the positional deviation between the solder printing of the printed circuit board and the component placement as compared with the conventional case.

  There is another advantage of mounting electronic components by connecting the A side and B side of the printed circuit board. For example, consider a printed circuit board having a high wiring density on the A surface and a low wiring density on the B surface. When mounting the same number of electronic components on the A side and the B side of the printed circuit board over the same time over the same time as in the prior art, mounting of the electronic components on the A side having a high wiring density has a low wiring density. It takes time compared to the surface.

  As an example, the mounting time of the electronic component on the A side of one printed circuit board is 30 seconds, and the mounting time of the electronic component on the B surface of one printed circuit board is 20 seconds. Therefore, when mounting 50 printed circuit boards, the total time required for mounting the A side of the printed circuit board is 1500 seconds, which is used as a reference.

  On the other hand, the total time required for mounting the B side of the printed circuit board is 1000 seconds, which is 500 seconds shorter than the mounting of the A side. Therefore, if the mounting of the B side of the printed circuit board is performed over 1500 seconds, a “time for no processing” (500/49 seconds) occurs between the individual printed circuit boards, and the processing efficiency decreases.

  On the other hand, according to the present invention, the A side and the B side of the printed circuit board are connected and the electronic components are mounted simultaneously in one line, so that “no processing time” does not occur. In addition, the mounting time of the A-side electronic component of 30 seconds and the mounting time of the B-side electronic component of 20 seconds are required as before, but the printed circuit board is arranged in units of two on the line. Compared to arranging them one by one, the time required to arrange them can be halved. Similarly, since the position recognition of the printed circuit board is performed in units of two sheets, the time per sheet required for position recognition is halved compared to the conventional position recognition in units of one sheet.

  Furthermore, if a new program that integrates the A-side processing program and the B-side processing program is created, the total mounting time of electronic components on the A-side and B-side (50 seconds in the above example) is reduced. It is also possible to make it.

  The ninth embodiment relates to a substrate connecting member mounting jig. FIG. 27 is a perspective view of an example of an attachment jig for the substrate connecting member. Referring to the figure, the board connecting member mounting jig 110 includes a base 111, a pin base 112 provided on the base 111, pins 113 and 114 provided on the pin base 112, and a base 111. It includes a pin base 115 provided above and below the pin base 112, pins 116 and 117 provided on the pin base 115, and positioning members 131 to 134 of the printed circuit board.

  The mounting positions of the pins 113, 114, 116, and 117 are through holes in the board connecting member (wedge 31) that fits into the notches 12, 22, 13, and 23 of the printed boards 1 and 2 shown in FIGS. Corresponding to positions 32 and 33. Therefore, the diameters of the pins 113 and 116 are different from the diameters of the pins 114 and 117.

  FIG. 28 is a perspective view showing an example in which a board connecting member (wedge 31) is fitted into a printed board using a jig. As shown in the figure, first, the printed boards 1 and 2 are placed on the base 111, and the positions are determined by using the positioning members 131 to 134 (with the printed boards 1 and 2 fitted between the positioning members 131 to 134). Next, the board connecting member (wedge 31) is fitted into the pins 113, 114, 116, 117 on the base 111.

  According to the ninth embodiment, by using the jig 110, it is easy to fit the board connecting member (wedge 31) at a predetermined position between the printed boards 1 and 2.

  The tenth embodiment relates to a substrate connecting member removal jig. FIG. 29 is a longitudinal sectional view of an example of a substrate connecting member removal jig. Referring to the figure, the board connecting member removal jig 120 includes a base 121, a washer 122, a pin 123, a washer 124, a pin 125, and a support member 126. The support member 126 is attached to the surface of the base 121. In addition, the top view of the board | substrate connection member (wedge 31) is also displayed on the figure for convenience.

