JPH042070U - - Google Patents
Info
- Publication number
- JPH042070U JPH042070U JP4357290U JP4357290U JPH042070U JP H042070 U JPH042070 U JP H042070U JP 4357290 U JP4357290 U JP 4357290U JP 4357290 U JP4357290 U JP 4357290U JP H042070 U JPH042070 U JP H042070U
- Authority
- JP
- Japan
- Prior art keywords
- pads
- printed wiring
- wiring board
- view
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例によるプリント配
線板を示す平面図、第２図はこの考案の他の実施
例を示す平面図、第３図〜第８図は従来のこの種
プリント配線板を示す図で、第３図は平面図、第
４図は第３図の部拡大斜視図、第５図は表面実
装部品を実装した状態を示す平面図、第６図は第
５図の部拡大斜視図、第７図は第５図の部分拡
大断面図、第８図は要部の拡大平面図である。
図中、１はプリント配線板、２１，２２はパツ
ド、３は表面実装部品、４，８，８１は導電パタ
ーン、５は半田、６は第１のソルダレジスト層、
７は第２のソルダレジスト層、９はシンボルマー
クである。なお、図中同一符号は同一又は相当部
分を示す。
Fig. 1 is a plan view showing a printed wiring board according to one embodiment of this invention, Fig. 2 is a plan view showing another embodiment of this invention, and Figs. 3 to 8 are conventional printed wiring boards of this kind. 3 is a plan view, FIG. 4 is an enlarged perspective view of the portion shown in FIG. 3, FIG. 5 is a plan view showing the state in which surface mount components are mounted, and FIG. FIG. 7 is an enlarged partial sectional view of FIG. 5, and FIG. 8 is an enlarged plan view of the main part. In the figure, 1 is a printed wiring board, 21 and 22 are pads, 3 is a surface mount component, 4, 8, and 81 are conductive patterns, 5 is solder, 6 is a first solder resist layer,
7 is a second solder resist layer, and 9 is a symbol mark. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
のリードが半田付けされる複数のパツド、これら
のパツドの半田付部以外に結合され、パツド相互
間を接続する導電パターンを備えたプリント配線
板。 A printed wiring board that is provided on a printed wiring board body and includes a plurality of pads to which leads of surface mount components are soldered, and a conductive pattern that is connected to a portion other than the soldered portions of these pads and connects the pads to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4357290U JPH042070U (en) | 1990-04-23 | 1990-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4357290U JPH042070U (en) | 1990-04-23 | 1990-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042070U true JPH042070U (en) | 1992-01-09 |
Family
ID=31556095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4357290U Pending JPH042070U (en) | 1990-04-23 | 1990-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042070U (en) |
-
1990
- 1990-04-23 JP JP4357290U patent/JPH042070U/ja active Pending