JPS6418775U - - Google Patents
Info
- Publication number
- JPS6418775U JPS6418775U JP11323287U JP11323287U JPS6418775U JP S6418775 U JPS6418775 U JP S6418775U JP 11323287 U JP11323287 U JP 11323287U JP 11323287 U JP11323287 U JP 11323287U JP S6418775 U JPS6418775 U JP S6418775U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- surface mount
- mount components
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す平面図、第
２図は従来の印刷配線基板の構成を示す平面図、
第３図はその斜視図。
１は印刷配線基板本体、２はパツド、３はスル
ーホール、４は配線パターン、５は定型パターン
。なお各図中同一符号は同一又は相当部分を示す
ものとする。
FIG. 1 is a plan view showing an embodiment of this invention, FIG. 2 is a plan view showing the configuration of a conventional printed wiring board,
FIG. 3 is a perspective view thereof. 1 is the printed wiring board body, 2 is a pad, 3 is a through hole, 4 is a wiring pattern, and 5 is a standard pattern. Note that the same reference numerals in each figure indicate the same or equivalent parts.
Claims (1)
体上に設けられた複数の面実装部品搭載用パツド
とを有し、この複数の面実装部品搭載用パツドに
面実装部品の接続ピンを固定して各種配線を用い
て電子回路を構成する印刷配線基板において、 複数の各面実装部品用パツドと一対一で上記印
刷配線基板本体上に設けられた複数の各スルーホ
ールと、この各スルーホールと上記各面実装部品
用パツドとをそれぞれ電気的に接続する配線パタ
ーンとを有し、 新たに配線を追加して接続する場合には、この
追加する配線を上記スルーホールに接続すること
を特徴とする印刷配線基板。 (2) 複数の各スルーホールをＩＣソケツトの接
続ピンが挿入できる形態に上記印刷配線基板本体
上に配置することを特徴とする実用新案登録請求
の範囲第１項記載の印刷配線基板。[Scope of Claim for Utility Model Registration] (1) A printed wiring board body and a plurality of pads for mounting surface mount components provided on the body of the printed wiring board; In a printed wiring board that fixes connection pins for surface mount components and configures an electronic circuit using various types of wiring, a plurality of pads for surface mount components are provided one-on-one on the printed wiring board body. It has a through hole and a wiring pattern that electrically connects each through hole and each surface mount component pad described above, and when adding and connecting new wiring, the added wiring is connected to the above-mentioned pad. A printed wiring board characterized by connection to through holes. (2) The printed wiring board according to claim 1, wherein a plurality of through holes are arranged on the printed wiring board main body in a form into which connecting pins of an IC socket can be inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11323287U JPS6418775U (en) | 1987-07-23 | 1987-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11323287U JPS6418775U (en) | 1987-07-23 | 1987-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418775U true JPS6418775U (en) | 1989-01-30 |
Family
ID=31352884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11323287U Pending JPS6418775U (en) | 1987-07-23 | 1987-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009033481A (en) * | 2007-07-27 | 2009-02-12 | Sony Corp | Camera module |
-
1987
- 1987-07-23 JP JP11323287U patent/JPS6418775U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009033481A (en) * | 2007-07-27 | 2009-02-12 | Sony Corp | Camera module |
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