  Washers 122 and 124 are attached to the back surface of the base 121. The washers 122 and 124 are formed in an annular shape, and their attachment positions correspond to the positions of the polygonal portions at both ends of the wedge 31. Pins 123 and 125 are fitted in openings (not shown) of the washers 122 and 124, respectively. The diameters (outer diameters) of the washers 122 and 124 are set to a length sufficient to press the polygonal portions at both ends of the wedge 31, and the diameters of the pins 123 and 125 are fitted in the through holes 32 and 33 of the wedge 31, respectively. It is set long enough to fit. Accordingly, the pins 123 and 125 have different diameters.

  Now, it is assumed that the wedge 31 is connected between the printed boards 1 and 2. When the positions of the pins 123 and 125 of the removal jig 120 are aligned with the through holes 32 and 33 of the wedge 31 and the removal jig 120 is lowered, the pins 123 and 125 of the removal jig 120 are moved to the through holes 32 and 33 of the wedge 31. Since the washers 122 and 124 of the removal jig 120 press the polygonal portions at both ends of the wedge 31, the wedge 31 is detached from the printed boards 1 and 2. The lowering of the removal jig 120 is performed by lowering the support member 126, but it may be performed by human power or by control of a control unit (not shown) connected to the upper end of the support member 126.

  According to the tenth embodiment, by using the jig 120, it becomes easy to remove the board connecting member (wedge 31) from the printed boards 1 and 2 accurately and easily.

It is a block diagram of an example of the printed circuit board used for the board | substrate mounting apparatus which concerns on this invention. It is a block diagram of an example of the double-sided mounting printed board used for the board | substrate mounting apparatus which concerns on this invention. It is a block diagram of another example of the double-sided mounting printed board used for the board | substrate mounting apparatus based on this invention. It is a top view which shows the detail of an example of a notch part. It is a top view of an example of a substrate connection member concerning the present invention. It is a top view which shows an example of the state which fitted the wedge in the printed circuit board. It is a top view of an example of two printed circuit boards provided with an example of a pattern for position recognition. It is a top view of an example of the two printed circuit boards in which another example of the pattern for position recognition was provided. It is a fragmentary top view which shows another example of a printed circuit board. It is a top view which shows another example of a printed circuit board. It is a top view of other examples of a substrate connection member and a printed circuit board. It is explanatory drawing which shows an example of the procedure which inserts a board | substrate connection member in a printed circuit board. It is explanatory drawing which shows an example of the procedure which inserts a board | substrate connection member in a printed circuit board. It is explanatory drawing which shows an example of the procedure which inserts a board | substrate connection member in a printed circuit board. It is explanatory drawing which shows an example of the procedure which inserts a board | substrate connection member in a printed circuit board. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a schematic diagram which shows an example of the mounting method of the printed circuit board which concerns on this invention. It is a schematic diagram which shows an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a figure which shows the outline | summary of an example of the mounting method of the printed circuit board which concerns on this invention. It is a flowchart which shows an example of the mounting method. It is a flowchart which shows an example of the mounting method. It is a perspective view of an example of the attachment jig | tool of a board | substrate connection member. It is a perspective view which shows an example at the time of inserting the board | substrate connection member (wedge 31) in the printed circuit board using the jig | tool. It is a longitudinal cross-sectional view of an example of the removal jig | tool of a board | substrate connection member.

Explanation of symbols

1-9 Printed circuit board 11, 21 Board end face 12, 13 Notch 22, 23 Notch
31 Wedge 32, 33 Through hole 34, 35 Protrusion
41 Support
42 Waste board
43 Board connector
51 V-shaped wedge 61-64 V-cut notch
52 wedge
53 Notch
81 Buttocks
91 trays
92 Tray Magazine
93 Conveyance line
95 rail corrugation
101 Cream solder 102-104 Electronic components
110 Jig for mounting substrate connecting member
111 base 112, 115 pin base 113, 114 pin 116, 117 pin
120 Jig for removing board connecting member
121 Base 122, 124 Washer 123, 125 pins 151, 152 Printed circuit board
153 Bending part

