JPS63136374U - - Google Patents

Info

Publication number
JPS63136374U
JPS63136374U JP2827487U JP2827487U JPS63136374U JP S63136374 U JPS63136374 U JP S63136374U JP 2827487 U JP2827487 U JP 2827487U JP 2827487 U JP2827487 U JP 2827487U JP S63136374 U JPS63136374 U JP S63136374U
Authority
JP
Japan
Prior art keywords
wiring pattern
circuit board
printed circuit
flexible
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2827487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2827487U priority Critical patent/JPS63136374U/ja
Publication of JPS63136374U publication Critical patent/JPS63136374U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のフレキシブルプリント基板の
一実施例の端部の平面図、第2図及び第3図は第
1図示のプリント基板の使用状態を説明するため
の図、第4図及び第5図は従来のプリント基板の
使用状態を説明するための図である。 10,13……ハードプリント基板、11,1
2,14,15……電子部品、30……フレキシ
ブルプリント基板、31……配線パターン、32
,35……ランド、33……貫通孔、36……半
田。
FIG. 1 is a plan view of the end of an embodiment of the flexible printed circuit board of the present invention, FIGS. 2 and 3 are diagrams for explaining how the printed circuit board shown in FIG. 1 is used, and FIGS. FIG. 5 is a diagram for explaining the usage state of a conventional printed circuit board. 10,13...Hard printed circuit board, 11,1
2, 14, 15...Electronic component, 30...Flexible printed circuit board, 31...Wiring pattern, 32
, 35...Land, 33...Through hole, 36...Solder.

Claims (1)

【実用新案登録請求の範囲】 可撓性のベースフイルム上に配線パターンを形
成したフレキシブルプリント基板において、 該配線パターンに設けられた接続用ランド内に
、半田が流通する貫通孔を設けてなるフレキシブ
ルプリント基板。
[Scope of Claim for Utility Model Registration] A flexible printed circuit board in which a wiring pattern is formed on a flexible base film, in which a through hole through which solder flows is provided in a connecting land provided in the wiring pattern. Printed board.
JP2827487U 1987-02-27 1987-02-27 Pending JPS63136374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2827487U JPS63136374U (en) 1987-02-27 1987-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2827487U JPS63136374U (en) 1987-02-27 1987-02-27

Publications (1)

Publication Number Publication Date
JPS63136374U true JPS63136374U (en) 1988-09-07

Family

ID=30831084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2827487U Pending JPS63136374U (en) 1987-02-27 1987-02-27

Country Status (1)

Country Link
JP (1) JPS63136374U (en)

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