Claims (91)

A board mounting apparatus for mounting electronic components on a printed circuit board,
A board mounting apparatus comprising a wedge that connects a board end face of one of the two printed boards and a board end face of the other printed board. 2. The board mounting apparatus according to claim 1, wherein the two printed boards have the same specification. The board mounting apparatus according to claim 1, wherein electronic components are mounted on both sides of the two printed boards. The substrate mounting apparatus according to claim 1, wherein the wedge has a glasses shape, and an outer periphery of both end portions thereof has a polygonal shape. The board mounting apparatus according to claim 4, wherein the wedge has through holes at both ends. 6. The substrate mounting apparatus according to claim 5, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. The board mounting apparatus according to claim 1, further comprising a notch for fitting the wedge to at least one side of the printed board. A board mounting apparatus for mounting electronic components on a double-sided printed board,
A board mounting apparatus, wherein a board end face of one printed board of two double-sided printed boards and a board end face of the other printed board are coupled so that different planes face each other. A connection means for connecting a substrate end surface of one printed circuit board of the two double-sided printed circuit boards and a substrate end surface of the other printed circuit board so that different surfaces face up is provided. Item 9. The board mounting apparatus according to Item 8. 10. The board mounting apparatus according to claim 9, wherein the connecting means is a wedge. The board mounting apparatus according to claim 9, wherein the connecting means is a tape. 11. The substrate mounting apparatus according to claim 10, wherein the wedge has a glasses shape, and the outer periphery of both ends thereof has a polygonal shape. 13. The board mounting apparatus according to claim 12, wherein the wedge has through holes at both ends. 14. The board mounting apparatus according to claim 13, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. The board mounting apparatus according to claim 9, further comprising a notch for fitting the connecting means to at least one side of the printed board. The board mounting apparatus according to claim 15, wherein the notch has a keyhole shape. The board mounting device according to claim 15 or 16, wherein the notch is provided on a second board that can be separated from the printed board. The connecting means includes a convex portion provided at an upper portion or a lower portion of both ends of the printed circuit board, and a concave portion provided at a lower portion or an upper portion of the printed circuit board and capable of fitting with the convex portion of another printed circuit board. The board mounting apparatus according to claim 9. The board mounting apparatus according to claim 10, wherein both ends of the wedge form a triangle. 20. The board mounting apparatus according to claim 19, wherein the printed board includes a triangular notch for fitting the wedge to at least one of the board end faces. 15. The substrate mounting apparatus according to claim 10, wherein the wedge includes a cut portion for bending and cutting at a center thereof. The board mounting apparatus according to claim 21, wherein the wedge is made of a solderable material. 23. The board mounting apparatus according to claim 21, wherein the printed circuit board includes a notch for fitting the wedge on at least one side thereof, and a flange surrounding the notch. The board mounting apparatus according to claim 23, wherein the flange portion is made of a solderable material. The mounting of the electronic component is finished in advance on one side of one double-sided printed circuit board, and the double-sided printed circuit board is arranged so that the surface on which the electronic component is not mounted faces up. 25. The board mounting apparatus according to claim 8, wherein the board mounting apparatus is connected to the other double-sided printed board not mounted. A double-sided printed circuit board on which electronic components are mounted only on one side is arranged so that the surface on which no electronic component is mounted is up, and the double-sided printed circuit board is connected to a double-sided printed circuit board on which both sides are not mounted. The connecting means;
Mounting processing means for mounting and fixing the electronic component on the surface of the double-sided printed circuit board supplied in a state where the double-sided printed circuit board is connected, and releasing the connection between the two boards on which the electronic component is mounted and fixed, 26. A separator comprising: a double-sided printed board on which the electronic component is mounted only on one side; and a separating unit that separates the double-sided printed board on which the electronic component is mounted on both sides. The board | substrate mounting apparatus in any one. The mounting processing means recognizes a position of a predetermined pattern in the double-sided printed board, prints solder on a place to be soldered on the double-sided printed board based on the recognized position, and the electronic component on the printed part 27. The board mounting apparatus according to claim 26, wherein the electronic component is fixed to the double-sided printed board by heating the entire double-sided printed board to melt the solder. 28. The board mounting apparatus according to claim 9, wherein a thickness of the connecting means is smaller than a thickness of the double-sided printed board. 28. The board mounting apparatus according to claim 27, wherein a predetermined pattern for recognizing a position of the printed board is provided on at least one of the printed boards. The predetermined pattern is provided on the left and right of the upper end of one printed circuit board and on the right of the lower end, or on the left of the upper end of one printed circuit board and on the right of the upper and lower ends of the other printed circuit board,
Create an X axis with a line connecting a predetermined pattern on the left and right of the upper end of one printed circuit board or a line connecting a predetermined pattern on the left of the upper end of one printed circuit board and a predetermined pattern on the right of the upper end of the other printed circuit board, A Y axis is created by a line connecting the right predetermined patterns at the upper and lower ends of one printed circuit board or a line connecting the right predetermined patterns at the upper and lower ends of the other printed circuit board. 30. The board mounting apparatus according to claim 29, wherein a solder printing position and an electronic component mounting position inside both printed boards are obtained. A board mounting method for mounting electronic components on a printed circuit board,
A board mounting method comprising connecting a board end face of one of the two printed boards and a board end face of the other printed board with a wedge. 32. The board mounting method according to claim 31, wherein the two printed boards have the same specifications. The board mounting method according to claim 31 or 32, wherein electronic components are mounted on both sides of the two printed boards. The substrate mounting method according to any one of claims 31 to 33, wherein the wedge has a glasses shape, and an outer periphery of both end portions thereof has a polygonal shape. 35. The substrate mounting method according to claim 34, wherein the wedge has through holes at both ends. 36. The substrate mounting method according to claim 35, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. 37. The substrate mounting method according to claim 31, further comprising a notch for fitting the wedge into at least one side of the printed circuit board. A board mounting method for mounting electronic components on a double-sided printed circuit board,
A substrate mounting method comprising: connecting a substrate end surface of one printed circuit board of two double-sided printed circuit boards and a substrate end surface of the other printed circuit board so that different surfaces face each other. A connecting step of connecting a substrate end surface of one of the two double-sided printed circuit boards and a substrate end surface of the other printed circuit board with a connecting member so that different surfaces face each other; 40. The substrate mounting method according to claim 38. 40. The substrate mounting method according to claim 39, wherein the connecting member is a wedge. 40. The substrate mounting method according to claim 39, wherein the connecting member is a tape. 41. The substrate mounting method according to claim 40, wherein the wedge has a glasses shape, and outer peripheries of both ends thereof have a polygonal shape. 43. The substrate mounting method according to claim 42, wherein the wedge has through holes at both ends. 44. The substrate mounting method according to claim 43, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. 45. The substrate mounting method according to any one of claims 39, 40, and 42 to 44, comprising a notch for fitting the connecting member in the connecting step into at least one side of the printed circuit board. 46. The substrate mounting method according to claim 45, wherein the notch has a keyhole shape. 47. The substrate mounting method according to claim 45 or 46, wherein the notch is provided on a second substrate that can be separated from the printed circuit board. The connecting member in the connecting step includes a convex portion provided at the upper or lower end of both ends of the printed circuit board, and a concave portion provided at the lower or upper end of both ends of the printed circuit board and capable of fitting with the convex portion of another printed circuit board. 40. The substrate mounting method according to claim 39, further comprising: 41. The substrate mounting method according to claim 40, wherein both ends of the wedge form a triangle. 50. The substrate mounting method according to claim 49, wherein the printed board includes a triangular notch for fitting the wedge to at least one of the substrate end faces. 45. The substrate mounting method according to any one of claims 40 and 42 to 44, wherein the wedge includes a cut portion for bending and cutting at a center thereof. 52. The substrate mounting method according to claim 51, wherein the wedge is made of a solderable material. 53. The substrate mounting method according to claim 51 or 52, wherein the printed board includes a notch for fitting the wedge on at least one side thereof, and a flange surrounding the notch. 54. The substrate mounting method according to claim 53, wherein the flange portion is made of a solderable material. The mounting of the electronic component is finished in advance on one side of one double-sided printed circuit board, and the double-sided printed circuit board is arranged so that the surface on which the electronic component is not mounted faces up. 55. The board mounting method according to any one of claims 38 to 40 and 42 to 54, wherein the board is connected to the other double-sided printed board not mounted. A double-sided printed circuit board on which electronic components are mounted only on one side is arranged so that the surface on which no electronic component is mounted is up, and the double-sided printed circuit board is connected to a double-sided printed circuit board on which both sides are not mounted. The connecting step;
A mounting process step of mounting and fixing the electronic component on the surface of the double-sided printed board supplied in a state where the double-sided printed board is connected, and releasing the connection between the two boards on which the electronic component is mounted and fixed, The separation step of separating into a double-sided printed board on which the electronic component is mounted only on one side and a double-sided printed board on which the electronic component is mounted on both sides is included. The board mounting method according to any one of the above. The mounting processing step recognizes a position of a predetermined pattern in the double-sided printed circuit board, prints solder on a place to be soldered on the double-sided printed circuit board based on the recognized position, and the electronic component on the printed part 57. The substrate mounting method according to claim 56, wherein the electronic component is fixed to the double-sided printed circuit board by heating the entire double-sided printed circuit board to melt the solder. 58. The substrate mounting method according to claim 39, wherein a thickness of the connecting member is thinner than a thickness of the double-sided printed circuit board. 58. The substrate mounting method according to claim 57, wherein a predetermined pattern for recognizing a position of the printed circuit board is provided on at least one of the printed circuit boards. The predetermined pattern is provided on the left and right of the upper end of one printed circuit board and on the right of the lower end, or on the left of the upper end of one printed circuit board and on the right of the upper and lower ends of the other printed circuit board,
Create an X axis with a line connecting a predetermined pattern on the left and right of the upper end of one printed circuit board or a line connecting a predetermined pattern on the left of the upper end of one printed circuit board and a predetermined pattern on the right of the upper end of the other printed circuit board, A Y axis is created by a line connecting the right predetermined patterns at the upper and lower ends of one printed circuit board or a line connecting the right predetermined patterns at the upper and lower ends of the other printed circuit board. 60. The board mounting method according to claim 59, wherein a solder printing position and an electronic component mounting position inside both printed boards are obtained. A board connecting member used in a board mounting apparatus for mounting electronic components on a printed board,
A board connecting member comprising a wedge connecting the board end face of one of the two printed boards and the board end face of the other printed board. 62. The board connecting member according to claim 61, wherein the two printed boards have the same specifications. 63. The board connecting member according to claim 61, wherein electronic components are mounted on both sides of the two printed boards. The board connecting member according to any one of claims 61 to 63, wherein the wedge has a shape of glasses, and an outer periphery of both ends thereof has a polygonal shape. The board connecting member according to claim 64, wherein the wedge has through holes at both ends. 66. The board connecting member according to claim 65, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. A board connecting member used in a board mounting apparatus for mounting electronic components on a double-sided printed board,
A board connecting member for connecting a board end face of one printed board of two double-sided printed boards and a board end face of the other printed board so that different planes face each other. 68. The board connecting member according to claim 67, wherein the board connecting member is a wedge. 68. The board connecting member according to claim 67, wherein the board connecting member is a tape. The board connecting member according to claim 68, wherein the wedge has a glasses shape, and outer circumferences of both end portions thereof have a polygonal shape. The board connecting member according to claim 68 or 70, wherein the wedge has through holes at both ends. 72. The board connecting member according to claim 71, wherein the diameters of the two through holes and the positions of the two polygonal protrusions are different from each other. The board connecting member includes a convex part provided at the upper part or the lower part of both ends of the printed circuit board, and a concave part provided at the lower part or the upper part of the printed circuit board and capable of fitting with the convex part of another printed circuit board. 68. The board connecting member according to claim 67, wherein: The board connecting member according to claim 68, wherein both ends of the wedge form a triangle. The board connecting member according to any one of claims 68 and 70 to 72, wherein the wedge includes a cut portion for bending and cutting at a center thereof. The board connecting member according to claim 75, wherein the wedge is made of a solderable material. 77. The board connecting member according to claim 67, wherein a thickness of the board connecting member is thinner than a thickness of the double-sided printed board. A printed circuit board used in a substrate mounting apparatus for mounting electronic components on a printed circuit board,
A printed circuit board characterized in that a substrate end surface of one of the two printed circuit boards and a substrate end surface of the other printed circuit board are connected by a wedge. The printed circuit board according to claim 78, wherein the two printed circuit boards have the same specification. The printed circuit board according to claim 78 or 79, wherein electronic components are mounted on both sides of the two printed circuit boards. The printed circuit board according to any one of claims 78 to 80, further comprising a notch for fitting the wedge into at least one side of the printed circuit board. A printed circuit board used in a substrate mounting apparatus for mounting electronic components on a double-sided printed circuit board,
A printed circuit board comprising a substrate end face of one of the two double-sided printed boards and a substrate end face of the other printed circuit board so that different faces are on top. A connection means for connecting a substrate end surface of one printed circuit board of the two double-sided printed circuit boards and a substrate end surface of the other printed circuit board so that different surfaces face up is provided. Item 83. The printed circuit board according to Item 82. 84. A printed circuit board according to claim 83, wherein said connecting means is constituted by a wedge. 85. The printed circuit board according to claim 84, wherein the two double-sided printed circuit boards are connected by the wedges and include a notch for fitting the wedges on at least one side of each printed circuit board. The convex part provided in the upper part or the lower part of both ends of the printed circuit board, and the concave part provided in the lower part or upper part of the printed circuit board and capable of fitting with the convex part of another printed circuit board. Item 84. The printed circuit board according to Item 83. The printed board according to claim 84 or 85, wherein a thickness of the wedge is thinner than a thickness of the double-sided printed board. 88. The printed circuit board according to claim 82, wherein a predetermined pattern for recognizing a position of the printed circuit board is provided on at least one of the printed circuit boards. The predetermined pattern is provided on the left and right of the upper end of one printed circuit board and on the right of the lower end, or on the left of the upper end of one printed circuit board and on the right of the upper and lower ends of the other printed circuit board,
Create an X axis with a line connecting a predetermined pattern on the left and right of the upper end of one printed circuit board or a line connecting a predetermined pattern on the left of the upper end of one printed circuit board and a predetermined pattern on the right of the upper end of the other printed circuit board, A Y axis is created by a line connecting the right predetermined patterns at the upper and lower ends of one printed circuit board or a line connecting the right predetermined patterns at the upper and lower ends of the other printed circuit board. The printed circuit board according to claim 88, wherein a solder printing position and an electronic component mounting position in both printed circuit boards are obtained. A board connecting member mounting jig used in a board mounting apparatus for mounting electronic components on a printed board,
Including a board positioning means for positioning two printed boards and a connecting member positioning means for positioning a connecting member for connecting both printed boards, and after positioning the printed board by the board positioning means, A board connecting member mounting jig, wherein a connecting member is fitted into a position set by a connecting member positioning means to connect the printed circuit board. A board connecting member removal jig used in a board mounting apparatus for mounting electronic components on a printed board,
A board connecting member detaching jig comprising pressing means for pressing a connecting member for connecting two printed boards to remove them from the printed board.

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